Philips PHK4NQ10T Datasheet

Philips Semiconductors Product specification

N-channel TrenchMOSTM transistor PHK4NQ10T

FEATURES SYMBOL QUICK REFERENCE DATA

• Low on-state resistance

• Fast switching V

d

= 100 V

DS

• Low profile surface mount
package I

g

R

DS(ON)

s

= 4 A

D

≤ 70 mΩ (VGS = 10 V)

GENERAL DESCRIPTION PINNING SOT96-1 (SO8)

N-channel enhancement mode PIN DESCRIPTION
field-effect transistor in a plastic
envelope using ’trench’ 1-3 source
technology.

4 gate

Applications:-

• Motor and relay drivers 5-8 drain

• d.c. to d.c. converters

pin 1 index

1234

The PHK4NQ10Tis supplied in the
SOT96-1 (SO8) surface mounting
package.

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

5678

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DSS

V

DGR

Drain-source voltage Tj = 25 ˚C to 150˚C - 100 V
Drain-gate voltage Tj = 25 ˚C to 150˚C; - 100 V

RGS = 20 kΩ

V

GS

I

D

Gate-source voltage - ± 20 V
Drain current (tp ≤ 10 s) Ta = 25 ˚C - 4 A

Ta = 70 ˚C - 3 A

I

DM

P

tot

Drain current (pulse peak value) Ta = 25 ˚C - 16 A
Total power dissipation Ta = 25 ˚C, t ≤ 10 s - 2.5 W

Ta = 70 ˚C, t ≤ 10 s - 1.6 W

Tj, T

stg

Operating junction and storage - 65 150 ˚C
temperature

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT

R

th j-a

R

th j-a

Thermal resistance junction Surface mounted, FR4 board, t ≤ 10 sec - 50 K/W
to ambient
Thermal resistance junction Surface mounted, FR4 board 150 - K/W
to ambient

August 1999 1 Rev 1.000

Philips Semiconductors Product specification

N-channel TrenchMOSTM transistor PHK4NQ10T

ELECTRICAL CHARACTERISTICS

Tj= 25˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

(BR)DSS

V

GS(TO)

R

DS(ON)

I

GSS

I

DSS

Q

g(tot)

Q

gs

Q

gd

t

d on

t

r

t

d off

t

f

L

d

L

s

C

iss

C

oss

C

rss

Drain-source breakdown VGS = 0 V; ID = 10 µA; 100 - - V
voltage Tj = -55˚C 89 - - V
Gate threshold voltage VDS = VGS; ID = 1 mA 2 3 4 V

Tj = 150˚C 1.1 - - V

Tj = -55˚C - 6 V
Drain-source on-state VGS = 10 V; ID = 4 A - 65 70 mΩ
resistance Tj = 150˚C - - 168 mΩ
Gate source leakage current VGS = ±20 V; VDS = 0 V - 10 100 nA
Zero gate voltage drain VDS = 100 V; VGS = 0 V; - 0.05 10 µA
current Tj = 150˚C - 5 100 µA

Total gate charge ID = 4 A; V

= 80 V; VGS = 10 V - 22 - nC

DD

Gate-source charge - 4 - nC
Gate-drain (Miller) charge - 8 - nC

Turn-on delay time VDD = 50 V; RD = 12 Ω;-6-ns
Turn-on rise time VGS = 10 V; RG = 5.6 Ω -13-ns
Turn-off delay time Resistive load - 26 - ns
Turn-off fall time - 12 - ns

Internal drain inductance Measured from drain lead to centre of die - 1 - nH
Internal source inductance Measured from source lead to source - 3 - nH

bond pad

Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 880 - pF
Output capacitance - 137 - pF
Feedback capacitance - 84 - pF

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS

Tj = 25˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

S

I

SM

V

SD

t

rr

Q

rr

Continuous source current Ta = 25 ˚C, tp ≤ 10 s - - 2.3 A
(body diode)
Pulsed source current (body - - 15 A
diode)
Diode forward voltage IF = 4 A; VGS = 0 V - 0.82 1.2 V

Reverse recovery time IF = 4 A; -dIF/dt = 100 A/µs; - 60 - ns
Reverse recovery charge VGS = 0 V; VR = 25 V - 120 - nC

August 1999 2 Rev 1.000

Philips Semiconductors Product specification

N-channel TrenchMOSTM transistor PHK4NQ10T

Normalised Power Derating, PD (%)

100

90
80
70
60
50
40
30
20
10

0

0 25 50 75 100 125 150

Ambient temperature, Ta (C)

Fig.1. Normalised power dissipation.

PD% = 100⋅PD/P

Normalised Current Derating, ID (%)

100

90
80
70
60
50
40
30
20
10

0

0 25 50 75 100 125 150

Ambient temperature, Ta (C)

D 25 ˚C

= f(Ta)

Fig.2. Normalised continuous drain current.

ID% = 100⋅ID/I

= f(Ta); VGS ≥ 10 V

D 25 ˚C

Transient thermal impedance, Zth j-a (K/W)

100

D = 0.5

0.2

10

0.1

0.05

0.02

1

single pulse

0.1

0.01
1E-06 1E-05 1E-04 1E-03 1E-02 1E-01 1E+00 1E+01

Pulse width, tp (s)

P

D

tp

D = tp/T

T

Fig.4. Transient thermal impedance.

Z

= f(t); parameter D = tp/T

th j-a

Drain Current, ID (A)

10

VGS = 10V

9
8
7
6
5
4
3
2
1
0

8 V

6 V

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2

Drain-Source Voltage, VDS (V)

5.4 V

5.2 V

4.8 V

4.6 V

4.4 V

Tj = 25 C

Fig.5. Typical output characteristics, Tj = 25 ˚C

ID = f(VDS)

5 V

.

Peak Pulsed Drain Current, IDM (A)

100

RDS(on) = VDS/ ID

10

1

D.C.

0.1

0.01

0.1 1 10 100 1000
Drain-Source Voltage, VDS (V)

tp = 10 us
100 us

1 ms
10 ms

100 ms

Fig.3. Safe operating area

ID & IDM = f(VDS); IDM single pulse; parameter t

p

Drain-Source On Resistance, RDS(on) (Ohms)

0.2

0.18

0.16

0.14

0.12

0.1

0.08

0.06

0.04

0.02
0

012345678910

4.6 V

Drain Current, ID (A)

4.8 V

5 V

Tj = 25 C

8 V

5.2 V

5.4 V

VGS = 10V

Fig.6. Typical on-state resistance, Tj = 25 ˚C

R

= f(ID)

DS(ON)

6V

.

August 1999 3 Rev 1.000