Philips Semiconductors |
Product specification |
|
|
|
|
Rectifier diodes |
PBYR225CT series |
Schottky barrier |
|
|
|
FEATURES
•Low forward volt drop
•Fast switching
•Reverse surge capability
•High thermal cycling performance
•low profile surface mounting package
SYMBOL |
|
|
|
QUICK REFERENCE DATA |
||||
|
|
|
|
|
|
|
|
|
a1 |
|
|
|
a2 |
|
VR = 20 V / 25 V |
||
|
|
|
|
|
||||
1 |
|
|
|
|
|
3 |
|
IO(AV) = 2 A |
|
|
|
||||||
|
|
|
|
|
|
|
|
|
|
|
k |
|
2 |
|
|
|
VF ≤ 0.33V |
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
GENERAL DESCRIPTION |
PINNING |
SOT223 |
|
|
||||||
|
|
|
|
|
|
|
|
|
|
|
Dual, common cathode schottky |
|
PIN |
|
|
DESCRIPTION |
|
|
|
4 |
|
rectifier diodes in a plastic |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
envelope. Intended for use as |
1 |
|
anode 1 |
|
|
|
|
|||
output rectifiers in low voltage, high |
|
|
|
|
|
|
|
|
|
|
frequency switched mode power |
2 |
|
cathode |
|
|
|
|
|||
supplies. |
3 |
|
anode 2 |
|
|
|
|
|||
The PBYR225CT series is supplied |
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
in the surface mounting SOT223 |
|
tab |
|
cathode |
|
1 |
2 |
3 |
||
package. |
|
|
|
|
|
|
|
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
||
|
|
|
|
|
|
|
|
|
|
PBYR2 |
|
20CT |
|
25CT |
|
VRRM |
Peak repetitive reverse |
|
- |
20 |
|
25 |
V |
|
voltage |
|
|
|
|
|
|
VRWM |
Working peak reverse |
|
- |
20 |
|
25 |
V |
|
voltage |
Tsp ≤ 97 ˚C |
|
|
|
|
|
VR |
Continuous reverse voltage |
- |
20 |
|
25 |
V |
|
IO(AV) |
Average rectified output |
square wave; δ = 0.5; Tsp ≤ 136 ˚C |
- |
|
2 |
A |
|
|
current (both diodes |
|
|
|
|
|
|
|
conducting) |
square wave; δ = 0.5; Tsp ≤ 136 ˚C |
|
|
|
|
|
IFRM |
Repetitive peak forward |
- |
|
2 |
A |
||
|
current per diode |
|
|
|
|
|
|
IFSM |
Non-repetitive peak forward |
t = 10 ms |
- |
|
6 |
A |
|
|
current per diode |
t = 8.3 ms |
- |
|
6.6 |
A |
|
|
|
sinusoidal; Tj = 125 ˚C prior to |
|
|
|
|
|
|
|
surge; with reapplied VRRM(max) |
|
|
|
|
|
IRRM |
Peak repetitive reverse |
pulse width and repetition rate |
- |
|
1 |
A |
|
Tj |
surge current per diode |
limited by Tj max |
|
|
|
|
|
Operating junction |
|
- |
|
150 |
˚C |
||
|
temperature per diode |
|
|
|
|
|
|
Tstg |
Storage temperature |
|
- 40 |
|
150 |
˚C |
THERMAL RESISTANCES
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
TYP. |
MAX. |
UNIT |
|
|
|
|
|
|
|
Rth j-sp |
Thermal resistance junction |
one or both diodes conducting |
- |
- |
15 |
K/W |
|
to solder point |
|
|
|
|
|
Rth j-a |
Thermal resistance junction |
pcb mounted, minimum footprint |
- |
156 |
- |
K/W |
|
to ambient |
pcb mounted, pad area as in fig:1 |
- |
70 |
- |
K/W |
March 1998 |
1 |
Rev 1.100 |
Philips Semiconductors Product specification
Rectifier diodes |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PBYR225CT series |
|
||||
Schottky barrier |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||||||||
ELECTRICAL CHARACTERISTICS |
|
|
|
|
|
|
|
|
|
|||||||||||
characteristics are per diode at Tj = 25 ˚C unless otherwise specified |
|
|
|
|
|
|
|
|
|
|||||||||||
SYMBOL |
PARAMETER |
|
CONDITIONS |
|
|
|
|
MIN. |
TYP. |
MAX. |
UNIT |
|
||||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
||||||||
VF |
Forward voltage |
|
IF = 1 A; Tj = 125˚C |
|
|
|
|
- |
0.28 |
0.33 |
V |
|
||||||||
IR |
|
|
IF = 2 A |
|
|
|
|
- |
0.42 |
0.51 |
V |
|
||||||||
Reverse current |
|
VR = VRWM |
|
|
|
|
- |
0.05 |
3 |
mA |
|
|||||||||
Cd |
|
|
VR = VRWM; Tj = 100˚C |
|
|
|
|
- |
5 |
10 |
mA |
|
||||||||
Junction capacitance |
|
VR = 5 V; f = 1 MHz, Tj = 25˚C to 125˚C |
- |
160 |
- |
pF |
|
|||||||||||||
PRINTED CIRCUIT BOARD |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Dimensions in mm. |
|
||
|
|
|
|
|
|
|
36 |
|
|
|
|
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
18 |
|
|
|
|
|
||
|
|
60 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4.5 |
|
|
|
|
|
|||||
|
|
4.6 |
|
|
|
|
|
|
|
|
|
|||||||||
|
|
9 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
10 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
7
15
50
Fig.1. PCB for thermal resistance and power rating for SOT223.
PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 μm thick).
March 1998 |
2 |
Rev 1.100 |