DISCRETE SEMICONDUCTORS
DATA SH EET
PHN405
4 N-channel 60 mΩ FET array
enhancement mode MOS
transistors
Product specification
Supersedes data of 1997 Jun 19
File under Discrete Semiconductors, SC13
1998 Mar 17
Philips Semiconductors Product specification
4 N-channel 60 mΩ FET array
enhancement mode MOS transistors
FEATURES
• High-speed switching
• No secondary breakdown
• Very low on-state resistance
• Current monitoring.
APPLICATIONS
• Motor and actuator driver
• Power management
• Synchronized rectification.
DESCRIPTION
Four enhancement mode MOS transistors in a 16-pin
plastic SOT338-1 (SSOP16) package. Two transistors
feature current monitoring (sense FETs).
PINNING - SOT338-1 (SSOP16)
PIN SYMBOL DESCRIPTION
1 and 4 d
2s
3g
5 and 8 d
6s
7g
9g
10 s
11 and 15 d
12 m
13 g
14 s
16 m
1
1
1
2
2
2
3
3
3
3
4
4
4
drain 1
source 1
gate 1
drain 2
source 2
gate 2
gate 3
source 3
drain 3
current monitor 3
gate 4
source 4
current monitor 4
PHN405
CAUTION
The device is supplied in an antistatic package.
The gate-source input must be protected against static
discharge during transport or handling.
handbook, full pagewidth
16
1
9
8
d
3
g
4
m
4
g
1
s
4
d
1
s
1
g
3
m
3
s
3
d
2
g
2
MAM276
s
2
Fig.1 Simplified outline and symbol.
1998 Mar 17 2
Philips Semiconductors Product specification
4 N-channel 60 mΩ FET array
PHN405
enhancement mode MOS transistors
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
V
GS
V
GSth
I
D
R
DSon
P
tot
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per FET
V
DS
V
GS
I
D
I
DM
P
tot
T
stg
T
j
Current monitor
I
M
I
MM
Source-drain diode
I
S
I
SM
drain-source voltage (DC) − 30 V
gate-source voltage (DC) −±20 V
gate-source threshold voltage ID= 1 mA; VDS=V
GS
1 2.8 V
drain current (DC) Ts=80°C − 3.7 A
drain-source on-state resistance ID= 2 A; VGS=10V − 60 mΩ
total power dissipation Ts=80°C − 1.4 W
drain-source voltage (DC) − 30 V
gate-source voltage (DC) −±20 V
drain current (DC) Ts=80°C; note 1 − 3.7 A
peak drain current note 2 − 14.8 A
total power dissipation Ts=80°C; note 3 − 1.4 W
T
=80°C; note 4 − 1.25 W
s
T
=80°C; note 5 − 1.09 W
s
storage temperature −55 +150 °C
operating junction temperature −55 +150 °C
monitor current (DC) Ts=80°C − 50 mA
peak monitor current note 2 − 220 mA
source current (DC) Ts=80°C − 1.4 A
peak source current note 2 − 5.6 A
Notes
1. T
is the temperature at the soldering point of the drain lead.
s
2. Pulse width and duty cycle limited by maximum junction temperature.
3. When only one FET dissipates.
4. When either FETs 1 and 3 or 2 and 4 dissipate an equal amount of power.
5. When all four FETs dissipate an equal amount of power.
1998 Mar 17 3
Philips Semiconductors Product specification
4 N-channel 60 mΩ FET array
enhancement mode MOS transistors
150
MDA804
Ts (°C)
200
handbook, halfpage
2
P
tot
(W)
1.6
1.2
0.8
0.4
0
0 50 100
2
10
handbook, halfpage
I
D
(A)
10
1
1
10
2
10
1
10
PHN405
MDA805
(1)
t
P
t
p
T
p
=
δ
T
DC
t
1
10
V
DS
tp =
1 ms
10 ms
100 ms
1 s
(V)
2
10
δ =0.01; Ts=80°C.
(1) R
Fig.2 Power derating curve.
DSon
limitation.
Fig.3 SOAR.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Per FET
R
th j-s
thermal resistance from junction to soldering point note 1 50 K/W
note 2 56 K/W
note 3 64 K/W
Notes
1. When only one FET dissipates.
2. When either FETs 1 and 3 or 2 and 4 dissipate an equal amount of power.
3. When all four FETs dissipate an equal amount of power.
1998 Mar 17 4