Philips PEMD12 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
PEMD12
NPN/PNP resistor-equipped transistors
Product specification Supersedes data of 2001 Aug 30
2001 Nov 07
Philips Semiconductors Product specification
NPN/PNP resistor-equipped transistors PEMD12

FEATURES

300 mW total power dissipation
Very small 1.6 mm x 1.2 mm ultra thin package
Excellent coplanarity due to straight leads
Replaces two SC-75/SC-89 packaged transistors on
same PCB area
Reduces required PCB area
Reduced pick and place costs.

APPLICATIONS

General purpose switching and amplification
Inverter and interface circuits
Circuit driver.

DESCRIPTION

NPN/PNPresistor-equippedtransistorinaSOT666plastic package.

MARKING

QUICK REFERENCE DATA

SYMBOL PARAMETER MAX. UNIT
V I
CEO
CM
collector-emitter voltage 50 V
peak collector current 100 mA R1 bias resistor 47 k R2 bias resistor 47 k

PINNING

PIN DESCRIPTION
1, 4 emitter TR1; TR2 2, 5 base TR1; TR2 6, 3 collector TR1; TR2
handbook, halfpage
5
46
654
R1 R2
TR1
R2
TR2
R1
TYPE NUMBER MARKING CODE
PEMD12 D2
123
Top view
MAM448
123
Fig.1 Simplified outline (SOT666) and symbol.
2, 5
1, 4
MBK120
6, 3
Fig.2 Equivalent inverter symbol.
2001 Nov 07 2
Philips Semiconductors Product specification
NPN/PNP resistor-equipped transistors PEMD12

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per transistor for the PNP transistor with negative polarity
V
CBO
V
CEO
V
EBO
V
I
I
o
I
CM
P
tot
T
stg
T
j
T
amb
Per device
P
tot
collector-base voltage open emitter 50 V collector-emitter voltage open base 50 V emitter-base voltage open collector 10 V input voltage TR1
positive +40 V negative −−10 V
input voltage TR2
positive +10 V
negative −−40 V output current (DC) 100 mA peak collector current 100 mA total power dissipation T
25 °C; notes 1 and 2 200 mW
amb
storage temperature 65 +150 °C junction temperature 150 °C operating ambient temperature 65 +150 °C
total power dissipation T
25 °C; note 1 300 mW
amb
Notes
1. Transistor mounted on an FR4 printed-circuit board.
2. The only recommended soldering is reflow soldering.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
thermal resistance from junction to ambient notes 1 and 2 416 K/W
Notes
1. Transistor mounted on an FR4 printed-circuit board.
2. The only recommended soldering is reflow soldering.
2001 Nov 07 3
Philips Semiconductors Product specification
NPN/PNP resistor-equipped transistors PEMD12
CHARACTERISTICS
T
=25°C unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Per transistor for the PNP transistor with negative polarity
I
CBO
I
CEO
I
EBO
h
FE
V
CEsat
V
i(off)
V
i(on)
R
1
R2
------- ­R1
C
c
collector-base cut-off current VCB= 50 V; IE=0 −−100 nA collector-emitter cut-off current VCE= 50 V; IB=0 −−1µA
V
= 30 V; IB= 0; Tj= 150 °C −−50 µA
CE
emitter-base cut-off current VEB=5V; IC=0 −−90 µA DC current gain VCE=5V; IC=5mA 80 −− saturation voltage IC= 10 mA; IB= 0.5 mA −−150 mV input off voltage VCE=5V; IC= 100 µA 1.2 0.8 V input on voltage VCE= 0.3 V; IC= 2 mA 3 1.6 V input resistor 33 47 61 k resistor ratio 0.8 1 1.2
collector capacitance IE=ie= 0; VCB=10V;
TR1 (NPN) −−2.5 pF
f = 1 MHz
TR2 (PNP) −−3pF
2001 Nov 07 4
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