DISCRETE SEMICONDUCTORS
DATA SH EET
handbook, halfpage
M3D087
PBSS4540Z
NPN medium power transistor
Preliminary specification 1999 Aug 04
Philips Semiconductors Preliminary specification
NPN medium power transistor PBSS4540Z
FEATURES
• High current (max. 10 A)
• Low voltage (max. 40 V)
• Low V
CEsat
.
APPLICATIONS
• Heavy duty battery powered equipment (Automotive,
Telecom and Audio/Video) such as motor and lamp
drivers
• V
critical applications such as the latest low supply
CEsat
voltage IC applications
• All battery driven equipment to save battery power.
DESCRIPTION
NPN low V
transistor in a SOT223 plastic package.
CEsat
PNP complement: PBSS5540Z.
MARKING CODE
TYPE NUMBER MARKING CODE
PBSS4540Z PB4540
PINNING
PIN DESCRIPTION
1 base
2 collector
3 emitter
4 collector
handbook, halfpage
123
Top view
4
1
MAM287
Fig.1 Simplified outline (SOT223) and symbol.
2, 4
3
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
collector-base voltage open emitter − 40 V
collector-emitter voltage open base − 40 V
emitter-base voltage open collector − 6V
collector current (DC) − 5A
peak collector current − 10 A
peak base current − 2A
total power dissipation T
≤ 25 °C; note 1 − 1.35 W
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C
Note
2
1. Devicemountedonaprinted-circuitboard,single-sidedcopper,tinplated,mounting pad for collector 1 cm
mounting conditions, see
“Thermal considerations for SOT223 in the General Part of associated Handbook”.
.Forother
1999 Aug 04 2
Philips Semiconductors Preliminary specification
NPN medium power transistor PBSS4540Z
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
Note
1. Devicemountedonaprinted-circuitboard,single-sidedcopper,tinplated,mounting pad for collector 1 cm
mounting conditions, see
CHARACTERISTICS
Tj=25°C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CBO
I
EBO
h
FE
V
CEsat
V
BEsat
V
BEon
C
c
f
T
thermal resistance from junction to ambient note 1 92 K/W
2
.Forother
“Thermal considerations for SOT223 in the General Part of associated Handbook”.
collector cut-off current IE= 0; VCB=30V −−100 nA
I
= 0; VCB=30V; Tj= 150 °C −−50 µA
E
emitter cut-off current IC= 0; VEB=5V −−100 nA
DC current gain VCE=2V
I
= 500 mA 300 500 −
C
= 1 A; note 1 300 500 −
I
C
I
= 2 A; note 1 250 450 −
C
I
= 5 A; note 1 50 150 −
C
saturation voltage IC= 500 mA; IB=5mA − 65 120 mV
I
= 1 A; IB=10mA − 100 150 mV
C
I
= 2 A; IB= 200 mA; note 1 − 130 170 mV
C
I
= 5 A; IB= 500 mA; note 1 − 300 400 mV
C
saturation voltage IC= 5 A; IB= 500 mA; note 1 − 1.1 1.3 V
base-emitter turn-on voltage IC= 2 A; VCE= 2 V 1.1 0.8 − V
collector capacitance IE=ie= 0; VCB=10V; f=1MHz − 60 70 pF
transition frequency IC= 500 mA; VCE= 5 V; f = 100 MHz 80 120 − MHz
Note
1. Pulse test: t
≤ 300 µs; δ≤0.02.
p
1999 Aug 04 3