Philips PEMD13, PUMD13 User Guide

DATA SH EET
Product specification
Supersedes data of 2001 Feb 27
2003 Oct 08
DISCRETE SEMICONDUCTORS
PEMD13; PUMD13
NPN/PNP resistor-equipped
transistors; R1 = 4.7 k,R2=47k
2003 Oct 08 2
Philips Semiconductors Product specification
NPN/PNP resistor-equipped transistors;
R1 = 4.7 k, R2 = 47 k
PEMD13; PUMD13
FEATURES
Built-in bias resistors
Simplified circuit design
Reduction of component count
Reduced pick and place costs.
APPLICATIONS
Low current peripheral driver
Replacement of general purpose transistors in digital
applications
Control of IC inputs.
QUICK REFERENCE DATA
DESCRIPTION
NPN/PNP resistor-equipped transistors (see “Simplified
outline, symbol and pinning” for package details).
SYMBOL PARAMETER TYP. MAX. UNIT
V
CEO
collector-emitter
voltage
50 V
I
O
output current (DC) 100 mA
TR1 NPN −−−
TR2 PNP −−−
R1 bias resistor 4.7 k
R2 bias resistor 47 k
PRODUCT OVERVIEW
Note
1. * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
TYPE
NUMBER
PACKAGE
MARKING CODE
PNP/PNP
COMPLEMENT
NPN/NPN
COMPLEMENT
PHILIPS EIAJ
PEMD13 SOT666 Z1 PEMB13 PEMH13
PUMD13 SOT363 SC-88 3*1
(1)
PUMB13 PUMH13
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
TYPE NUMBER SIMPLIFIED OUTLINE AND SYMBOL
PINNING
PIN DESCRIPTION
PEMD13 1 emitter TR1
PUMD13 2 base TR1
3 collector TR2
4 emitter TR2
5 base TR2
6 collector TR1
123
46
5
Top view
654
123
R2
TR1
TR2
R1
R1 R2
MAM468
2003 Oct 08 3
Philips Semiconductors Product specification
NPN/PNP resistor-equipped transistors;
R1 = 4.7 k, R2 = 47 k
PEMD13; PUMD13
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
PEMD13 plastic surface mounted package; 6 leads SOT666
PUMD13 plastic surface mounted package; 6 leads SOT363
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per transistor; for the PNP transistor with negative polarity
V
CBO
collector-base voltage open emitter 50 V
V
CEO
collector-emitter voltage open base 50 V
V
EBO
emitter-base voltage open collector 10 V
V
I
input voltage TR1
positive +30 V
negative −−5V
V
I
input voltage TR2
positive +5 V
negative −−30 V
I
O
output current (DC) 100 mA
I
CM
peak collector current 100 mA
P
tot
total power dissipation T
amb
25 °C
SOT363 note 1 200 mW
SOT666 notes 1 and 2 200 mW
T
stg
storage temperature 65 +150 °C
T
j
junction temperature 150 °C
T
amb
operating ambient temperature 65 +150 °C
Per device
P
tot
total power dissipation T
amb
25 °C
SOT363 note 1 300 mW
SOT666 notes 1 and 2 300 mW
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