Philips PHP10N40 Datasheet
Philips Semiconductors Product specification
PowerMOS transistor PHP10N40
GENERAL DESCRIPTION QUICK REFERENCE DATA
N-channel enhancement mode SYMBOL PARAMETER MAX. UNIT
field-effect power transistor in a
plastic envelope featuring high V
avalanche energy capability, stable I
blocking voltage, fast switching and P
high thermal cycling performance R
withlowthermalresistance.Intended
DS
D
tot
DS(ON)
for use in Switched Mode Power
Supplies (SMPS), motor control
circuits and general purpose
switching applications.
PINNING - TO220AB PIN CONFIGURATION SYMBOL
Drain-source voltage 400 V
Drain current (DC) 10.7 A
Total power dissipation 147 W
Drain-source on-state resistance 0.55 Ω
PIN DESCRIPTION
tab
d
1 gate
2 drain
3 source
tab drain
123
g
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
D
I
DM
P
D
∆PD/∆TmbLinear derating factor Tmb > 25 ˚C - 1.176 W/K
V
GS
E
AS
I
AS
Tj, T
Continuous drain current Tmb = 25 ˚C; VGS = 10 V - 10.7 A
Tmb = 100 ˚C; VGS = 10 V - 6.7 A
Pulsed drain current Tmb = 25 ˚C - 43 A
Total dissipation Tmb = 25 ˚C - 147 W
Gate-source voltage - ± 30 V
Single pulse avalanche VDD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω; - 520 mJ
energy VGS = 10 V
Peak avalanche current VDD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω; - 10 A
VGS = 10 V
Operating junction and - 55 150 ˚C
stg
storage temperature range
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
R
th j-a
March 1997 1 Rev 1.000
Thermal resistance junction to - - 0.85 K/W
mounting base
Thermal resistance junction to - 60 - K/W
ambient
Philips Semiconductors Product specification
PowerMOS transistor PHP10N40
ELECTRICAL CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
∆V
(BR)DSS
∆T
j
R
DS(ON)
V
GS(TO)
g
fs
I
DSS
I
GSS
Q
g(tot)
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
d
L
d
L
s
C
iss
C
oss
C
rss
Drain-source breakdown VGS = 0 V; ID = 0.25 mA 400 - - V
voltage
/ Drain-source breakdown VDS = VGS; ID = 0.25 mA - 0.4 - V/K
voltage temperature coefficient
Drain-source on resistance VGS = 10 V; ID = 6 A - 0.42 0.55 Ω
Gate threshold voltage VDS = VGS; ID = 0.25 mA 2.0 3.0 4.0 V
Forward transconductance VDS = 30 V; ID = 6 A 3.5 6.0 - S
Drain-source leakage current VDS = 400 V; VGS = 0 V - 1 25 µA
VDS = 320 V; VGS = 0 V; Tj = 125 ˚C - 30 250 µA
Gate-source leakage current VGS = ±30 V; VDS = 0 V - 10 200 nA
Total gate charge ID = 10 A; V
Gate-source charge - 7 9 nC
= 320 V; VGS = 10 V - 90 110 nC
DD
Gate-drain (Miller) charge - 49 60 nC
Turn-on delay time VDD = 200 V; ID = 10 A; - 13 - ns
Turn-on rise time RG = 9.1 Ω; RD = 20 Ω -65-ns
Turn-off delay time - 108 - ns
Turn-off fall time - 70 - ns
Internal drain inductance Measured from contact screw on - 3.5 - nH
tab to centre of die
Internal drain inductance Measured from drain lead 6 mm - 4.5 - nH
from package to centre of die
Internal source inductance Measured from source lead 6 mm - 7.5 - nH
from package to source bond pad
Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 1080 - pF
Output capacitance - 190 - pF
Feedback capacitance - 110 - pF
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
S
I
SM
V
SD
t
rr
Q
rr
Continuous source current Tmb = 25˚C - - 10.6 A
(body diode)
Pulsed source current (body Tmb = 25˚C - - 43 A
diode)
Diode forward voltage IS = 10 A; VGS = 0 V - - 1.2 V
Reverse recovery time IS = 10 A; VGS = 0 V; - 330 - ns
dI/dt = 100 A/µs
Reverse recovery charge - 4.8 - µC
March 1997 2 Rev 1.000
Philips Semiconductors Product specification
PowerMOS transistor PHP10N40
PD%
120
110
100
90
80
70
60
50
40
30
20
10
0
0 20 40 60 80 100 120 140
Normalised Power Derating
Tmb / C
Fig.1. Normalised power dissipation.
PD% = 100⋅PD/P
ID%
120
110
100
90
80
70
60
50
40
30
20
10
0
0 20 40 60 80 100 120 140
Tmb / C
= f(Tmb)
D 25 ˚C
Normalised Current Derating
Fig.2. Normalised continuous drain current.
ID% = 100⋅ID/I
= f(Tmb); conditions: VGS ≥ 10 V
D 25 ˚C
p
t
T
BUKx57-mv
p
t
D =
T
t
1
0.1
0.01
0.001
Zth j-mb / (K/W)
D =
0.5
0.2
0.1
0.05
0.02
0
1E-05 1E-03 1E-01 1E+01
t / s
P
D
Fig.4. Transient thermal impedance.
Z
= f(t); parameter D = tp/T
th j-mb
ID, Drain current (Amps)
40
Tj = 25 C
30
20
10
0
0 5 10 15 20 25 30
VDS, Drain-Source voltage (Volts)
PHP10N40
VGS = 4.5 V
Fig.5. Typical output characteristics
ID = f(VDS); parameter V
GS
10 V
7 V
6.5 V
6 V
5.5 V
5 V
.
ID / A
100
10
1
0.1
1 10 100 1000
RDS(ON) = VDS/ID
DC
VDS / V
BUK457-400B
tp = 10 us
100 us
1 ms
10 ms
100 ms
Fig.3. Safe operating area. Tmb = 25 ˚C
ID & IDM = f(VDS); IDM single pulse; parameter t
RDS(on), Drain-Source on resistance (Ohms)
1
4.5 V 6 V 6.5 V
5 V 5.5 V
0.8
0.6
0.4
0.2
0
0 5 10 15 20 25 30 35
ID, Drain current (Amps)
Fig.6. Typical on-state resistance
R
p
= f(ID); parameter V
DS(ON)
PHP10N40
VGS = 7 V
Tj = 25 C
.
GS
10 V
March 1997 3 Rev 1.000
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