Philips PBSS4160T User Guide [en, ca]

Page 1
查询PBSS4160T供应商
DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D088
PBSS4160T
60 V, 1 A NPN low V
Product specification Supersedes data of 2003 Jun 24
(BISS) transistor
2004 May 12
Page 2
Philips Semiconductors Product specification
60 V, 1 A NPN low V
CEsat
FEATURES
• Low collector-emitter saturation voltage V
• High collector current capability IC and I
• High efficiency, reduces heat generation
• Reduces printed-circuit board area required
• Cost effectivereplacement for medium power transistor
BCP55 and BCX55.
APPLICATIONS
• Major application segments: – Automotive 42 V power – Telecom infrastructure – Industrial.
• Power management: – DC-to-DC conversion – Supply line switching.
• Peripheral driver – Driver in low supply voltage applications (e.g. lamps
and LEDs)
– Inductive load driver (e.g. relays,
buzzers and motors).
DESCRIPTION
NPN low V
transistor in a SOT23 plastic package.
CEsat
PNP complement: PBSS5160T.
(BISS) transistor
CEsat
CM
PBSS4160T
QUICK REFERENCE DATA
SYMBOL PARAMETER MAX. UNIT
V
CEO
I
C
I
CM
R
CEsat
PINNING
handbook, halfpage
collector-emitter voltage 60 V collector current (DC) 1 A peak collector current 2 A equivalent on-resistance 250 mΩ
PIN DESCRIPTION
1 base 2 emitter 3 collector
Top view
3
1
21
MAM255
3
2
Fig.1 Simplified outline (SOT23) and symbol.
MARKING
TYPE NUMBER MARKING CODE
(1)
PBSS4160T *U5
Note
1. * = p: made in Hong Kong
* = t: made in Malaysia * = W: made in China.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
PBSS4160T − plastic surface mounted package; 3 leads SOT23
2004 May 12 2
Page 3
Philips Semiconductors Product specification
60 V, 1 A
PBSS4160T
NPN low V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V V V I
I I I P
T T T
CBO CEO EBO
C
CM B BM
tot
stg j amb
collector-base voltage open emitter − 80 V collector-emitter voltage open base − 60 V emitter-base voltage open collector − 5V collector current (DC) note 1 − 0.9 A
peak collector current t = 1 ms or limited by T base current (DC) − 300 mA peak base current tp≤ 300 µs; δ≤0.02 − 1A total power dissipation T
storage temperature −65 +150 °C junction temperature − 150 °C operating ambient temperature −65 +150 °C
(BISS) transistor
CEsat
note 2 − 1A
j(max)
≤ 25 °C; note 1 − 270 mW
amb
T
≤ 25 °C; note 2 − 400 mW
amb
T
≤ 25 °C; notes 1 and 3 − 1.25 W
amb
− 2A
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint.
2. Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated, 1 cm2 collector mounting pad.
3. Operated under pulsed conditions: duty cycle δ≤20%, pulse width tp≤ 10 ms.
120
T
amb
MLE128
(°C)
500
handbook, halfpage
P
tot
(mW)
400
(1)
300
(2)
200
100
0
0 40 80 160
(1) Device mounted with 1 cm2 collector tab. (2) Device mounted on standard footprint.
Fig.2 Power derating curves.
2004 May 12 3
Page 4
Philips Semiconductors Product specification
60 V, 1 A
PBSS4160T
NPN low V
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
2. Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and 1 cm2 collector mounting pad.
3. Operated under pulsed conditions: duty cycle δ≤20%, pulse width tp≤ 10 ms.
handbook, full pagewidth
thermal resistance from junction to ambient
3
10
δ = 1
Z
th
(K/W)
0.75
0.5
0.33
2
10
0.2
(BISS) transistor
CEsat
in free air; note 1 465 K/W in free air; note 2 312 K/W in free air; notes 1 and 3 100 K/W
MLE127
0.1
0.05
0.02
10
0.01
0
1
−5
10
Mounted on printed-circuit board; standard footprint.
−4
10
−3
10
Fig.3 Transient thermal impedance as a function of pulse time; typical values.
−2
10
−1
10
1
10 10
2
tp (s)
3
10
2004 May 12 4
Page 5
Philips Semiconductors Product specification
60 V, 1 A
PBSS4160T
NPN low V
CHARACTERISTICS
T
=25°C unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CBO
I
CES
I
EBO
h
V
V R V f
T
C
FE
CEsat
BEsat
CEsat
BEon
c
collector-base cut-off current VCB= 60 V; IE=0A −−100 nA
collector-emitter cut-off current VCE= 60 V; VBE=0A −−100 nA emitter-base cut-off current VEB=5V; IC=0A −−100 nA DC current gain VCE=5V; IC= 1 mA 250 400 −
collector-emitter saturation voltage IC= 100 mA; IB=1mA − 90 110 mV
base-emitter saturation voltage IC= 1 A; IB=50mA − 0.95 1.1 V equivalent on-resistance IC= 1 A; IB= 100 mA; note 1 − 200 250 mΩ base-emitter turn-on voltage VCE=5V; IC=1A − 0.82 0.9 V transition frequency IC= 50 mA; VCE=10V;
collector capacitance VCB=10V;IE=Ie= 0 A; f = 1 MHz − 5.5 10 pF
(BISS) transistor
CEsat
= 60 V; IE= 0 A; Tj= 150 °C −−50 µA
V
CB
VCE=5V; IC= 500 mA; note 1 200 350 − VCE=5V; IC= 1 A; note 1 100 150 −
IC= 500 mA; IB=50mA − 110 140 mV IC= 1 A; IB= 100 mA; note 1 − 200 250 mV
150 220 − MHz
f = 100 MHz
Note
1. Pulse test: t
800
handbook, halfpage
h
FE
600
400
200
0
−1
10
VCE=5V. (1) T (2) T (3) T
amb amb amb
= 100 °C. =25°C. = −55 °C.
≤ 300 µs; δ≤0.02.
p
(1)
(2)
(3)
1
10 10
MLE130
2
10
3
IC (mA)
4
10
1.2
handbook, halfpage
V
BE
(V)
0.8
0.4
0
−1
10
VCE=5V. (1) T (2) T (3) T
amb amb amb
= −55 °C. =25°C. = 100 °C.
110
(1)
(2)
(3)
2
10
10
MLE133
3
IC (mA)
4
10
Fig.4 DC current gain as a function of collector
current; typical values.
2004 May 12 5
Fig.5 Base-emitter voltage as a function of
collector current; typical values.
Page 6
Philips Semiconductors Product specification
60 V, 1 A NPN low V
V
CEsat
(V)
−1
10
−2
10
−3
10
IC/IB= 10. (1) T
amb
(2) T
amb
(3) T
amb
1
−1
10
= 100 °C. =25°C. = −55 °C.
handbook, halfpage
(BISS) transistor
CEsat
(1)
(2)
(3)
110
PBSS4160T
MLE135
handbook, halfpage
V
CEsat
1
(V)
−1
10
(1)
(3) (2)
−2
10
2
10
3
10
IC (mA)
4
10
−1
10
11010
2
IC/IB= 20. (1) T (2) T (3) T
amb amb amb
= 100 °C. =25°C. = −55 °C.
10
MLE104
3
IC (mA)
4
10
Fig.6 Collector-emitter saturation voltage as a
function of collector current; typical values.
10
MLE129
3
IC (mA)
V
CEsat
1
handbook, halfpage
(V)
−1
10
−2
10
−1
10
T
=25°C.
amb
(1) IC/IB= 100. (2) IC/IB= 50.
(1)
(2)
11010
2
Fig.7 Collector-emitter saturation voltage as a
function of collector current; typical values.
10
MLE134
3
IC (mA)
4
10
1.2
handbook, halfpage
V
BEsat
(V)
0.8
(1)
(2)
(3)
0.4
0
4
10
−1
10
110
2
10
IC/IB= 20. (1) T (2) T (3) T
amb amb amb
= −55 °C. =25°C. = 100 °C.
Fig.8 Collector-emitter saturation voltage as a
function of collector current; typical values.
2004 May 12 6
Fig.9 Base-emitter saturation voltage as a
function of collector current; typical values.
Page 7
Philips Semiconductors Product specification
60 V, 1 A NPN low V
handbook, halfpage
2
I
C
(A)
1.6
1.2
0.8
0.4
0
05
=25°C.
T
amb
(1) IB= 60 mA. (2) IB= 54 mA. (3) IB= 48 mA. (4) IB= 42 mA.
1
Fig.10 Collector current as a function of
collector-emitter voltage; typical values.
(BISS) transistor
CEsat
(4)(5)(6)
234
(5) IB= 36 mA. (6) IB= 30 mA. (7) IB= 24 mA. (8) IB= 18 mA.
(2)(3)
MLE131
(1)
(7) (8)
(9)
(10)
VCE (V)
(9) IB= 12 mA. (10) IB= 6 mA.
PBSS4160T
10
MLE132
3
IC (mA)
amb
3
10
handbook, halfpage
R
CEsat
(Ω)
2
10
10
1
−1
10
10
IC/IB= 20.
(1) T
amb
−1
1
= 100 °C. (2) T
10 10
amb
(1)
(2)
(3)
2
=25°C. (3) T
Fig.11 Equivalent on-resistance as a function of
collector current; typical values.
4
10
= −55 °C.
2004 May 12 7
Page 8
Philips Semiconductors Product specification
60 V, 1 A
PBSS4160T
NPN low V
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads SOT23
(BISS) transistor
CEsat
D
E
H
E
AB
X
v
M
A
3
12
e
1
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
1.1
mm
0.9
OUTLINE VERSION
SOT23 TO-236AB
max.
0.1
b
p
0.48
0.15
0.38
0.09
IEC JEDEC EIAJ
b
p
e
cD
3.0
2.8
w
M
B
0 1 2 mm
scale
e
0.95
H
1
2.5
2.1
E
1.4
1.9
1.2
REFERENCES
e
Q
A
A
1
c
L
p
detail X
L
Qwv
p
E
0.55
0.45
0.15
0.45
0.2
0.1
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28 99-09-13
2004 May 12 8
Page 9
Philips Semiconductors Product specification
60 V, 1 A
PBSS4160T
NPN low V
DATA SHEET STATUS
LEVEL
I Objective data Development This data sheet contains data from the objective specification for product
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
III Product data Production This data sheet contains data from the product specification. Philips
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DATA SHEET
STATUS
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
(BISS) transistor
CEsat
(1)
PRODUCT
STATUS
(2)(3)
development. Philips Semiconductors reserves the right to change the specification in any manner without notice.
Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
DEFINITION
DEFINITIONS Short-form specification The data in a short-form
specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device attheseoratanyotherconditionsabovethosegiveninthe Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentationorwarrantythatsuchapplicationswillbe suitable for the specified use without further testing or modification.
DISCLAIMERS Life support applications These products are not
designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductorscustomersusingorsellingtheseproducts for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes  Philips Semiconductors reserves the right to make changes in the products ­including circuits, standard cells, and/or software ­described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 May 12 9
Page 10
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected].
© Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R75/02/pp10 Date of release: 2004 May 12 Document order number: 9397 750 13198
SCA76
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