Philips phb, 45nq10t DATASHEETS

Philips Semiconductors Product specification

N-channel TrenchMOS transistor PHB45NQ10T, PHP45NQ10T

PHW45NQ10T

FEATURES SYMBOL QUICK REFERENCE DATA

• ’Trench’ technology

• Very low on-state resistance V

d

= 100 V

DSS

• Fast switching

• Low thermal resistance I

g

s

R

DS(ON)

= 47 A

D

≤ 25 mΩ

GENERAL DESCRIPTION

N-channel enhancement mode field-effect power transistor in a plastic envelope using ’trench’ technology.
Applications:-

• d.c. to d.c. converters

• switched mode power supplies
The PHP45NQ10T is supplied in the SOT78 (TO220AB) conventional leaded package.

The PHB45NQ10T is supplied in the SOT404 (D2PAK) surface mounting package.
The PHW45NQ10T is supplied in the SOT429 (TO247) conventional leaded package.

PINNING SOT78 (TO220AB) SOT404 (D2PAK) SOT429 (TO247)

PIN DESCRIPTION

1 gate
2 drain

1

tab

tab

3 source

2

tab drain

123

13

2

3

1

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DSS

V

DGR

V

GS

I

D

I

DM

P

D

Tj, T

1 It is not possible to make connection to pin 2 of the SOT404 package.

Drain-source voltage Tj = 25 ˚C to 175˚C - 100 V
Drain-gate voltage Tj = 25 ˚C to 175˚C; RGS = 20 kΩ - 100 V
Gate-source voltage - ± 20 V
Continuous drain current Tmb = 25 ˚C; VGS = 10 V - 47 A

Tmb = 100 ˚C; VGS = 10 V - 33 A
Pulsed drain current Tmb = 25 ˚C - 188 A
Total power dissipation Tmb = 25 ˚C - 150 W
Operating junction and - 55 175 ˚C

stg

storage temperature

August 1999 1 Rev 1.000

Philips Semiconductors Product specification

N-channel TrenchMOS transistor PHB45NQ10T, PHP45NQ10T

PHW45NQ10T

AVALANCHE ENERGY LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

E

AS

I

AS

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

R

th j-mb

R

th j-a

Non-repetitive avalanche Unclamped inductive load, IAS = 40 A; - 260 mJ
energy tp = 100 µs; Tj prior to avalanche = 25˚C;

VDD ≤ 25 V; RGS = 50 Ω; VGS = 10 V; refer

to fig:15
Non-repetitive avalanche - 47 A
current

Thermal resistance junction - - 1 K/W
to mounting base
Thermal resistance junction SOT78 package, in free air - 60 - K/W
to ambient SOT429 package, in free air - 45 - K/W

SOT404 package, pcb mounted, minimum - 50 - K/W

footprint

ELECTRICAL CHARACTERISTICS

Tj= 25˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

(BR)DSS

V

GS(TO)

R

DS(ON)

I

GSS

I

DSS

Q

g(tot)

Q

gs

Q

gd

t

d on

t

r

t

d off

t

f

L

d

L

d

L

s

C

iss

C

oss

C

rss

Drain-source breakdown VGS = 0 V; ID = 0.25 mA; 100 - - V
voltage Tj = -55˚C 89 - - V
Gate threshold voltage VDS = VGS; ID = 1 mA 2 3 4 V

Tj = 175˚C 1 - - V

Tj = -55˚C - - 6 V
Drain-source on-state VGS = 10 V; ID = 25 A - 22 25 mΩ
resistance Tj = 175˚C - - 68 mΩ
Gate source leakage current VGS = ±10 V; VDS = 0 V - 0.02 100 nA
Zero gate voltage drain VDS = 100 V; VGS = 0 V; - 0.05 10 µA
current Tj = 175˚C - - 500 µA

Total gate charge ID = 45 A; V

= 80 V; VGS = 10 V - 61 - nC

DD

Gate-source charge - 13 - nC
Gate-drain (Miller) charge - 25 - nC

Turn-on delay time VDD = 50 V; RD = 1.8 Ω; - 18 - ns
Turn-on rise time VGS = 10 V; RG = 5.6 Ω -72-ns
Turn-off delay time Resistive load - 69 - ns
Turn-off fall time - 58 - ns

Internal drain inductance Measured tab to centre of die - 3.5 - nH
Internal drain inductance Measured from drain lead to centre of die - 4.5 - nH

(SOT78 and SOT429 packages)

Internal source inductance Measured from source lead to source - 7.5 - nH

bond pad

Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 2600 - pF
Output capacitance - 340 - pF
Feedback capacitance - 195 - pF

August 1999 2 Rev 1.000

Philips Semiconductors Product specification

N-channel TrenchMOS transistor PHB45NQ10T, PHP45NQ10T

PHW45NQ10T

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS

Tj = 25˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

S

I

SM

V

SD

t

rr

Q

rr

Continuous source current - - 47 A
(body diode)
Pulsed source current (body - - 188 A
diode)
Diode forward voltage IF = 25 A; VGS = 0 V - 0.87 1.2 V

Reverse recovery time IF = 20 A; -dIF/dt = 100 A/µs; - 82 - ns
Reverse recovery charge VGS = 0 V; VR = 25 V - 0.26 - µC

August 1999 3 Rev 1.000

Philips Semiconductors Product specification

N-channel TrenchMOS transistor PHB45NQ10T, PHP45NQ10T

PHW45NQ10T

Normalised Power Derating, PD (%)

100

90
80
70
60
50
40
30
20
10

0

0 25 50 75 100 125 150 175

Mounting Base temperature, Tmb (C)

Fig.1. Normalised power dissipation.

PD% = 100⋅PD/P

Normalised Current Derating, ID (%)

100

90
80
70
60
50
40
30
20
10

0

0 25 50 75 100 125 150 175

Mounting Base temperature, Tmb (C)

D 25 ˚C

= f(Tmb)

Fig.2. Normalised continuous drain current.

ID% = 100⋅ID/I

= f(Tmb); VGS ≥ 10 V

D 25 ˚C

Transient thermal impedance, Zth j-mb (K/W)

1

D = 0.5

0.2

0.1

0.1

0.05

0.02

P

0.01
single pulse

0.001
1E-06 1E-05 1E-04 1E-03 1E-02 1E-01 1E+00

Pulse width, tp (s)

D

D = tp/T

tp

T

Fig.4. Transient thermal impedance.

Z

= f(t); parameter D = tp/T

th j-mb

Drain Current, ID (A)

40
35
30
25
20
15
10

5
0

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2

VGS = 10V

8 V

Drain-Source Voltage, VDS (V)

6 V

4 V

Tj = 25 C

5 V

4.8 V

4.6 V

4.4 V

4.2 V

Fig.5. Typical output characteristics, Tj = 25 ˚C

ID = f(VDS)

.

Peak Pulsed Drain Current, IDM (A)

1000

RDS(on) = VDS/ ID

100

10

D.C.

1

0.1
1 10 100 1000

Drain-Source Voltage, VDS (V)

tp = 10 us

100 us
1 ms
10 ms

100 ms

Fig.3. Safe operating area

ID & IDM = f(VDS); IDM single pulse; parameter t

p

Drain-Source On Resistance, RDS(on) (Ohms)

0.16

0.14

0.12

0.1

0.08

0.06

0.04

0.02

4.2 V

4 V

0

0 2 4 6 8 101214161820

4.4 V

4.6 V

Drain Current, ID (A)

4.8 V

Tj = 25 C

8 V

VGS = 10V

Fig.6. Typical on-state resistance, Tj = 25 ˚C

R

= f(ID)

DS(ON)

5 V

6V

.

August 1999 4 Rev 1.000