Philips PHB11N50E, PHP11N50E, PHW11N50E Datasheet
Philips Semiconductors Preliminary specification
PowerMOS transistors PHP11N50E, PHB11N50E, PHW11N50E
Avalanche energy rated
FEATURES SYMBOL QUICK REFERENCE DATA
• Repetitive Avalanche Rated
• Fast switching V
d
= 500 V
DSS
• Stable off-state characteristics
• High thermal cycling performance I
• Low thermal resistance
g
s
= 10.4 A
D
R
DS(ON)
≤ 0.6 Ω
GENERAL DESCRIPTION
N-channel,enhancementmodefield-effect power transistor, intendedforusein off-line switched mode powersupplies,
T.V.andcomputer monitor powersupplies, d.c. to d.c.converters, motor controlcircuitsand general purpose switching
applications.
The PHP11N50E is supplied in the SOT78 (TO220AB) conventional leaded package.
The PHW11N50E is supplied in the SOT429 (TO247) conventional leaded package.
The PHB11N50E is supplied in the SOT404 surface mounting package.
PINNING SOT78 (TO220AB) SOT404 SOT429 (TO247)
PIN DESCRIPTION
1 gate
2 drain
1
tab
tab
3 source
2
tab drain
123
13
2
3
1
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DSS
V
DGR
V
GS
I
D
I
DM
P
D
Tj, T
Drain-source voltage Tj = 25 ˚C to 150˚C - 500 V
Drain-gate voltage Tj = 25 ˚C to 150˚C; RGS = 20 kΩ - 500 V
Gate-source voltage - ± 30 V
Continuous drain current Tmb = 25 ˚C; VGS = 10 V - 10.4 A
Tmb = 100 ˚C; VGS = 10 V - 6.6 A
Pulsed drain current Tmb = 25 ˚C - 42 A
Total dissipation Tmb = 25 ˚C - 156 W
Operating junction and - 55 150 ˚C
stg
storage temperature range
1 It is not possible to make connection to pin 2 of the SOT404 package.
January 1998 1 Rev 1.000
Philips Semiconductors Preliminary specification
PowerMOS transistors PHP11N50E, PHB11N50E, PHW11N50E
Avalanche energy rated
AVALANCHE ENERGY LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
E
AS
E
AR
IAS, I
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
R
th j-a
Non-repetitive avalanche Unclamped inductive load, ID = 10.4 A; - 676 mJ
energy VDD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω;
VGS = 10 V
Repetitive avalanche energy
Repetitive and non-repetitive - 10.4 A
AR
avalanche current
2
- 16.9 mJ
Thermal resistance junction - - 0.8 K/W
to mounting base
Thermal resistance junction SOT78 package, in free air - 60 - K/W
to ambient SOT429 package, in free air - 45 - K/W
SOT404 package, pcb mounted, minimum - 50 - K/W
footprint
ELECTRICAL CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
∆V
∆T
R
DS(ON)
V
GS(TO)
g
fs
I
DSS
I
GSS
Q
g(tot)
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
d
L
d
L
s
C
iss
C
oss
C
rss
(BR)DSS
j
Drain-source breakdown VGS = 0 V; ID = 0.25 mA 500 - - V
voltage
/ Drain-source breakdown VDS = VGS; ID = 0.25 mA - 0.1 - %/K
voltage temperature
coefficient
Drain-source on resistance VGS = 10 V; ID = 5.2 A - 0.5 0.6 Ω
Gate threshold voltage VDS = VGS; ID = 0.25 mA 2.0 3.0 4.0 V
Forward transconductance VDS = 30 V; ID = 5.2 A 4 7 - S
Drain-source leakage current VDS = 500 V; VGS = 0 V - 1 25 µA
VDS = 400 V; VGS = 0 V; Tj = 125 ˚C - 60 500 µA
Gate-source leakage current VGS = ±30 V; VDS = 0 V - 10 200 nA
Total gate charge ID = 10.4 A; V
Gate-source charge - 8 10 nC
= 400 V; VGS = 10 V - 120 150 nC
DD
Gate-drain (Miller) charge - 65 85 nC
Turn-on delay time VDD = 250 V; RD = 22 Ω; - 22 - ns
Turn-on rise time RG = 5.6 Ω -70-ns
Turn-off delay time - 145 - ns
Turn-off fall time - 84 - ns
Internal drain inductance Measured from tab to centre of die - 3.5 - nH
Internal drain inductance Measured from drain lead to centre of die - 4.5 - nH
(SOT78 and SOT429 packages only)
Internal source inductance Measured from source lead to source - 7.5 - nH
bond pad
Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 1400 - pF
Output capacitance - 220 - pF
Feedback capacitance - 125 - pF
2 pulse width and repetition rate limited by Tj max.
January 1998 2 Rev 1.000
Philips Semiconductors Preliminary specification
PowerMOS transistors PHP11N50E, PHB11N50E, PHW11N50E
Avalanche energy rated
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
S
I
SM
V
SD
t
rr
Q
rr
Continuous source current Tmb = 25˚C - - 10.4 A
(body diode)
Pulsed source current (body Tmb = 25˚C - - 42 A
diode)
Diode forward voltage IS = 10.4 A; VGS = 0 V - - 1.2 V
Reverse recovery time IS = 10.4 A; VGS = 0 V; dI/dt = 100 A/µs - 600 - ns
Reverse recovery charge - 9 - µC
January 1998 3 Rev 1.000
Loading...