Philips php69n03t DATASHEETS

Philips Semiconductors Product specification
TrenchMOS transistor PHP69N03T Standard level FET

GENERAL DESCRIPTION QUICK REFERENCE DATA

N-channel enhancement mode SYMBOL PARAMETER MAX. UNIT standard level field-effect power transistor in a plastic envelope using V ’trench’ technology. The device I featuresverylowon-state resistance P and has integral zener diodes giving T ESD protection up to 2kV. It is R
DS
D
tot j
DS(ON)
intended for use in DC-DC resistance VGS = 10 V converters and general purpose switching applications.

PINNING - TO220AB PIN CONFIGURATION SYMBOL

PIN DESCRIPTION
tab
d
1 gate 2 drain 3 source
tab drain
123
g
s

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
DS
V
DGR
Drain-source voltage - - 30 V
Drain-gate voltage RGS = 20 kΩ -30V ±VGSGate-source voltage - - 20 V I
D
I
D
I
DM
P
tot
T
, T
stg
j
Drain current (DC) Tmb = 25 ˚C - 69 A
Drain current (DC) Tmb = 100 ˚C - 48 A
Drain current (pulse peak value) Tmb = 25 ˚C - 240 A
Total power dissipation Tmb = 25 ˚C - 125 W
Storage & operating temperature - - 55 175 ˚C

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
th j-mb
Thermal resistance junction to - - 1.2 K/W
mounting base R
th j-a
Thermal resistance junction to in free air 60 - K/W
ambient

ESD LIMITING VALUE

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
C
September 1997 1 Rev 1.100
Electrostatic discharge capacitor Human body model - 2 kV
voltage, all pins (100 pF, 1.5 k)
Philips Semiconductors Product specification
TrenchMOS transistor PHP69N03T
Standard level FET

STATIC CHARACTERISTICS

Tj= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
V
GS(TO)
I
DSS
I
GSS
±V R
DS(ON)
(BR)GSS
Drain-source breakdown VGS = 0 V; ID = 0.25 mA; 30 - - V voltage Tj = -55˚C 27 - - V Gate threshold voltage VDS = VGS; ID = 1 mA 2.0 3.0 4.0 V
Tj = 175˚C 1.0 - - V
Tj = -55˚C - - 4.4 V
Zero gate voltage drain current VDS = 30 V; VGS = 0 V; - 0.05 10 µA
Tj = 175˚C - - 500 µA
Gate source leakage current VGS = ±10 V; VDS = 0 V - 0.02 1 µA
Tj = 175˚C - - 20 µA Gate-source breakdown IG = ±1 mA; 16 - - V voltage Drain-source on-state VGS = 10 V; ID = 25 A - 12 14 m resistance Tj = 175˚C - - 26 m

DYNAMIC CHARACTERISTICS

Tmb = 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
g
fs
Q
g(tot)
Q
gs
Q
gd
C
iss
C
oss
C
rss
t
d on
t
r
t
d off
t
f
L
d
L
d
L
s
Forward transconductance VDS = 25 V; ID = 25 A 9 18 - S Total gate charge ID = 69 A; V
= 24 V; VGS = 10 V - 38 - nC
DD
Gate-source charge - 7 - nC Gate-drain (Miller) charge - 21 - nC
Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 1500 2000 pF Output capacitance - 480 550 pF Feedback capacitance - 220 300 pF
Turn-on delay time VDD = 25 V; ID = 25 A; - 22 35 ns Turn-on rise time VGS = 10 V; RG = 5 - 3060ns Turn-off delay time Resistive load - 40 50 ns Turn-off fall time - 25 38 ns
Internal drain inductance Measured from contact screw on - 3.5 - nH
tab to centre of die
Internal drain inductance Measured from drain lead 6 mm - 4.5 - nH
from package to centre of die
Internal source inductance Measured from source lead 6 mm - 7.5 - nH
from package to source bond pad
September 1997 2 Rev 1.100
Philips Semiconductors Product specification
TrenchMOS transistor PHP69N03T
Standard level FET

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS

Tj = 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
DR
I
DRM
V
SD
t
rr
Q
rr

AVALANCHE LIMITING VALUE

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
W
DSS
Continuous reverse drain - - 69 A current Pulsed reverse drain current - - 240 A Diode forward voltage IF = 25 A; VGS = 0 V - 0.95 1.2 V
IF = 69 A; VGS = 0 V - 1.0 - V
Reverse recovery time IF = 69 A; -dIF/dt = 100 A/µs; - 60 - ns Reverse recovery charge VGS = -10 V; VR = 25 V - 0.1 - µC
Drain-source non-repetitive ID = 36 A; VDD 15 V; - - 125 mJ unclamped inductive turn-off VGS = 10 V; RGS = 50 ; Tmb = 25 ˚C energy
September 1997 3 Rev 1.100
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