Philips PBSS5160T Technical data

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DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
PBSS5160T
60 V, 1 A PNP low V
M3D088
(BISS) transistor
Product specification Supersedes data of 2003 Jun 23
2004 May 27
Philips Semiconductors Product specification
60 V, 1 A PNP low V
CEsat
FEATURES
Low collector-emitter saturation voltage V
High collector current capability: IC and I
High efficiency, reduces heat generation
Reduces printed-circuit board area required
Cost effective replacement for medium power
transistors BCP52 and BCX52.
APPLICATIONS
Major application segments: – Automotive – Telecom infrastructure – Industrial.
Power management: – DC-to-DC conversion – Supply line switching.
Peripheral driver: – Driver in low supply voltage applications (e.g. lamps
and LEDs)
– Inductive load driver (e.g. relays,
buzzers and motors).
DESCRIPTION
PNP low V
transistor in a SOT23 plastic package.
CEsat
NPN complement: PBSS4160T.
(BISS) transistor
CEsat
CM
PBSS5160T
QUICK REFERENCE DATA
SYMBOL PARAMETER MAX. UNIT
V
CEO
I
C
I
CM
R
CEsat
PINNING
1 base 2 emitter 3 collector
handbook, halfpage
collector-emitter voltage 60 V collector current (DC) 1A peak collector current 2A equivalent on-resistance 330 m
PIN DESCRIPTION
Top view
3
1
21
MAM256
3
2
Fig.1 Simplified outline (SOT23) and symbol.
MARKING
TYPE NUMBER MARKING CODE
(1)
PBSS5160T U6*
Note
1. * = p: made in Hong Kong
* = t: made in Malaysia * = W: made in China.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
PBSS5160T plastic surface mounted package; 3 leads SOT23
2004 May 27 2
Philips Semiconductors Product specification
60 V, 1 A
PBSS5160T
PNP low V
CEsat
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V V V I
I I I P
T T T
CBO CEO EBO
C
CM B BM
tot
stg j amb
collector-base voltage open emitter −−80 V collector-emitter voltage open base −−60 V emitter-base voltage open collector −−5V collector current (DC) note 1 −−0.9 A
peak collector current t = 1 ms or limited by T base current (DC) −−300 mA peak base current tp≤ 300 µs; δ≤0.02 −−1A total power dissipation T
storage temperature 65 +150 °C junction temperature 150 °C operating ambient temperature 65 +150 °C
(BISS) transistor
note 2 −−1A
−−2A
amb
j(max)
25 °C; note 1 270 mW note 2 400 mW notes 1 and 3 1.25 W
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
2. Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and 1 cm2 collector mounting pad.
3. Operated under pulsed conditions: duty cycle δ≤20 %, pulse width tp≤ 10 ms.
120
T
amb
MLE128
(°C)
500
handbook, halfpage
P
tot
(mW)
400
300
200
100
0
0 40 80 160
(1)
(2)
(1) Device mounted with 1 cm2 collector tab. (2) Device mounted on standard footprint.
Fig.2 Power derating curves.
2004 May 27 3
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