Philips PESD5V0L6UAS, PESD5V0L6US Technical data

查询PESD5V0L6UAS供应商
Low capacitance 6-fold ESD protection diode arrays
Rev. 02 — 9 November 2004 Product data sheet
1. Product profile
1.1 General description
Low capacitance 6-fold ESD protection diode arrays in small plastic packages designed to protect up to six transmission or data lines from the damage caused by ElectroStatic Discharge (ESD) and other transients.
Table 1: Product overview
Type number Package
PESD5V0L6UAS TSSOP8 SOT505-1 PESD5V0L6US SO8 SOT96-1
Name Philips
1.2 Features
ESD protection of up to six lines Ultra low leakage current: IRM = 8 nA
Low diode capacitance ESD protection of up to 20 kV
Max. peak pulse power: PPP = 35 W ■ IEC 61000-4-2, level 4 (ESD)
Low clamping voltage: V
= 15 V IEC 61000-4-5 (surge); IPP = 2.5 A.
(CL)R
1.3 Applications
Computers and peripherals High speed data lines
Communication systems Parallel ports.
Audio and video equipment
1.4 Quick reference data
Table 2: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V C
RWM d
reverse stand-off voltage - - 5 V diode capacitance VR = 0 V;
f=1MHz
- 1619pF
Philips Semiconductors
2. Pinning information
Table 3: Discrete pinning
Pin Description Simplified outline Symbol
TSSOP8
1 cathode 1 2 cathode 2 3 cathode 3 4 cathode 4 5 cathode 5 6 common anode 7 common anode 8 cathode 6
SO8
1 cathode 1 2 cathode 2 3 cathode 3 4 cathode 4 5 cathode 5 6 common anode 7 common anode 8 cathode 6
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
85
14
8
1
5
4
1
2
3
4
1
2
3
4
8
7
6
5
sym004
8
7
6
5
sym004
3. Ordering information
Table 4: Ordering information
Type number Package
Name Description Version
PESD5V0L6UAS TSSOP8 plastic thin shrink small outline package; 8 leads;
SOT505-1
body width 3 mm
PESD5V0L6US SO8 plastic small outline package; 8 leads;
SOT96-1
body width 3.9 mm
4. Marking
Table 5: Marking
Type number Marking code
PESD5V0L6UAS 5V06U PESD5V0L6US 5V06US
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 2 of 14
Philips Semiconductors
5. Limiting values
Table 6: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
P
PP
I
PP
T
j
T
amb
T
stg
[1] Non-repetitive current pulse 8/20 µs exponentially decay waveform according to IEC 61000-4-5;
see Figure 1.
[2] Measured from pin 1, 2, 3, 4, 5 or 8 to pin 6 or 7.
Table 7: ESD maximum ratings
Symbol Parameter Conditions Min Max Unit
ESD electrostatic discharge
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
peak pulse power 8/20 µs pulse peak pulse current 8/20 µs pulse junction temperature - 150 °C ambient temperature 65 +150 °C storage temperature 65 +150 °C
IEC 61000-4-2
capability
(contact discharge) HBM MIL-STD883 - 10 kV
[1] [2]
-35W
[1] [2]
- 2.5 A
[1] [2]
-20kV
[1] Device stressed with ten non-repetitive ElectroStatic Discharge (ESD) pulses; see Figure 2. [2] Measured from pin 1, 2, 3, 4, 5 or 8 to pin 6 or 7.
Table 8: ESD standards compliance
ESD Standard Conditions
IEC 61000-4-2, level 4 (ESD); see
Figure 2 > 15 kV (air); > 8 kV (contact)
HBM MIL-STD883, class 3 > 4 kV
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 3 of 14
Philips Semiconductors
120
I
(%)
pp
100 % Ipp; 8 µs
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
001aaa191
I
001aaa630
pp
100 %
90 %
80
40
0
0403010 20
t
e
; 20 µs
50 % I
pp
t (µs)
Fig 1. 8/20 µs pulse waveform according to
IEC 61000-4-5.
10 %
tr = 0.7 to 1 ns
30 ns
60 ns
t
Fig 2. ElectroStatic Discharge (ESD) pulse waveform
according to IEC 61000-4-2.
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 4 of 14
Philips Semiconductors
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
6. Characteristics
Table 9: Characteristics
T
= 25°C unless otherwise specified.
amb
Symbol Parameter Conditions Min Typ Max Unit
Per diode
V
RWM
I
RM
V
(CL)R
V
(BR)
r
dif
C
d
[1] Non-repetitive current pulse 8/20 µs exponentially decay waveform according to IEC 61000-4-5; see Figure 1. [2] Measured between each cathode on pins 1, 2, 3, 4, 5 or 8 and anode on pin 6 or 7.
reverse stand-off voltage - - 5 V reverse leakage current V clamping voltage IPP = 1 A
= 5 V - 8 25 nA
RWM
[1] [2]
--10V
= 2.5 A
I
PP
[1] [2]
--15V breakdown voltage IR = 1 mA 6.4 6.8 7.2 V differential resistance IR = 1 mA - - 100 diode capacitance VR = 0 V; f = 1 MHz;
see
Figure 5
- 1619pF
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 5 of 14
Philips Semiconductors
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
10
001aaa192
3
tp (µs)
4
2
10
P
pp
(W)
10
1
110
T
amb
10 10
= 25 °C.
2
Fig 3. Peak pulse power as a function of exponential
pulse duration t
18
C
d
(pF)
16
; typical values.
p
001aaa194
1.2
P
pp
P
pp(25˚C)
0.8
0.4
0
0 20015050 100
001aaa193
Tj (°C)
Fig 4. Relative variation of peak pulse power as a
function of junction temperature; typical values.
001aaa195
I
RM
I
RM(25˚C)
10
14
12
10
8
054231
T
= 25 °C; f = 1 MHz.
amb
VR (V)
Fig 5. Diode capacitance as a function of reverse
voltage; typical values.
1
1
10
100 150100050−50 Tj (°C)
Fig 6. Relative variation of reverse leakage current as
a function of junction temperature; typical values.
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 6 of 14
Philips Semiconductors
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
ESD TESTER
R
Z
C
Z
IEC61000-4-2 network
= 150 pF; RZ = 330
C
Z
vertical scale = 200 V/div horizontal scale = 50 ns/div
RG 223/U
450
50 coax
DUT: PESD5V0L6UAS PESD5V0L6US
GND
10×
ATTENUATOR
4 GHz DIGITIZING
OSCILLOSCOPE
50
vertical scale = 10 V/div horizontal scale = 50 ns/div
GND
unclamped +1 kV ESD voltage waveform (IEC61000-4-2 network)
GND
vertical scale = 200 V/div horizontal scale = 50 ns/div
unclamped 1 kV ESD voltage waveform (IEC61000-4-2 network)
Fig 7. ESD clamping test set-up and waveforms.
clamped +1 kV ESD voltage waveform (IEC61000-4-2 network)
GND
vertical scale = 10 V/div horizontal scale = 50 ns/div
clamped 1 kV ESD voltage waveform (IEC61000-4-2 network)
006aaa064
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 7 of 14
Philips Semiconductors
7. Application information
The PESD5V0L6UAS and the PESD5V0L6US are designed for protection of up to six unidirectional data lines from the damage caused by ElectroStatic Discharge (ESD) and surge pulses. The PESD5V0L6UAS and the PESD5V0L6US may be used on lines where the signal polarity is above or below ground.
The PESD5V0L6UAS and the PESD5V0L6US provide a surge capability of 35 W per line for a 8/20 µs waveform.
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
high speed data lines
PESD5V0L6UAS
PESD5V0L6US
unidirectional protection of 6 lines bidirectional protection of 5 lines
Fig 8. Typical application for ESD protection of data lines.
PESD5V0L6UAS
PESD5V0L6US
n.c.
n.c.
006aaa065
Circuit board layout and protection device placement:
Circuit board layout is critical for the suppression of ESD, EFT and surge transients. The following guidelines are recommended:
1. Place the protection device as close to the input terminal or connector as possible.
2. The path length between the protection device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protection conductors in parallel with unprotected conductor.
5. Minimize all printed-circuit board conductive loops including power and ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer printed-circuit boards, use ground vias.
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 8 of 14
Philips Semiconductors
8. Package outline
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
D
y
Z
8
pin 1 index
5
14
e
w M
b
p
c
A
2
A
1
E
H
E
L
detail X
SOT505-1
A
X
v M
A
(A3)
L
p
A
θ
2.5 5 mm0
scale
DIMENSIONS (mm are the original dimensions)
A
A
UNIT
max.
mm
1.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT505-1
1
0.15
0.05
A2A3b
0.95
0.25
0.80
IEC JEDEC JEITA
p
0.45
0.25
ceD
0.28
0.15
REFERENCES
(1)E(2)
3.1
2.9
3.1
2.9
0.65
5.1
4.7
LH
E
L
0.7
0.4
p
wyv
0.1 0.10.10.94
EUROPEAN
PROJECTION
(1)
Z
0.70
0.35
ISSUE DATE
θ
6° 0°
99-04-09 03-02-18
Fig 9. Package outline SOT505-1 (TSSOP8).
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 9 of 14
Philips Semiconductors
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
SO8: plastic small outline package; 8 leads; body width 3.9 mm
D
c
y
Z
8
pin 1 index
1
e
5
A
2
A
4
w M
b
p
SOT96-1
E
H
E
1
detail X
A
X
v M
A
Q
(A )
L
p
L
A
3
θ
0 2.5 5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE
VERSION
SOT96-1
A
max.
1.75
0.069
A1A2A
0.25
1.45
0.10
1.25
0.010
0.057
0.004
0.049
IEC JEDEC JEITA
076E03 MS-012
0.25
0.01
b
3
p
0.49
0.25
0.36
0.19
0.019
0.0100
0.014
0.0075
UNIT
inches
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)E(2)
cD
5.0
4.8
0.20
0.19
REFERENCES
eHELLpQZywv θ
4.0
3.8
0.16
0.15
1.27
0.05
6.2
5.8
0.244
0.228
1.05
1.0
0.4
0.039
0.016
0.7
0.6
0.028
0.024
0.25 0.10.25
0.010.010.041 0.004
EUROPEAN
PROJECTION
(1)
0.7
0.3
0.028
0.012
ISSUE DATE
99-12-27 03-02-18
o
8
o
0
Fig 10. Package outline SOT96-1 (SO8/MS-012).
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 10 of 14
Philips Semiconductors
9. Packing information
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
Table 10: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
Type number Package Description Packing quantity
PESD5V0L6UAS SOT505-1 8 mm pitch, 12 mm tape and reel - -118 PESD5V0L6US SOT96-1 8 mm pitch, 12 mm tape and reel -115 -118
[1] For further information and the availability of packing methods, seeSection 14.
[1]
1000 2500
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 11 of 14
Philips Semiconductors
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
10. Revision history
Table 11: Revision history
Document ID Release date Data sheet status Change notice Order number Supersedes
PESD5V06UAS_US_2 20041109 Product data sheet - 9297 750 13537 PESD5V0L6US_1 Modifications:
PESD5V0L6US_1 20040315 Product specification - 9397 750 12248 -
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
PESD5V0L6UAS added
Table 1: product overview added
Section 9: packing information added
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 12 of 14
Philips Semiconductors
11. Data sheet status
PESD5V0L6UAS; PESD5V0L6US
Low capacitance 6-fold ESD protection diode arrays
Level Data sheet status
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
[1]
Product status
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
[2] [3]
Definition
Semiconductors reserves the right to change the specification in any manner without notice.
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
right to make changes at any time in order to improve the design, manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
13. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 13537 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 9 November 2004 13 of 14
Philips Semiconductors
PESD5V0L6UAS; PESD5V0L6US
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Application information. . . . . . . . . . . . . . . . . . . 8
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
9 Packing information. . . . . . . . . . . . . . . . . . . . . 11
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
11 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 13
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14 Contact information . . . . . . . . . . . . . . . . . . . . 13
Low capacitance 6-fold ESD protection diode arrays
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Published in The Netherlands
Date of release: 9 November 2004
Document order number: 9397 750 13537
Loading...