Datasheet PCA82C250-N4, PCA82C250T-N4 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1997 Oct 21
File under Integrated Circuits, IC18

2000 Jan 13

INTEGRATED CIRCUITS

PCA82C250

CAN controller interface

2000 Jan 13 2

Philips Semiconductors Product specification

CAN controller interface PCA82C250

FEATURES

• Fully compatible with the

“ISO 11898”

standard

• High speed (up to 1 Mbaud)

• Bus lines protected against transients in an automotive

environment

• Slope control to reduce Radio Frequency Interference
(RFI)

• Differential receiver with wide common-mode range for
high immunity against ElectroMagnetic Interference
(EMI)

• Thermally protected

• Short-circuit proof to battery and ground

• Low-current standby mode

• An unpowered node does not disturb the bus lines

• At least 110 nodes can be connected.

APPLICATIONS

• High-speed applications (up to 1 Mbaud) in cars.

GENERAL DESCRIPTION

The PCA82C250 is the interface between the CAN
protocol controller and the physical bus. The device
provides differential transmit capability to the bus and
differential receive capability to the CAN controller.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

supply voltage 4.5 5.5 V

I

CC

supply current standby mode − 170 µA

1/t

bit

maximum transmission speed non-return-to-zero 1 − Mbaud

V

CAN

CANH, CANL input/output voltage −8 +18 V

V

diff

differential bus voltage 1.5 3.0 V

t

PD

propagation delay high-speed mode − 50 ns

T

amb

ambient temperature −40 +125 °C

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION CODE

PCA82C250 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
PCA82C250T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
PCA82C250U − bare die; 2790 × 1780 × 380 µm −

2000 Jan 13 3

Philips Semiconductors Product specification

CAN controller interface PCA82C250

BLOCK DIAGRAM

handbook, full pagewidth

MKA669

RECEIVER

HS

REFERENCE

VOLTAGE

SLOPE/

STANDBY

PROTECTION

DRIVER

3

2

5

4

8

1

6

7

GND

CANL

CANH

V

ref

TXD

Rs

RXD

V

CC

PCA82C250

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

TXD 1 transmit data input
GND 2 ground
V

CC

3 supply voltage
RXD 4 receive data output
V

ref

5 reference voltage output
CANL 6 LOW-level CAN voltage

input/output

CANH 7 HIGH-level CAN voltage

input/output

Rs 8 slope resistor input

handbook, halfpage

1
2
3
4

8
7
6
5

MKA670

PCA82C250

Rs
CANHGND
CANL
V

ref

RXD

V

CC

TXD

Fig.2 Pin configuration.

2000 Jan 13 4

Philips Semiconductors Product specification

CAN controller interface PCA82C250

FUNCTIONAL DESCRIPTION

The PCA82C250 is the interface between the CAN
protocol controller and the physical bus. It is primarily
intended for high-speed applications (up to 1 Mbaud) in
cars. Thedevice provides differential transmit capability to
the bus and differential receive capability to the CAN
controller. It is fully compatible with the

“ISO 11898”

standard.
A current limiting circuit protects the transmitter output

stage againstshort-circuit to positive and negative battery
voltage. Although the power dissipation is increased
during this fault condition, this feature will prevent
destruction of the transmitter output stage.

If the junction temperature exceeds a value of
approximately 160 °C, the limiting current of both
transmitter outputs is decreased. Because the transmitter
is responsible for the major part of the power dissipation,
this will result in a reduced powerdissipation and hence a
lowerchip temperature.All otherparts of theIC willremain
in operation.The thermal protection is particularly needed
when a bus line is short-circuited.

The CANH and CANL lines are also protected against
electrical transients which may occur in an automotive
environment.

Pin 8 (Rs) allows three different modes of operation to be
selected: high-speed, slope control or standby.

For high-speed operation, the transmitter output
transistors are simply switched on and off as fast as
possible. In this mode, no measures are taken to limit the
rise and fall slope. Use of a shielded cable is
recommended to avoid RFI problems. The high-speed
mode is selected by connecting pin 8 to ground.

For lower speeds or shorter bus length, an unshielded
twisted pair or a parallel pair of wires can be used for the
bus. To reduce RFI, the rise and fall slope should be
limited. The rise and fall slope can be programmed with a
resistor connected from pin 8 to ground. The slope is
proportional to the current output at pin 8.

If a HIGH level is applied to pin 8, the circuit enters a low
current standby mode. In this mode, the transmitter is
switched off and the receiver is switched to a low current.
If dominant bits are detected (differential bus voltage
>0.9 V), RXD will be switched to a LOW level.
The microcontroller should react to this condition by
switching the transceiver back to normal operation (via
pin 8). Because the receiver is slow in standby mode, the
first message will be lost.

Table 1 Truth table of the CAN transceiver

Note

1. X = don’t care.

Table 2 Pin Rs summary

SUPPLY TXD CANH CANL BUS STATE RXD

4.5 to 5.5 V 0 HIGH LOW dominant 0

4.5 to 5.5 V 1 (or floating) floating floating recessive 1

<2 V (not powered) X

(1)

floating floating recessive X

(1)

2V<VCC< 4.5 V >0.75V

CC

floating floating recessive X

(1)

2V<VCC< 4.5 V X

(1)

floating if

VRs> 0.75V

CC

floating if

VRs> 0.75V

CC

recessive X

(1)

CONDITION FORCED AT PIN Rs MODE RESULTING VOLTAGE OR CURRENT AT PIN Rs

V

Rs

> 0.75V

CC

standby IRs< 10 µA

−10 µA<I

Rs

< −200 µA slope control 0.4VCC<VRs< 0.6V

CC

VRs< 0.3V

CC

high-speed IRs< −500 µA

2000 Jan 13 5

Philips Semiconductors Product specification

CAN controller interface PCA82C250

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2;
positive input current.

Notes

1. In accordance with

“IEC 60747-1”

. An alternative definition of virtual junction temperature is:

Tvj=T

amb+Pd×Rth(vj-a)

, where R

th(j-a)

is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits

the allowable combinations of power dissipation (Pd) and ambient temperature (T

amb

).

2. Classification A: human body model; C = 100 pF; R = 1500 Ω; V = ±2000 V.

3. Classification B: machine model; C = 200 pF; R = 25 Ω; V = ±200 V.

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

According to

“SNW-FQ-611 part E”

.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

supply voltage −0.3 +9.0 V

V

n

DC voltage at pins 1, 4, 5 and 8 −0.3 VCC+ 0.3 V

V

6, 7

DC voltage at pins 6 and 7 0 V < VCC< 5.5 V;

no time limit

−8.0 +18.0 V

V

trt

transient voltage at pins 6 and 7 see Fig.8 −150 +100 V

T

stg

storage temperature −55 +150 °C

T

amb

ambient temperature −40 +125 °C

T

vj

virtual junction temperature note 1 −40 +150 °C

V

esd

electrostatic discharge voltage note 2 −2000 +2000 V

note 3 −200 +200 V

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air

PCA82C250 100 K/W
PCA82C250T 160 K/W

2000 Jan 13 6

Philips Semiconductors Product specification

CAN controller interface PCA82C250

CHARACTERISTICS

VCC= 4.5 to 5.5 V; T

amb

= −40 to +125 °C; RL=60Ω; I8> −10 µA; unless otherwise specified; all voltages referenced
to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design,
but only 100% tested at +25 °C.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply

I

3

supply current dominant; V1=1V −−70 mA

recessive; V

1

=4V;

R8=47kΩ

−−14 mA

recessive; V

1

=4V;

V8=1V

−−18 mA

standby; T

amb

<90°C;

note 1

− 100 170 µA

DC bus transmitter

V

IH

HIGH-level input voltage output recessive 0.7V

CC

− VCC+ 0.3 V

V

IL

LOW-level input voltage output dominant −0.3 − 0.3V

CC

V

I

IH

HIGH-level input current V1=4V −200 − +30 µA

I

IL

LOW-level input current V1=1V −100 −−600 µA

V

6,7

recessive bus voltage V1= 4 V; no load 2.0 − 3.0 V

I

LO

off-state output leakage current −2V<(V6,V7)<7V −2 − +1 mA

−5V<(V

6,V7

)<18V −5 − +12 mA

V

7

CANH output voltage V1= 1 V 2.75 − 4.5 V

V

6

CANL output voltage V1= 1 V 0.5 − 2.25 V

∆V

6, 7

difference between output
voltage at pins 6 and 7

V1= 1 V 1.5 − 3.0 V
V

1

=1V; RL=45Ω;

VCC≥ 4.9 V

1.5 −−V

V

1

= 4 V; no load −500 − +50 mV

I

sc7

short-circuit CANH current V7= −5 V; VCC≤ 5V −−−105 mA

V

7

= −5 V; VCC= 5.5 V −−−120 mA

I

sc6

short-circuit CANL current V6=18V −−160 mA

DC bus receiver: V1= 4 V; pins 6 and 7 externally driven; −2V<(V6,V7) < 7 V; unless otherwise specified

V

diff(r)

differential input voltage
(recessive)

−1.0 − +0.5 V

−7V<(V

6,V7

)<12V;

not standby mode

−1.0 − +0.4 V

V

diff(d)

differential input voltage
(dominant)

0.9 − 5.0 V

−7V<(V

6,V7

)<12V;

not standby mode

1.0 − 5.0 V

V

diff(hys)

differential input hysteresis see Fig.5 − 150 − mV

V

OH

HIGH-level output voltage
(pin 4)

I4= −100 µA 0.8V

CC

− V

CC

V

V

OL

LOW-level output voltage (pin 4) I4=1mA 0 − 0.2V

CC

V

I

4

=10mA 0 − 1.5 V

R

i

CANH, CANL input resistance 5 − 25 kΩ

2000 Jan 13 7

Philips Semiconductors Product specification

CAN controller interface PCA82C250

Note

1. I1=I4=I5= 0 mA; 0 V < V6<VCC; 0V<V7<VCC; V8=VCC.

R

diff

differential input resistance 20 − 100 kΩ

C

i

CANH, CANL input capacitance −−20 pF

C

diff

differential input capacitance −−10 pF

Reference output

V

ref

reference output voltage V8=1V;

−50 µA<I5<50µA

0.45V

CC

− 0.55V

CC

V

V

8

=4V;

−5µA<I5<5µA

0.4V

CC

− 0.6V

CC

V

Timing (see Figs 4, 6 and 7)
t

bit

minimum bit time V8=1V −−1µs

t

onTXD

delay TXD to bus active V8=1V −−50 ns

t

offTXD

delay TXD to bus inactive V8=1V − 40 80 ns

t

onRXD

delay TXD to receiver active V8=1V − 55 120 ns

t

offRXD

delay TXD to receiver inactive V8=1V; VCC< 5.1 V;

T

amb

< +85 °C

− 82 150 ns

V

8

=1V; VCC< 5.1 V;

T

amb

< +125 °C

− 82 170 ns

V

8

=1V; VCC< 5.5 V;

T

amb

< +85 °C

− 90 170 ns

V

8

=1V; VCC< 5.5 V;

T

amb

< +125 °C

− 90 190 ns

t

onRXD

delay TXD to receiver active R8=47kΩ−390 520 ns

R

8

=24kΩ−260 320 ns

t

offRXD

delay TXD to receiver inactive R8=47kΩ−260 450 ns

R

8

=24kΩ−210 320 ns

SR differential output voltage slew

rate

R

8

=47kΩ−14 − V/µs

t

WAKE

wake-up time from standby
(via pin 8)

−−20 µs

t

dRXDL

bus dominant to RXD LOW V8= 4 V; standby mode −−3µs

Standby/slope control (pin 8)

V

8

input voltage for high-speed −−0.3V

CC

V

I

8

input current for high-speed V8=0V −−−500 µA

V

stb

input voltage for standby mode 0.75V

CC

−−V

I

slope

slope control mode current −10 −−200 µA

V

slope

slope control mode voltage 0.4V

CC

− 0.6V

CC

V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2000 Jan 13 8

Philips Semiconductors Product specification

CAN controller interface PCA82C250

handbook, halfpage

MKA671

30 pF

100 pF62 Ω

100 pF

+5 V

PCA82C250

RXD

V

ref

TXD

CANH

CANL

GND

V

CC

R

ext

Rs

Fig.3 Test circuit for dynamic characteristics.

handbook, full pagewidth

MKA672

t

offTXD

t

offRXD

t

onTXD

V

RXD

V

diff

V

TXD

t

onRXD

0.3V

CC

0.9 V

0.5 V

0.7V

CC

V

CC

0 V

Fig.4 Timing diagram for dynamic characteristics.

2000 Jan 13 9

Philips Semiconductors Product specification

CAN controller interface PCA82C250

handbook, full pagewidth

MKA673

hysteresis

V

RXD

HIGH

LOW

0.5 V 0.9 V

V

diff

Fig.5 Hysteresis.

handbook, full pagewidth

MKA674

t

WAKE

V

Rs

V

RXD

V

CC

0 V

Fig.6 Timing diagram for wake-up from standby.

V1=1V.

2000 Jan 13 10

Philips Semiconductors Product specification

CAN controller interface PCA82C250

handbook, full pagewidth

MKA675

t

dRXDL

1.5 V

0 V

V

diff

V

RXD

Fig.7 Timing diagram for bus dominant to RXD LOW.

V1= 4 V; V8=4V.

handbook, full pagewidth

MKA676

PCA82C250

RXD

V

ref

TXD

CANH

CANL

GND

V

CC

SCHAFFNER
GENERATOR

62 Ω

+5 V

R

ext

Rs

1 nF

1 nF

Fig.8 Test circuit for automotive transients.

The waveforms of the applied transients shall be in accordance with

“ISO 7637 part 1”

, test pulses 1, 2, 3a and 3b.

2000 Jan 13 11

Philips Semiconductors Product specification

CAN controller interface PCA82C250

APPLICATION INFORMATION

handbook, halfpage

MKA677

P8xC592/P8xCE598

CAN-CONTROLLER

PCA82C250T

CAN-TRANSCEIVER

CTX0 CRX0 CRX1 PX,Y

TXD RXD V

ref

CANL

CAN BUS

LINE

CANH

Rs

R

ext

+5 V

100 nF

124 Ω 124 Ω

V

CC

GND

Fig.9 Application of the CAN transceiver.

2000 Jan 13 12

Philips Semiconductors Product specification

CAN controller interface PCA82C250

handbook, full pagewidth

V

DD

V

SS

R

ext

+5 V

+5 V

+5 V

0 V

100 nF

100 nF

390 Ω

390 Ω

390 Ω

6.8 kΩ 3.6 kΩ

390 Ω

6N137

6N137

MKA678

PCA82C250

CAN-TRANSCEIVER

TXD RXD V

ref

CANL

CAN BUS LINE

CANH

Rs

+5 V

100 nF

124 Ω 124 Ω

V

CC

GND

SJA1000

CAN-CONTROLLER

TX0 TX1 RX0 RX1

Fig.10 Application with galvanic isolation.

2000 Jan 13 13

Philips Semiconductors Product specification

CAN controller interface PCA82C250

INTERNAL PIN CONFIGURATION

handbook, full pagewidth

MKA679

7

6

2

5

4

8

1

3

TXD

V

CC

Rs

RXD

V

ref

GND

CANH
CANL

PCA82C250

Fig.11 Internal pin configuration.

2000 Jan 13 14

Philips Semiconductors Product specification

CAN controller interface PCA82C250

BONDING PAD LOCATIONS

Note

1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of

the die (x/y = 0).

SYMBOL PAD

COORDINATES

(1)

xy

TXD 1 196 135
GND 2 1280 135
V

CC

3 1767 135
RXD 4 2588 135
V

ref

5 2594 1640
CANL 6 1689 1640
CANH 7 948 1640
Rs 8 196 1640

handbook, full pagewidth

PCA82C250U

1

TXD

8

Rs

7

CANH

6

CANL

5

V

ref

V

CC

2

GND

34

RXD

MGL945

y

2.79 mm

x

0

0

1.78
mm

Fig.12 Bonding pad locations.

2000 Jan 13 15

Philips Semiconductors Product specification

CAN controller interface PCA82C250

PACKAGE OUTLINES

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

SOT97-1

95-02-04
99-12-27

UNIT

A

max.

12

b

1

(1) (1)

(1)

b

2

cD E e M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

M

E

e

1

1.73

1.14

0.53

0.38

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05

0.2542.54 7.62

8.25

7.80

10.0

8.3

1.154.2 0.51 3.2

inches

0.068

0.045

0.021

0.015

0.014

0.009

1.07

0.89

0.042

0.035

0.39

0.36

0.26

0.24

0.14

0.12

0.010.10 0.30

0.32

0.31

0.39

0.33

0.0450.17 0.020 0.13

b

2

050G01 MO-001 SC-504-8

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

8

1

5

4

b

E

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1

2000 Jan 13 16

Philips Semiconductors Product specification

CAN controller interface PCA82C250

UNIT

A

max.

A1A2A

3

b

p

cD

(1)E(2)

(1)

eHELLpQZywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

1.27

6.2

5.8

1.05

0.7

0.6

0.7

0.3

8
0

o
o

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.4

SOT96-1

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

4

5

pin 1 index

1

8

y

076E03 MS-012

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15

0.050

0.244

0.228

0.028

0.024

0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

97-05-22
99-12-27

2000 Jan 13 17

Philips Semiconductors Product specification

CAN controller interface PCA82C250

SOLDERING
Introduction

Thistext gives averybrief insight toa complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when
through-holeandsurface mount componentsaremixedon
one printed-circuit board. However, wave soldering is not
always suitable forsurface mountICs, orfor printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the
printed-circuit board has been pre-heated, forced cooling
may benecessary immediately aftersoldering to keepthe
temperature within the permissible limit.

MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
tothe printed-circuitboardby screenprinting,stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

WAVE SOLDERING
Conventional single wave soldering is not recommended

forsurface mount devices(SMDs)or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wavewith high upwardpressure followed bya
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leadsonfour sides, thefootprintmust
be placedat a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

MANUAL SOLDERING
Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 Jan 13 18

Philips Semiconductors Product specification

CAN controller interface PCA82C250

Suitability of IC packages for wave, reflow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is onlysuitable for SSOP and TSSOPpackages with a pitch (e) equal toor larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

MOUNTING PACKAGE

SOLDERING METHOD

WAVE REFLOW

(1)

DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable

(2)

− suitable

Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −

HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS

not suitable

(3)

suitable −

PLCC

(4)

, SO, SOJ suitable suitable −

LQFP, QFP, TQFP not recommended

(4)(5)

suitable −

SSOP, TSSOP, VSO not recommended

(6)

suitable −

2000 Jan 13 19

Philips Semiconductors Product specification

CAN controller interface PCA82C250

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips’ delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in thedata sheet.There areno postpacking testsperformed onindividual die or wafer. Philips Semiconductors
has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips
Semiconductorsassumes noliability for devicefunctionality or performanceof the dieor systemsafter third partysawing,
handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in
which the die is used.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2000

69

Philips Semiconductors – a w orldwide compan y

For all other countries apply to: Philips Semiconductors,

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Printed in The Netherlands 285002/05/pp20 Date of release:2000 Jan 13 Document order number: 9397750 06609