Philips PHP225 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
PHP225
Dual P-channel enhancement mode MOS transistor
Product specification Supersedes data of November 1994 File under Discrete Semiconductors, SC13b
1997 Jun 20
Philips Semiconductors Product specification
Dual P-channel enhancement mode MOS transistor
FEATURES
High-speed switching
No secondary breakdown
Very low on-resistance.
APPLICATIONS
Motor and actuator driver
Power management
Synchronized rectification.
DESCRIPTION
Two P-channel enhancement mode MOS transistors in an 8-pin plastic SOT96-1 (SO8) package.
CAUTION
The device is supplied in an antistatic package. The gate-source input must be protected against static discharge during transport or handling.
PINNING - SOT96-1 (SO8)
PIN SYMBOL DESCRIPTION
1s 2g 3s 4g 5d 6d 7d 8d
handbook, halfpage
58
1
4
MAM119
1 1 2 2 2 2 1 1
source 1 gate 1 source 2 gate 2 drain 2 drain 2 drain 1 drain 1
d
d
1
1
gs
1
PHP225
d
2
2
1
d
2
gs
2
Fig.1 Simplified outline and symbol.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per P-channel
V V V V I
D
R P
DS SD GSO GSth
DSon tot
drain-source voltage (DC) −−30 V source-drain diode forward voltage IS= 1.25 A −−1.6 V gate-source voltage (DC) open drain −±20 V gate-source threshold voltage ID= 1 mA; VDS=V
1 2.8 V
GS
drain current (DC) −−2.3 A drain-source on-state resistance ID= 1 A; VGS= −10 V 0.25 total power dissipation Ts=80°C 2W
1997 Jun 20 2
Philips Semiconductors Product specification
Dual P-channel enhancement
PHP225
mode MOS transistor
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per P-channel
V
DS
V
GSO
I
D
I
DM
P
tot
T
stg
T
j
Source-drain diode
I
S
I
SM
drain-source voltage (DC) −−30 V gate-source voltage (DC) open drain −±20 V drain current (DC) Ts≤ 80 °C −−2.3 A peak drain current note 1 −−10 A total power dissipation Ts=80°C; note 2 2W
T
=25°C; note 3 2W
amb
T
=25°C; note 4 1W
amb
=25°C; note 5 1.3 W
T
amb
storage temperature 65 +150 °C operating junction temperature 150 °C
source current (DC) Ts≤ 80 °C −−1.25 A peak pulsed source current note 1 −−5A
Notes
1. Pulse width and duty cycle limited by maximum junction temperature.
2. Maximum permissible dissipation per MOS transistor. Both devices may be loaded up to 2 W at the same time.
3. Maximum permissible dissipation per MOS transistor. Device mounted on printed-circuit board with an R
th a-tp
(ambient to tie-point) of 27.5 K/W.
4. Maximum permissible dissipation per MOS transistor. Device mounted on printed-circuit board with an R
th a-tp
(ambient to tie-point) of 90 K/W.
5. Maximum permissible dissipation if only one MOS transistor dissipates. Device mounted on printed-circuit board with an R
(ambient to tie-point) of 90 K/W.
th a-tp
1997 Jun 20 3
Philips Semiconductors Product specification
Dual P-channel enhancement mode MOS transistor
2.5
handbook, halfpage
P
tot
(W)
2.0
1.5
1.0
0.5
0
0 200
50 100 150
T ( C)
s
MLB836
o
2
10
handbook, halfpage
I
D
(A)
10
1
1
10
2
10
1
10
δ =0.01. Ts=80°C. (1) R
DSon
limitation.
PHP225
MBE155
(1)
t
P
t
p
T
p
=
δ
T
DC
t
11010
tp =
10 µs
1 ms
0.1 s
V
(V)
DS
2
Fig.2 Power derating curve.
Fig.3 SOAR.
1997 Jun 20 4
Philips Semiconductors Product specification
Dual P-channel enhancement
PHP225
mode MOS transistor
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
R
th j-s
CHARACTERISTICS
=25°C unless otherwise specified.
T
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Per P-channel
V
(BR)DSS
V
GSth
I
DSS
I
GSS
I
Don
R
DSon
y
forward transfer admittance VDS= −20 V; ID= −1A 1 2 S
fs
C
iss
C
oss
C
rss
Q
G
Q
GS
Q
GD
thermal resistance from junction to soldering point 35 K/W
drain-source breakdown voltage VGS= 0; ID= 10 µA 30 −−V gate-source threshold voltage VGS=VDS; ID= 1mA −1 −−2.8 V drain-source leakage current VGS= 0; VDS= −24 V −−−100 nA gate leakage current VGS= ±20 V; VDS=0 −−±100 nA on-state drain current VGS= 10 V; VDS= −1V −2.3 −−A
V
= 4.5 V; VDS= −5V −1 −−A
GS
drain-source on-state resistance VGS= 4.5 V; ID= 0.5 A 0.33 0.4
V
= 10 V; ID= 1A 0.22 0.25
GS
input capacitance VGS= 0; VDS= −20 V; f = 1 MHz 250 pF output capacitance VGS= 0; VDS= −20 V; f = 1 MHz 140 pF reverse transfer capacitance VGS= 0; VDS= −20 V; f = 1 MHz 50 pF total gate charge VGS= 10 V; VDS= −15 V;
10 25 nC
ID= 2.3 A
gate-source charge VGS= 10 V; VDS= −15 V;
1 nC
ID= 2.3 A
gate-drain charge VGS= 10 V; VDS= −15 V;
3 nC
ID= 2.3 A
Switching times
t
on
turn-on time VGD=0to−10 V; VDD= −20 V;
ID= 1 A; RL=20
t
off
turn-off time VGS= 10 to 0 V; VDD= −20 V;
ID= 1 A; RL=20
Source-drain diode
V
DS
source drain diode forward
VGD= 0; IS= 1.25 A −−−1.6 V
voltage
t
rr
reverse recovery time IS= 1.25 A; di/dt = 100 A/µs 150 200 ns
1997 Jun 20 5
20 80 ns
50 140 ns
Philips Semiconductors Product specification
,g
Dual P-channel enhancement mode MOS transistor
C
iss
C
oss
C
rss
V (V)
DS
MBE144
600
handbook, halfpage
C
(pF)
400
200
0
0
VGS=0. Tj=25°C.
10 20 30
Fig.4 Capacitance as a function of drain-source
voltage; typical values.
10
V =
GS
I
D
10 V
(A)
8
6
4
2
0
0 2 10 12
Tj=25°C.
7.5 V
468
V (V)
DS
Fig.5 Output characteristics; typical values.
PHP225
MBE154
6 V
5 V
4.5 V
4 V
3.5 V
3 V
2.5 V
handbook, halfpage
10
I
D
(A)
8
6
4
2
0
024 8
VDS= 10 V. Tj=25°C.
6
V (V)
GS
Fig.6 Transfer characteristic; typical values.
MBE157
10
handbook, halfpage
V
GS
(V)
8
6
4
2
0
024 108
VDD= 15 V. ID= 2.3 A.
6
MBE145
Q (nC)
g
Fig.7 Gate-source voltage as a function of total
gate charge.
1997 Jun 20 6
Philips Semiconductors Product specification
Dual P-channel enhancement mode MOS transistor
handbook, halfpage
6
I
S
(A)
4
2
0
0 0.5 1 21.5
VGD=0. (1) Tj= 150 °C. (2) Tj=25°C. (3) Tj= 55 °C.
(1) (2) (3)
V (V)
MBE156
SD
4
10
handbook, halfpage
R
DSon
(m)
3
10
2
10
VDS≥−IR = 0.1 A.
(1) I
D
(2) ID= 0.5 A. (3) ID= 1A.
(1) (4) (5)(2)(3)
2 4 6 8
; Tj=25°C.
DSon
(4) ID= 2.3 A. (5) ID= 4.5 A.
PHP225
MDA165
100
VGS (V)
Fig.8 Source current as a function of source-drain
diode forward voltage.
.
MBE138
o
T ( C)
j
1.2
handbook, halfpage
k
1.1
1.0
0.9
0.8
0.7
0.6
V
GSth
k
=
-------------------------------------­V
GSth
Typical V
GSth
0 50 100 15050
at T
j
at 25°C
at ID= 1 mA; VDS=VGS=V
GSth
Fig.9 Drain-source on-state resistance as a
function of gate-source voltage; typical values.
1.8
handbook, halfpage
k
1.6
1.4
1.2
1.0
0.8
0.6
R
DSon
k
=
----------------------------------------­R
DSon
Typical R
DSon
(1) ID= 1 A; VGS= 10 V. (2) ID= 0.5 A; VGS= 4.5 V.
at T
at 25 °C
at:
0 50 100 15050
j
T ( C)
MBE146
j
(1)
(2)
o
Fig.10 Temperature coefficient of gate-source
threshold voltage.
1997 Jun 20 7
Fig.11 Temperature coefficient of drain-source
on-resistance.
Philips Semiconductors Product specification
Dual P-channel enhancement mode MOS transistor
2
10
R
th j-s
(K/W)
10
10
1
1
6
10
δ =
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
5
10
10
PHP225
MBE153
t
tp(s)
p
=
δ
T
t
1
P
t
p
T
4
3
10
2
10
1
10
Fig.12 Transient thermal resistance from junction to soldering point as a function of pulse time; typical values.
1997 Jun 20 8
Philips Semiconductors Product specification
Dual P-channel enhancement mode MOS transistor
PACKAGE OUTLINE
SO8: plastic small outline package; 8 leads; body width 3.9 mm
D
c
y
Z
8
5
PHP225
SOT96-1
E
H
E
A
X
v M
A
A
pin 1 index
1
e
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
1.75
0.069
A
1
0.25
0.10
0.010
0.004
A2A
1.45
1.25
0.057
0.049
0.25
0.01
b
3
p
0.49
0.25
0.36
0.19
0.019
0.0100
0.014
0.0075
4
w M
b
p
0 2.5 5 mm
scale
(1)E(2)
cD
5.0
4.8
0.20
0.19
eHELLpQZywv θ
4.0
1.27
3.8
0.16
0.050
0.15
2
A
6.2
5.8
0.244
0.228
Q
3
A
θ
0.25 0.10.25
0.010.010.041 0.004
0.7
0.3
0.028
0.012
(1)
o
8
o
0
L
p
L
0.7
0.6
0.028
0.024
(A )
1
detail X
1.0
1.05
0.4
0.039
0.016
OUTLINE VERSION
SOT96-1
IEC JEDEC EIAJ
076E03S MS-012AA
REFERENCES
1997 Jun 20 9
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04 97-05-22
Philips Semiconductors Product specification
Dual P-channel enhancement
PHP225
mode MOS transistor
DEFINITIONS
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Jun 20 10
Philips Semiconductors Product specification
Dual P-channel enhancement mode MOS transistor
PHP225
NOTES
1997 Jun 20 11
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© Philips Electronics N.V. 1997 SCA54 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Printed in The Netherlands 137107/00/02/pp12 Date of release: 1997 Jun 20 Document order number: 9397 750 02523
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