Philips PBSS8110D Technical data

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PBSS8110D
100 V, 1 A NPN low V
Rev. 01 — 23 April 2004 Product data sheet
1. Product profile
1.1 General description
NPN low V
1.2 Features
SOT457 package
Low collector-emitter saturation voltage V
High collector current capability IC and I
High efficiency, leading to less heat generation.
1.3 Applications
Major application segments:
DC-to-DC converter
Peripheral driver
(BISS) transistor
CEsat
transistor in a plastic SOT457 (SC-74) package.
CEsat
CEsat
CM
Automotive 42 V power
Telecom infrastructure
Industrial.
Driver in low supply voltage applications (e.g. lamps and LEDs)
Inductive load drivers (e.g. relays, buzzers and motors).
1.4 Quick reference data
Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V I
C
I
CM
R
CEO
CEsat
collector-emitter voltage - - 100 V collector current (DC) - - 1 A peak collector current - - 3 A equivalent on-resistance - - 200 m
Philips Semiconductors
PBSS8110D
2. Pinning information
Table 2: Discrete pinning
Pin Description Simplified outline Symbol
1, 2, 5, 6 collector 3 base 4 emitter
3. Ordering information
Table 3: Ordering information
Type number Package
PBSS8110D - plastic surface mounted package; 6 leads SOT457
100 V, 1 A NPN low V
132
Top view
Name Description Version
(BISS) transistor
CEsat
456
3
1, 2, 5, 6
4
sym014
4. Marking
Table 4: Marking
Type number Marking code
PBSS8110D A8
[1] Made in Malaysia.
[1]
9397 750 12566 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 23 April 2004 2 of 12
Philips Semiconductors
PBSS8110D
5. Limiting values
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
V
CEO
V
EBO
I
CM
I
C
I
B
P
tot
T
j
T
amb
T
stg
[1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint. [2] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, 1 cm2 collector mounting
pad.
[3] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, 6 cm2 collector mounting
pad.
100 V, 1 A NPN low V
(BISS) transistor
CEsat
collector-base voltage open emitter - 120 V collector-emitter voltage open base - 100 V emitter-base voltage open collector - 5 V peak collector current T
j(max)
-3A continuous collector current - 1 A continuous base current - 0.3 A total power dissipation T
amb
25 °C
[1]
- 300 mW
[2]
- 550 mW
[3]
- 700 mW junction temperature - 150 °C operating ambient temperature 65 +150 °C storage temperature 65 +150 °C
800
P
tot
(mW)
600
400
200
0
0 16012040 80
(1) FR4 PCB; 6 cm2 collector mounting pad. (2) FR4 PCB; 1 cm2 collector mounting pad. (3) FR4 PCB; standard footprint.
Fig 1. Power derating curves.
001aaa493
(1)
(2)
(3)
T
(°C)
amb
9397 750 12566 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 23 April 2004 3 of 12
Philips Semiconductors
PBSS8110D
100 V, 1 A NPN low V
(BISS) transistor
CEsat
6. Thermal characteristics
Table 6: Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
R
th(j-a)
th(j-s)
thermal resistance from junction to ambient in free air
thermal resistance from junction to
in free air
soldering point
[1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint. [2] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, 1 cm2 collector mounting pad. [3] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, 6 cm2 collector mounting pad.
3
10
Z
th
(1) (2)
(K/W)
(3) (4)
2
10
(5) (6)
(7)
(8)
10
(9)
[1]
416 K/W
[2]
227 K/W
[3]
178 K/W
[1]
83 K/W
001aaa494
(10)
1
1
10
5
10
4
10
3
10
2
1
10
1
Mounted on FR4 PCB; standard footprint. (1) δ =1. (2) δ = 0.75. (3) δ = 0.5. (4) δ = 0.33. (5) δ = 0.2. (6) δ = 0.1. (7) δ = 0.05. (8) δ = 0.02. (9) δ = 0.01.
(10) δ =0.
Fig 2. Transient thermal impedance as a function of pulse time; typical values.
1010
2
10
tp (s)
3
10
9397 750 12566 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 23 April 2004 4 of 12
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