Philips PCB80C552-5-16WP, S87C552-5BA Datasheet

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80C552/83C552
Single-chip 8-bit microcontroller
Product specification 1996 Aug 06
INTEGRATED CIRCUITS
IC20 Data Handbook
Philips Semiconductors Product specification
Single-chip 8-bit microcontroller
Single-chip 8-bit microcontroller with 10-bit A/D, capture/compare timer, high-speed outputs, PWM
2
1996 Aug 06
DESCRIPTION
The 80C552/83C552 (hereafter generically referred to as 8XC552) Single-Chip 8-Bit Microcontroller is manufactured in an advanced CMOS process and is a derivative of the 80C51 microcontroller family. The 8XC552 has the same instruction set as the 80C51. Three versions of the derivative exist:
83C552—8k bytes mask programmable
ROM
80C552—ROMless version of the 83C552
87C552—8k bytes EPROM (described in a
separate chapter)
The 8XC552 contains a non-volatile 8k × 8 read-only program memory (83C552), a volatile 256 × 8 read/write data memory, five 8-bit I/O ports, one 8-bit input port, two 16-bit timer/event counters (identical to the timers of the 80C51), an additional 16-bit timer coupled to capture and compare latches, a 15-source, two-priority-level, nested interrupt structure, an 8-input ADC, a dual DAC pulse width modulated interface, two serial interfaces (UART and I
2
C-bus), a “watchdog” timer and on-chip oscillator and timing circuits. For systems that require extra capability, the 8XC552 can be expanded using standard TTL compatible memories and logic.
In addition, the 8XC552 has two software selectable modes of power reduction—idle mode and power-down mode. The idle mode freezes the CPU while allowing the RAM, timers, serial ports, and interrupt system to continue functioning. The power-down mode saves the RAM contents but freezes the oscillator, causing all other chip functions to be inoperative.
The device also functions as an arithmetic processor having facilities for both binary and BCD arithmetic plus bit-handling capabilities. The instruction set consists of over 100 instructions: 49 one-byte, 45 two-byte, and 17 three-byte. With a 16MHz (24MHz) crystal, 58% of the instructions are executed in 0.75µs (0.5µs) and 40% in 1.5µs (1µs). Multiply and divide instructions require 3µs (2µs).
FEA TURES
80C51 central processing unit
8k × 8 ROM expandable externally to 64k
bytes
An additional 16-bit timer/counter coupled
to four capture registers and three compare registers
Two standard 16-bit timer/counters
256 × 8 RAM, expandable externally to 64k
bytes
Capable of producing eight synchronized,
timed outputs
A 10-bit ADC with eight multiplexed analog
inputs
Two 8-bit resolution, pulse width
modulation outputs
Five 8-bit I/O ports plus one 8-bit input port
shared with analog inputs
I
2
C-bus serial I/O port with byte oriented
master and slave functions
Full-duplex UART compatible with the
standard 80C51
On-chip watchdog timer
Three speed ranges:
1.2 to 16MHz1.2 to 24MHz (ROM, ROMless only)1.2 to 30MHz (ROM, ROMless only)
Three operating ambient temperature
ranges:
PCB83C552–5: 0°C to +70°CPCF83C552–5: –40°C to +85°C
(XTAL frequency max. 24 MHz)
– PCA83C552–5: –40°C to +125°C
(XTAL frequency max. 16 MHz)
PIN CONFIGURA TIONS
9161
60
44
4327
26
10
CERAMIC
AND
PLASTIC
LEADED CHIP
CARRIER
Pin Function Pin Function
1 P5.0/ADC0 35 XTAL1 2 V
DD
36 V
SS
3 STADC 37 V
SS
4 PWM0 38 NC* 5 PWM1 39 P2.0/A08 6 EW 40 P2.1/A09 7 P4.0/CMSR0 41 P2.2/A10 8 P4.1/CMSR1 42 P2.3/A11
9 P4.2/CMSR2 43 P2.4/A12 10 P4.3/CMSR3 44 P2.5/A13 11 P4.4/CMSR4 45 P2.6/A14 12 P4.5/CMSR5 46 P2.7/A15 13 P4.6/CMT0 47 PSEN 14 P4.7/CMT1 48 ALE 15 RST 49 EA 16 P1.0/CT0I 50 P0.7/AD7 17 P1.1/CT1I 51 P0.6/AD6 18 P1.2/CT2I 52 P0.5/AD5 19 P1.3/CT3I 53 P0.4/AD4 20 P1.4/T2 54 P0.3/AD3 21 P1.5/RT2 55 P0.2/AD2 22 P1.6/SCL 56 P0.1/AD1 23 P1.7/SDA 57 P0.0/AD0 24 P3.0/RxD 58 AVref– 25 P3.1/TxD 59 AVref+ 26 P3.2/INT0 60 AV
SS
27 P3.3/INT1 61 AV
DD
28 P3.4/T0 62 P5.7/ADC7 29 P3.5/T1 63 P5.6/ADC6 30 P3.6/WR 64 P5.5/ADC5 31 P3.7/RD 65 P5.4/ADC4 32 NC* 66 P5.3/ADC3 33 NC* 67 P5.2/ADC2 34 XTAL2 68 P5.1/ADC1
*DO NOT CONNECT
80 65
64
41
4025
24
1
PLASTIC
QUAD FLAT
PACK
PORT 5
PORT 4
ADC0-7
CMT0 CMT1
CMSR0-5
RST
EW
XTAL1 XTAL2
EA
ALE
PSEN
AVref+ AVref–
STADC
PWM0 PWM1
PORT 0
LOW ORDER
ADDRESS AND
DATA BUS
PORT 1PORT 2PORT 3
CT0I CT1I CT2I CT3I T2 RT2 SCL SDA
RxD/DATA TxD/CLOCK
INT0 INT1 T0 T1 WR RD
V
SS
V
DD
AV
SS
AV
DD
HIGH ORDER
ADDRESS AND
DATA BUS
Philips Semiconductors Product specification
Single-chip 8-bit microcontroller
1996 Aug 06
3
PLASTIC QUAD FLAT PACK PIN FUNCTIONS
80 65
64
41
4025
24
1
PQFP
Pin Function Pin Function
1 P4.1/CMSR1 41 P2.3/A11 2 P4.2/CMSR2 42 P2.4/A12 3 NC* 43 NC* 4 P4.3/CMSR3 44 NC* 5 P4.4/CMSR4 45 P2.5/A13 6 P4.5/CMSR5 46 P2.6/A14 7 P4.6/CMT0 47 P2.7/A15 8 P4.7/CMT1 48 PSEN
9 RST 49 ALE 10 P1.0/CT0I 50 EA 11 P1.1/CT1I 51 P0.7/AD7 12 P1.2/CT2I 52 P0.6/AD6 13 P1.3/CT3I 53 P0.5/AD5 14 P1.4/T2 54 P0.4/AD4 15 P1.5/RT2 55 P0.3/AD3 16 P1.6/SCL 56 P0.2/AD2 17 P1.7/SDA 57 P0.1/AD1 18 P3.0/RxD 58 P0.0/AD0 19 P3.1/TxD 59 AVref– 20 P3.2/INT0 60 AVref+ 21 NC* 61 AV
SS
22 NC* 62 NC* 23 P3.3/INT1 63
AV
DD
24 P3.4/T0 64 P5.7/ADC7 25 P3.5/T1 65 P5.6/ADC6 26 P3.6/WR 66 P5.5/ADC5 27 P3.7/RD 67 P5.4/ADC4 28 NC* 68 P5.3/ADC3 29 NC* 69 P5.2/ADC2 30 NC* 70 P5.1/ADC1 31 XTAL2 71 P5.0/ADC0 32 XTAL1 72 V
DD
33 IC 73 IC 34 V
SS
74 STADC
35 V
SS
75 PWM0
36 V
SS
76 PWM1 37 NC* 77 EW 38 P2.0/A08 78 NC* 39 P2.1/A09 79 NC* 40 P2.2/A10 80 P4.0/CMSR0
* DO NOT CONNECT IC = internally connected (do not use)
LOGIC SYMBOL
Philips Semiconductors Product specification
Single-chip 8-bit microcontroller
1996 Aug 06
4
ORDERING INFORMATION
PHILIPS
PART ORDER NUMBER
PART MARKING
NORTH AMERICA PHILIPS
PART ORDER NUMBER
DRAWING
TEMPERATURE °C
FREQ
ROMless ROM ROMless ROM NUMBER AND PACKAGE MHz
PCB80C552-5-16WP PCB83C552-5WP/xxx S80C552-4A68 S83C552-4A68 SOT188-3
0 to +70, Plastic Leaded Chip
Carrier
16
PCB80C552-5-16H PCB83C552-5H/xxx S80C552-4B S83C552-4B SOT318-2 0 to +70, Plastic Quad Flat Pack 16 PCF80C552-5-16WP PCF83C552-5WP/xxx S80C552-5A68 S83C552-5A68 SOT188-3
–40 to +85, Plastic Leaded Chip
Carrier
16
PCF80C552-5-16H PCF83C552-5H/xxx S80C552-5B S83C552-5B SOT318-2
–40 to +85, Plastic Quad Flat
Pack
16
PCA80C552-5-16WP PCA83C552-5WP/xxx S80C552-6A68 S83C552-6A68 SOT188-3
–40 to +125, Plastic Leaded Chip
Carrier
16
PCA80C552-5-16H PCA83C552-5H/xxx S80C552-6B S83C552-6B SOT318-2
–40 to +125, Plastic Quad Flat
Pack
16
PCB80C552-5-24WP PCB83C552-5WP/xxx S80C552-AA68 S83C552-AA68 SOT188-3
0 to +70, Plastic Leaded Chip
Carrier
24
PCB80C552-5-24H PCB83C552-5H/xxx S80C552-AB S83C552-AB SOT318-2 0 to +70, Plastic Quad Flat Pack 24 PCF80C552-5-24WP PCF83C552-5WP/xxx S80C552-BA68 S83C552-BA68 SOT188-3
–40 to +85, Plastic Leaded Chip
Carrier
24
PCF80C552-5-24H PCF83C552-5H/xxx S80C552-BB S83C552-BB SOT318-2
–40 to +85, Plastic Quad Flat
Pack
24
PCB80C552-5-30WP PCB83C552-5WP/xxx S80C552-CA68 S83C552-CA68 SOT188-3
0 to +70, Plastic Leaded Chip
Carrier
30
PCB80C552-5-30H PCB83C552-5H/xxx S80C552-CB S83C552-CB SOT318-2 0 to +70, Plastic Quad Flat Pack 30
NOTE:
1. xxx denotes the ROM code number.
Philips Semiconductors Product specification
Single-chip 8-bit microcontroller
1996 Aug 06
5
DRAWING
TEMPERATURE °C
FREQ
EPROM NUMBER AND PACKAGE MHz
S87C552-4A68 SOT188-3
0 to +70, Plastic Leaded Chip
Carrier
16
S87C552-4K68 1473A
0 to +70, Ceramic Leaded Chip
Carrier w/Window
16 S87C552-4BA SOT318-2 0 to +70, Plastic Quad Flat Pack 16 S87C552-5A68 SOT188-3
–40 to +85, Plastic Leaded Chip
Carrier
16
S87C552-5K68 1473A
–40 to +85, Ceramic Leaded
Chip Carrier w/Window
16
S87C552-5BA SOT318-2
–40 to +85, Plastic Quad Flat
Pack
16
Philips Semiconductors Product specification
Single-chip 8-bit microcontroller
1996 Aug 06
6
BLOCK DIAGRAM
CPU
ADC
8-BIT INTERNAL BUS
16
P0 P1 P2 P3 TxD RxD P5 P4 CT0I-CT3I T2 RT2 CMSR0-CMSR5
CMT0, CMT1
RST EW
XTAL1
XTAL2
EA
ALE
PSEN
WR
RD
T0 T1 INT0 INT1
V
DD
V
SS
PWM0 PWM1
AV
SS
AV
DD
AV
REF
–+
STADC
ADC0-7 SDA SCL
3 3 3 3
3 3
0
2
1 1 1 4
115
0 1 2
ALTERNATE FUNCTION OF PORT 0
3 4 5
AD0-7
A8-15
3
3
16
T0, T1
TWO 16-BIT
TIMER/EVENT
COUNTERS
PROGRAM
MEMORY
8k x 8 ROM
DATA
MEMORY
256 x 8 RAM
DUAL PWM
SERIAL
I
2
C PORT
80C51 CORE
EXCLUDING
ROM/RAM
PARALLEL I/O
PORTS AND
EXTERNAL BUS
SERIAL
UART PORT
8-BIT
PORT
FOUR 16-BIT
CAPTURE
LATCHES
T2
16-BIT TIMER/ EVENT
COUNTERS
T2
16-BIT
COMPARA-
TORS
wITH
REGISTERS
COMPARA-
TOR
OUTPUT
SELECTION
T3
WATCHDOG
TIMER
ALTERNATE FUNCTION OF PORT 1 ALTERNATE FUNCTION OF PORT 2
ALTERNATE FUNCTION OF PORT 3 ALTERNATE FUNCTION OF PORT 4 ALTERNATE FUNCTION OF PORT 5
Philips Semiconductors Product specification
Single-chip 8-bit microcontroller
1996 Aug 06
7
PIN DESCRIPTION
PIN NO.
MNEMONIC PLCC QFP TYPE NAME AND FUNCTION
V
DD
2 72 I Digital Power Supply: +5V power supply pin during normal operation, idle and
power-down mode.
STADC 3 74 I Start ADC Operation: Input starting analog to digital conversion (ADC operation can also
be started by software). This pin must not float. PWM0 4 75 O Pulse Width Modulation: Output 0. PWM1 5 76 O Pulse Width Modulation: Output 1. EW 6 77 I Enable W atchdog T imer: Enable for T3 watchdog timer and disable power-down mode.
This pin must not float. P0.0-P0.7 57-50 58-51 I/O Port 0: Port 0 is an 8-bit open-drain bidirectional I/O port. Port 0 pins that have 1s written
to them float and can be used as high-impedance inputs. Port 0 is also the multiplexed
low-order address and data bus during accesses to external program and data memory. In
this application it uses strong internal pull-ups when emitting 1s. P1.0-P1.7 16-23 10-17 I/O Port 1: 8-bit I/O port. Alternate functions include:
16-21 10-15 I/O (P1.0-P1.5): Quasi-bidirectional port pins. 22-23 16-17 I/O (P1.6, P1.7): Open drain port pins. 16-19 10-13 I CT0I-CT3I (P1.0-P1.3): Capture timer input signals for timer T2.
20 14 I T2 (P1.4): T2 event input. 21 15 I RT2 (P1.5): T2 timer reset signal. Rising edge triggered. 22 16 I/O SCL (P1.6): Serial port clock line I2C-bus. 23 17 I/O SDA (P1.7): Serial port data line I2C-bus.
Port 1 is also used to input the lower order address byte during EPROM programming and
verification. A0 is on P1.0, etc. P2.0-P2.7 39-46 38-42,
45-47
I/O Port 2: 8-bit quasi-bidirectional I/O port.
Alternate function: High-order address byte for external memory (A08-A15). P3.0-P3.7 24-31 18-20,
23-27
I/O Port 3: 8-bit quasi-bidirectional I/O port. Alternate functions include:
24 18 RxD(P3.0): Serial input port. 25 19 TxD (P3.1): Serial output port. 26 20 INT0 (P3.2): External interrupt. 27 23 INT1 (P3.3): External interrupt. 28 24 T0 (P3.4): Timer 0 external input. 29 25 T1 (P3.5): Timer 1 external input. 30 26 WR (P3.6): External data memory write strobe. 31 27 RD (P3.7): External data memory read strobe.
P4.0-P4.7 7-14 80, 1-2
4-8
I/O Port 4: 8-bit quasi-bidirectional I/O port. Alternate functions include:
7-12 80, 1-2
4-6
O CMSR0-CMSR5 (P4.0-P4.5): Timer T2 compare and set/reset outputs on a match with
timer T2.
13, 14 7, 8 O CMT0, CMT1 (P4.6, P4.7): Timer T2 compare and toggle outputs on a match with timer T2.
P5.0-P5.7 68-62, 71-64, I Port 5: 8-bit input port.
1 ADC0-ADC7 (P5.0-P5.7): Alternate function: Eight input channels to ADC.
RST 15 9 I/O Reset: Input to reset the 8XC552. It also provides a reset pulse as output when timer T3
overflows. XTAL1 35 32 I Crystal Input 1: Input to the inverting amplifier that forms the oscillator, and input to the
internal clock generator. Receives the external clock signal when an external oscillator is
used. XTAL2 34 31 O Crystal Input 2: Output of the inverting amplifier that forms the oscillator. Left open-circuit
when an external clock is used.
Philips Semiconductors Product specification
Single-chip 8-bit microcontroller
1996 Aug 06
8
PIN DESCRIPTION (Continued)
PIN NO.
MNEMONIC PLCC QFP TYPE NAME AND FUNCTION
V
SS
36, 37 34-36 I Two Digital ground pins. PSEN 47 48 O Program Store Enable: Active-low read strobe to external program memory. ALE 48 49 O Address Latch Enable: Latches the low byte of the address during accesses to external
memory. It is activated every six oscillator periods. During an external data memory access, one ALE pulse is skipped. ALE can drive up to eight LS TTL inputs and handles CMOS inputs without an external pull-up.
EA 49 50 I External Access: When EA is held at TTL level high, the CPU executes out of the internal
program ROM provided the program counter is less than 8192. When EA
is held at TTL
low level, the CPU executes out of external program memory. EA
is not allowed to float.
AV
REF–
58 59 I Analog to Digital Conversion Reference Resistor: Low-end.
AV
REF+
59 60 I Analog to Digital Conversion Reference Resistor: High-end.
AV
SS
60 61 I Analog Ground
AV
DD
61 63 I Analog Power Supply
NOTE:
1. To avoid “latch-up” effect at power-on, the voltage on any pin at any time must not be higher or lower than V
DD
+ 0.5V or VSS – 0.5V ,
respectively.
OSCILLATOR CHARACTERISTICS
XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier. The pins can be configured for use as an on-chip oscillator, as shown in the logic symbol, page 3.
To drive the device from an external clock source, XTAL1 should be driven while XTAL2 is left unconnected. There are no requirements on the duty cycle of the external clock signal, because the input to the internal clock circuitry is through a divide-by-two flip-flop. However, minimum and maximum high and low times specified in the data sheet must be observed.
RESET
A reset is accomplished by holding the RST pin high for at least two machine cycles (24 oscillator periods), while the oscillator is running. To insure a good power-on reset, the RST pin must be high long enough to allow the oscillator time to start up (normally a few milliseconds) plus two machine cycles. At power-on, the voltage on V
DD
and RST must come up at the same time for a proper start-up.
IDLE MODE
In the idle mode, the CPU puts itself to sleep while some of the on-chip peripherals stay active. The instruction to invoke the idle mode is the last instruction executed in the normal operating mode before the idle mode is activated. The CPU contents, the on-chip RAM, and all of the special function registers
remain intact during this mode. The idle mode can be terminated either by any enabled interrupt (at which time the process is picked up at the interrupt service routine and continued), or by a hardware reset which starts the processor in the same manner as a power-on reset.
POWER-DOWN MODE
In the power-down mode, the oscillator is stopped and the instruction to invoke power-down is the last instruction executed. Only the contents of the on-chip RAM are preserved. A hardware reset is the only way to terminate the power-down mode. The control bits for the reduced power modes are in the special function register PCON. Table 1 shows the state of the I/O ports during low current operating modes.
Table 1. External Pin Status During Idle and Power-Down Modes
MODE
PROGRAM
MEMORY
ALE PSEN PORT 0 PORT 1 PORT 2 PORT 3 PORT 4
PWM0/
PWM1
Idle Internal 1 1 Data Data Data Data Data 1 Idle External 1 1 Float Data Address Data Data 1 Power-down Internal 0 0 Data Data Data Data Data 1 Power-down External 0 0 Float Data Data Data Data 1
Philips Semiconductors Product specification
Single-chip 8-bit microcontroller
1996 Aug 06
9
Serial Control Register (S1CON) – See Table 2
CR2 ENS1 STA STO SI AA CR1 CR0
S1CON (D8H)
Bits CR0, CR1 and CR2 determine the serial clock frequency that is generated in the master mode of operation.
Table 2. Serial Clock Rates
BIT FREQUENCY (kHz) AT f
OSC
CR2 CR1 CR0 6MHz 12MHz 16MHz 24MHz
2
30MHz
2
f
OSC
DIVIDED BY
0 0 0 23 47 62.5 94 117 1 256 0 0 1 27 54 71 107
1
134
1
224
0 1 0 31 63 83.3 125
1
156
1
192
0 1 1 37 75 100 150
1
188
1
160 1 0 0 6.25 12.5 17 25 31 960 1 0 1 50 100 133
1
200
1
250
1
120 1 1 0 100 200 267
1
400
1
500
1
60
1 1 1 0.24 < 62.5 0.49 < 62.5 0.65 < 55.6 0.98 < 50.0 1.22 < 52.1 96 × (256 – (reload value Timer 1))
0 < 255 0 < 254 0 < 253 0 <251 0 < 250 reload value Timer 1 in Mode 2.
NOTES:
1. These frequencies exceed the upper limit of 100kHz of the I
2
C-bus specification and cannot be used in an I2C-bus application.
2. At f
OSC
= 24MHz/ 30MHz the maximum I2C bus rate of 100kHz cannot be realized due to the fixed divider rates.
ABSOLUTE MAXIMUM RATINGS
1, 2, 3
PARAMETER RATING UNIT
Storage temperature range –65 to +150 °C Voltage on any other pin to V
SS
–0.5 to +6.5 V Input, output DC current on any single I/O pin 5.0 mA Power dissipation
(based on package heat transfer limitations, not device power consumption)
1.0 W
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the AC and DC Electrical Characteristics section of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
3. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless otherwise
noted.
DEVICE SPECIFICATIONS
SUPPLY VOLTAGE (V) FREQUENCY (MHz)
TYPE MIN MAX MIN MAX TEMPERATURE RANGE (°C)
PCB83(0)C552-5-16 4.0 6.0 1.2 16 0 to +70 PCF83(0)C552-5-16 4.0 6.0 1.2 16 –40 to +85 PCA83(0)C552-5-16 4.5 5.5 1.2 16 –40 to +125 PCB83(0)C552-5-24 4.5 5.5 1.2 24 0 to +70 PCF83(0)C552-5-24 4.5 5.5 1.2 24 –40 to +85 PCB83(0)C552-5-30 4.5 5.5 1.2 30 0 to +70
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