Philips p80cl410, p83cl410 DATASHEETS
INTEGRATED CIRCUITS
DATA SH EET
P80CL410; P83CL410
Low voltage 8-bit microcontrollers
with I
Product specification
Supersedes data of 1995 Jan 20
File under Integrated circuits, IC20
2
C-bus
1997 Apr 10
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
CONTENTS
1 FEATURES
2 GENERAL DESCRIPTION
2.1 ROMless version: P80CL410
3 APPLICATIONS
4 ORDERING INFORMATION
5 BLOCK DIAGRAM
6 FUNCTIONAL DIAGRAM
7 PINNING INFORMATION
7.1 Pinning
7.2 Pin description
8 FUNCTIONAL DESCRIPTION OVERVIEW
8.1 General
8.2 CPU timing
9 MEMORY ORGANIZATION
9.1 Program Memory
9.2 Data Memory
9.3 Special Function Registers (SFRs)
9.4 Addressing
10 I/O FACILITIES
10.1 Ports
10.2 Port options
10.3 Port 0 options
10.3.1 External memory accesses
10.3.2 I/O Accesses
10.4 SET/RESET options
11 TIMERS/EVENT COUNTERS
12 REDUCED POWER MODES
12.1 Idle mode
12.2 Power-down mode
12.3 Wake-up from Power-down mode
12.3.1 Wake-up using INT2 to INT9
12.3.2 Wake-up using RST
12.4 Power Control Register (PCON)
12.5 Status of external pins
13 I2C-BUS SERIAL I/O
13.1 Serial Control Register (S1CON)
13.2 Serial Status Register (S1STA)
13.3 Data Shift Register (S1DAT)
13.4 Address Register (S1ADR)
14 INTERRUPT SYSTEM
14.1 External interrupts INT2 to INT9
14.2 Interrupt priority
14.3 Interrupt registers
14.3.1 Interrupt Enable Register (IEN0)
P80CL410; P83CL410
14.3.2 Interrupt Enable Register (IEN1)
14.3.3 Interrupt Priority Register (IP0)
14.3.4 Interrupt Priority Register (IP1)
14.3.5 Interrupt Polarity Register (IX1)
14.3.6 Interrupt Request Flag Register (IRQ1)
15 OSCILLATOR CIRCUITRY
16 RESET
16.1 External reset using the RST pin
16.2 Power-on-reset
17 SPECIAL FUNCTION REGISTERS
OVERVIEW
18 INSTRUCTION SET
19 LIMITING VALUES
20 DC CHARACTERISTICS
21 AC CHARACTERISTICS
22 P85CL000HFZ ‘PIGGY-BACK’
SPECIFICATION
22.1 General description
22.2 Feature differences/additional features of
P85CL000HFZ with respect to P83CL410
22.3 Common specification/feature differences
between P85CL000HFZ and
P83CL410/P80CL51
23 PACKAGE OUTLINES
24 SOLDERING
24.1 Introduction
24.2 DIP
24.2.1 Soldering by dipping or by wave
24.2.2 Repairing soldered joints
24.3 QFP
24.3.1 Reflow soldering
24.3.2 Wave soldering
24.3.3 Repairing soldered joints
24.4 Reflow soldering
24.5 Wave soldering
24.6 Repairing soldered joints
25 DEFINITIONS
26 LIFE SUPPORT APPLICATIONS
27 PURCHASE OF PHILIPS I2C COMPONENTS
1997 Apr 10 2
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
1 FEATURES
• Full static 80C51 Central Processing Unit
• 8-bit CPU, ROM, RAM, I/O in a 40-lead DIP,
40-lead VSO or 44-lead QFP package
• 128 bytes on-chip RAM Data Memory
• 4 kbytes on-chip ROM Program Memory for P83CL410
• External memory expandable up to 128 kbytes: RAM up
to 64 kbytes and ROM up to 64 kbytes
• Four 8-bit ports; 32 I/O lines
• Two 16-bit Timer/Event counters
• On-chip oscillator suitable for RC, LC, quartz crystal or
ceramic resonator
• Thirteen source, thirteen vector, nested interrupt
structure with two priority levels
2
C-bus interface for serial transfer on two lines
• I
• Enhanced architecture with:
– non-page oriented instructions
– direct addressing
– four 8-byte RAM register banks
– stack depth limited only by available internal RAM
(maximum 128 bytes)
– multiply, divide, subtract and compare instructions
• Reduced power consumption through Power-down and
Idle modes
• Wake-up via external interrupts at Port 1
• Frequency range: DC to 12 MHz
• Supply voltage: 1.8 to 6.0 V
• Very low current consumption
• Operating ambient temperature range: −40 to +85 °C.
2 GENERAL DESCRIPTION
The P80CL410; P83CL410 (hereafter generally referred to
as the P8xCL410) is manufactured in an advanced CMOS
technology that allows the device to operate at voltages
down to 1.8 V and at frequencies down to DC.
The P8xCL410 has the same instruction set as the 80C51.
P80CL410; P83CL410
The 8xCL410 has two reduced power modes that are the
same as those on the standard 80C51.
The special reduced power feature of this device is that it
can be stopped and then restarted. Running from an
external clock source, the clock can be stopped and after
a period of time restarted. The 8xCL410 will resume
operation from where it was when the code stopped with
no loss of internal state, RAM contents, or Special
Function Register contents.
If the internal oscillator is used the device cannot be
stopped and started, but the Power-down mode can be
used to achieve similar power savings, without loss of
on-chip RAM and Special Function Register values.
The Power-down mode can be terminated via an interrupt.
This data sheet details the specific properties of the
P80CL410; P83CL410. For details of the 80C51 core see
“Data Handbook IC20”
For emulation purposes, the P85CL000 (piggy-back
version) with 256 bytes of RAM is recommended. Details
are given in Chapter 22.
2.1 ROMless version: P80CL410
The P80CL410 is the ROMless version of the P83CL410.
The mask options on the P80CL410 are fixed as follows:
• All ports have option ‘1S’ (standard port, HIGH after
reset), except ports P1.6 and P1.7 which have option
‘2S’ (open-drain, HIGH after reset)
• Oscillator option: Oscillator 3
• Power-on-reset option: OFF.
3 APPLICATIONS
The P8xCL410 is an 8-bit general purpose microcontroller
especially suited for battery-powered applications.
The P8xCL410 also functions as an arithmetic processor
having facilities for both binary and BCD arithmetic plus
bit-handling capabilities.
.
The P8xCL410 features 4 kbyte ROM (83CL410),
128 bytes RAM (both ROM and RAM are externally
expandable to 64 kbytes), four 8-bit ports, two 16-bit
timer/counter, an I
priority level nested interrupt structure, and on-chip
oscillator circuitry suitable for quartz crystal, ceramic
resonator, RC, or LC. The device operates over a wide
range of supply voltages and has low power consumption.
1997 Apr 10 3
2
C serial interface, a thirteen source two
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
4 ORDERING INFORMATION
TYPE NUMBER
(1)
PACKAGE
ROMless ROM NAME DESCRIPTION VERSION
P80CL410HFP P83CL410HFP DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1
P80CL410HFT P83CL410HFT VSO40 plastic very small outline package; 40 leads SOT158-1
− P83CL410HFH QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10 × 10 × 1.75 mm
Note
1. Refer to the Order Entry Form (OEF) for this device for the full type number, including options/program.
5 BLOCK DIAGRAM
frequency
reference
XTAL2 XTAL1
P80CL410; P83CL410
SOT307-2
counter (1)
T0 T1
OSCILLATOR
AND
TIMING
CPU
10 3
internal
interrupts
external interrupts (1)
(1) Pins shared with parallel port pins.
PROGRAM
MEMORY
(4K x 8 ROM)
64 kbyte BUS
EXPANSION
CONTROL
control parallel ports,
DATA
MEMORY
(128 x 8 RAM)
PROGRAMMABLE I/O
address/data bus
and I/O pins
P80CL410
P83CL410
TWO 16-BIT
TIMER/EVENT
COUNTERS
I2C-BUS
SERIAL I/O
SDA SCL
(1)
MBK018
Fig.1 Block diagram.
1997 Apr 10 4
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
6 FUNCTIONAL DIAGRAM
V
handbook, full pagewidth
XTAL1
XTAL2
EA
PSEN
ALE
SS
V
DD
P80CL410
P83CL410
RST
P80CL410; P83CL410
port 0
port 1
address and
data bus
INT2
INT3
INT4
INT5
INT6
INT7
INT8/SCL
INT9/SDA
INT0
INT1
alternative
functions
T0
T1
WR
RD
port 3
Fig.2 Functional diagram.
1997 Apr 10 5
MBK019
port 2
address bus
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
7 PINNING INFORMATION
7.1 Pinning
handbook, halfpage
P1.0/INT2
P1.1/INT3
P1.2/INT4
P1.3/INT5
P1.4/INT6
P1.5/INT7
P1.6/INT8/SCL
P1.7/INT9/SDA
RST
P3.0
P3.1
P3.2/INT0
1
2
3
4
5
6
7
8
9
10
11
12
P80CL410
P83CL410
40
39
38
37
36
35
34
33
32
31
30
29
V
DD
P0.0/AD0
P0.1/AD1
P0.2/AD2
P0.3/AD3
P0.4/AD4
P0.5/AD5
P0.6/AD6
P0.7/AD7
EA
ALE
PSEN
P80CL410; P83CL410
P3.3/INT1
P3.4/T0
P3.5/T1
P3.6/WR
P3.7/RD
XTAL2
XTAL1
V
SS
13
14
15
16
17
18
19
20
MBK017
28
27
26
25
24
23
22
21
P2.7/A15
P2.6/A14
P2.5/A13
P2.4/A12
P2.3/A11
P2.2/A10
P2.1/A9
P2.0/A8
Fig.3 Pin configuration for DIP40 and VSO40 packages.
1997 Apr 10 6
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
handbook, full pagewidth
P1.1/INT3
P1.2/INT4
P1.3/INT5
P1.4/INT6
44
43
42
41
1P1.5/INT7
RST
P3.0
n.c.
P3.1
2
3
4
5
6
7
8
9
10
11
P83CL410HFH
P1.6/INT8/SCL
P1.7/INT9/SDA
P3.2/INT0
P3.3/INT1
P3.4/T0
P3.5/T1
n.c.
P1.0/INT2
40
39
DD
V
38
P0.1/AD1
P0.0/AD0
37
36
P80CL410; P83CL410
P0.3/AD3
P0.2/AD2
35
34
P0.4/AD4
33
32
P0.5/AD5
31
P0.6/AD6
30
P0.7/AD7
29
EA
n.c.
28
27
ALE
PSEN
26
25
P2.7/A15
24
P2.6/A14
23
P2.5/A13
12
13
14
15
16
SS
P3.7/RD
P3.6/WR
XTAL2
XTAL1
V
Fig.4 Pin configuration for QFP44 package.
1997 Apr 10 7
17
n.c.
18
19
P2.0/A8
P2.1/A9
20
21
P2.2/A10
P2.3/A11
22
MBK016
P2.4/A12
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
7.2 Pin description Table 1 Pin description for DIP40 (SOT190-1), VSO40 (SOT319-2) and QFP44 (SOT307-2) packages
For more extensive description of the port pins see Chapter 10 “I/O facilities”.
PIN
SYMBOL
INT2 1 40 • Port 1: 8-bit bidirectional I/O port (P1.0 to P1.7). Port pins that have
P1.0/
P1.1/
INT3 2 41
INT4 3 42
P1.2/
INT5 4 43
P1.3/
INT6 5 44
P1.4/
INT7 6 1
P1.5/
INT8/SCL 7 2
P1.6/
INT9/SDA 8 3
P1.7/
RST 9 4 Reset: a HIGH level on this pin for two machine cycles while the oscillator
P3.0 10 5 • Port 3: 8-bit bidirectional I/O port (P3.0 to P3.7).
P3.1 11 7
P3.2/INT0 12 8
INT1 13 9
P3.3/
P3.4/T0 14 10
P3.5/T1 15 11
WR 16 12
P3.6/
RD 17 13
P3.7/
XTAL2 18 14 Crystal oscillator output: output of the inverting amplifier of the oscillator.
XTAL1 19 15 Crystal oscillator input: input to the inverting amplifier of the oscillator,
V
SS
P2.0 to P2.7
A8 to A15
PSEN 29 26 Program Store Enable. Output read strobe to external Program Memory.
DIP40
VSO40
20 16 Ground: circuit ground potential.
21 to 28 18 to 25 • Port 2: 8-bit bidirectional I/O port (P2.0 to P2.7) with internal pull-ups.
QFP44
logic 1s written to them are pulled HIGH by internal pull-ups, and in this
state can be used as inputs. As inputs, Port 1 pins that are externally
pulled LOW will source current (IIL, see Chapter 20) due to the internal
pull-ups. Port 1 output buffers can sink/source 4 LS TTL loads.
• Alternative functions:
– INT2 to INT9 are external interrupt inputs
– SCL and SDA are the I2C-bus clock and data lines.
is running resets the device.
Same characteristics as Port 1.
• Alternative functions:
INT0 and INT1 are external interrupts 0 and 1
–
– T0 and T1 are external inputs for timers 0 and 1
– WR is the external Data Memory write strobe
– RD is the external Data Memory read strobe.
Left open when external clock is used.
also the input for an externally generated clock source.
Same characteristics as Port 1.
• High-order addressing: Port 2 emits the high-order address byte
(A8 to A15) during accesses to external memory that use 16-bit
addresses (MOVX @DPTR). In this application it uses the strong internal
pull-ups when emitting logic 1s. During accesses to external memory that
use 8-bit addresses (MOVX @Ri), Port 2 emits the contents of the P2
Special Function Register.
When executing code out of external Program Memory ,PSEN is activated
twice each machine cycle. However, during each access to external Data
Memory two PSEN activations are skipped.
DESCRIPTION
P80CL410; P83CL410
1997 Apr 10 8
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
PIN
SYMBOL
ALE 30 27 Address Latch Enable. Output pulse for latching the low byte of the
EA 31 29 External Access. When EA is held HIGH the CPU executes out of internal
P0.0 to P0.7
AD0 to AD7
V
DD
n.c. − 6, 17, 28
DIP40
VSO40
39 to 32 30 to 37 • Port 0: 8-bit open-drain bidirectional I/O port. As an open-drain output
40 38 Power supply.
QFP44
and 39
address during access to external memory. ALE is emitted at a constant
rate of1⁄6× f
(assuming MOVX instructions are not used).
program memory (unless the program counter exceeds 0FFFH). Holding
EA LOW forces the CPU to execute out of external memory regardless of
the value of the program counter.
port it can sink 8 LS TTL loads. Port 0 pins that have logic 1s written to
them float, and in that state will function as high impedance inputs.
• Low-order addressing: Port 0 is also the multiplexed low-order address
and data bus during access to external memory. The strong internal
pull-ups are used while emitting logic 1s within the low order address.
Not connected.
, and may be used for external timing or clocking purposes
osc
DESCRIPTION
P80CL410; P83CL410
1997 Apr 10 9
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
8 FUNCTIONAL DESCRIPTION OVERVIEW
This chapter gives a brief overview of the device.
The detailed functional description is in the following
chapters:
Chapter 9 “Memory organization”
Chapter 10 “I/O facilities”
Chapter 11 “Timers/event counters”
Chapter 12 “Reduced power modes”
Chapter 13 “I2C-bus serial I/O”
Chapter 14 “Interrupt system”
Chapter 15 “Oscillator circuitry”
Chapter 16 “Reset”.
8.1 General
The P8xCL410 is a stand-alone high-performance CMOS
microcontroller designed for use in real-time applications
such as instrumentation, industrial control, intelligent
computer peripherals and consumer products.
The device provides hardware features, architectural
enhancements and new instructions to function as a
controller for applications requiring up to 64 kbytes of
Program Memory and/or up to 64 kbytes of Data Memory.
The P8xCL410 contains a 4 kbytes Program Memory
(ROM; P83CL410); a static 128 bytes Data Memory
(RAM); 32 I/O lines; two16-bit timer/event counters;
a thirteen-source, two priority-level, nested interrupt
structure and on-chip oscillator and timing circuit.
2
C-bus serial interface is also provided.
An I
The device has two software-selectable modes of reduced
activity for power reduction:
• Idle mode; freezes the CPU while allowing the timers,
serial I/O and interrupt system to continue functioning.
• Power-down mode; saves the RAM contents but
freezes the oscillator causing all other chip functions to
be inoperative.
P80CL410; P83CL410
9 MEMORY ORGANIZATION
The P8xCL410 has 4 kbytes of Program Memory (ROM;
P83CL410 only) plus 128 bytes of Data Memory (RAM) on
board. The device has separate address spaces for
Program and Data Memory (see Fig.5). Using Port latches
P0 and P2, the P8xCL410 can address a maximum of
64 kbytes of program memory and a maximum of
64 kbytes of data memory. The CPU generates. The CPU
generates both read (
external Data Memory accesses, and the read strobe
PSEN) for external Program Memory.
(
9.1 Program Memory
After reset the CPU begins program execution at location
0000H. The lower 4 kbytes of Program Memory can be
implemented in the on-chip ROM (P83CL410 only) or in
external Program Memory.
EA pin is tied to VDD, then Program Memory fetches
If the
from addresses 0000H to 0FFFH are directed to the
internal ROM. Fetches from addresses 1000H to FFFFH
are directed to external ROM. Program Counter values
greater than 0FFFH are automatically addressed to
external memory regardless of the state of the EA pin.
9.2 Data Memory
The P8xCL410 contains128 bytes of internal RAM and 27
Special Function Registers (SFR). The memory map
(Fig.5) shows the internal Data Memory space divided into
the lower 128, the upper 128, and the SFR space.
The lower 128 bytes of the internal RAM are organized as
mapped in Fig.6. The lowest 32 bytes are grouped into 4
banks of 8 registers. Program instructions refer to these
registers within a register bank as R0 through R7. Two bits
in the Program Status Word select which register bank is
in use. The next 16 bytes above the register banks form a
block of bit-addressable memory space. The 128 bits in
this area can be directly addressed by the single-bit
manipulation instructions. The remaining registers
(30H to 7FH) are directly and indirectly byte addressable.
RD) and write (WR) signals for
8.2 CPU timing
A machine cycle consists of a sequence of 6 states. Each
state lasts for two oscillator periods, thus a machine cycle
takes 12 oscillator periods or 1 µs if the oscillator
frequency (f
1997 Apr 10 10
) is 12 MHz.
osc
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
handbook, full pagewidth
4095
64K
4096
INTERNAL
(EA = 1)
EXTERNAL
4095
EXTERNAL
(EA = 0)
255
127
0
OVERLAPPED SPACE
INTERNAL
DATA RAM
P80CL410; P83CL410
64K
SPECIAL
FUNCTION
REGISTERS
0
PROGRAM MEMORY
INTERNAL DATA MEMORY
Fig.5 Memory map.
MLA559
EXTERNAL
DATA MEMORY
1997 Apr 10 11
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
handbook, halfpage
R7
R0
R7
R0
R7
7FH
30H
2FH
20H
1FH
18H
17H
10H
0FH
P80CL410; P83CL410
bit-addressable space
(bit addresses 0 to 7F)
4 banks of 8 registers
(R0 to R7)
R0
R7
R0
Fig.6 The lower 128 bytes of internal RAM.
9.3 Special Function Registers (SFRs)
The upper 128 bytes are the address locations of the
SFRs. Figure 7 shows the SFR space. The SFRs include
the port latches, timers, peripheral control, serial I/O
registers, etc. These registers can only be accessed by
direct addressing. There are 128 directly addressable
locations in the SFR address space (SFRs with addresses
divisible by eight).
9.4 Addressing
The P8xCL410 has five methods for addressing source
operands:
• Register
• Direct
• Register-indirect
• Immediate
• Base-register plus index-register-indirect.
08H
07H
0
MLA560 - 1
The first three methods can be used for addressing
destination operands. Most instructions have a
‘destination/source’ field that specifies the data type,
addressing methods and operands involved.
For operations other than MOVs, the destination operand
is also a source operand.
Access to memory addressing is as follows:
• Registers in one of the four register banks through
register, direct or register-indirect
• Internal RAM (128 bytes) through direct or
register-indirect
• Special Function Registers through direct
• External data memory through register-indirect
• Program Memory look-up tables through base-register
plus index-register-indirect.
1997 Apr 10 12
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
REGISTER
MNEMONIC
IP1
B
IX1
IEN1
ACC
S1ADR
S1DAT
S1STA
S1CON
BIT ADDRESS
FEFF FD FC FB FA F9 F8
F6F7 F5 F4 F3 F2 F1 F0
EEEF ED EC EB EA E9 E8
E6E7 E5 E4 E3 E2 E1 E0
DEDF DD DC DB DA D9 D8
DIRECT
BYTE
ADDRESS (HEX)
FFH
F8H
F0H
E9H
E8H
E0H
DBH
DAH
D9H
D8H
P80CL410; P83CL410
PSW
IRQ1
IP0
IEN0
P1
TH1
TH0
TL1
TL0
TMOD
TCON
PCON
DPH
DPL
SP
P0
P3
P2
D6D7 D5 D4 D3 D2 D1 D0
C6C7 C5 C4 C3 C2 C1 C0
BE BD BC BB BA B9 B8
B6B7 B5 B4 B3 B2 B1 B0
AEAF AD AC AB AA A9 A8
A6A7 A5 A4 A3 A2 A1 A0
9697 95 94 93 92 91 90
8E8F 8D 8C 8B 8A 89 88
8687 85 84 83 82 81 80
D0H
C0H
B8H
B0H
A8H
A0H
90H
8DH
8CH
8BH
8AH
89H
88H
87H
83H
82H
81H
80H
SFRs containing
directly addressable
bits
MBK020
Fig.7 Special Function Register memory map.
1997 Apr 10 13
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
10 I/O FACILITIES
10.1 Ports
The P8xCL410 has 32 I/O lines treated as 32 individually
addressable bits or as four parallel 8-bit addressable ports.
Ports 0, 1, 2 and 3 perform the alternative functions
detailed below. To enable a port pin alternate function, the
port bit latch in its SFR must contain a logic 1.
Port 0 Provides the multiplexed low-order address and
data bus for expanding the device with standard
memories and peripherals.
Port 1 Used for the external interrupts
the I2C-bus interface lines SCL and SDA.
Port 2 Provides the high-order address when expanding
the device with external Program or Data Memory.
Port 3 Pins can be configured individually to provide:
• External interrupt request inputs: INT1 and INT0
• Timer/counter inputs: T1 and T0
• Control signals to read and write to external
memories: RD and WR.
Each port consists of a latch (SFRs P0 to P3), an output
driver and input buffer. Ports 1, 2, and 3 have internal
pull-ups Figure 8(a) shows that the strong transistor ‘p1’ is
turned on for only 2 oscillator periods after a LOW-to-HIGH
transition in the port latch. When on, it turns on ‘p3’ (a weak
pull-up) through the inverter. This inverter and ‘p3’ form a
latch which holds the logic 1. In Port 0 the pull-up ‘p1’ is
only on when emitting logic 1s for external memory
access. Writing a logic 1 to a Port 0 bit latch leaves both
output transistors switched off so that the pin can be used
as a high-impedance input.
INT2 to INT9, and
P80CL410; P83CL410
Option 3 Push-pull; output with drive capability in both
polarities. Under this option, pins can only be
used as outputs; see Fig.8(c).
10.3 Port 0 options
The definition of port options for Port 0 is slightly different.
Two cases are considered. First, access to external
memory (
boundary) and second, I/O accesses.
10.3.1 E
Option 1 True logic 0 and logic 1 are written as address to
Option 2 An external pull-up resistor is required for
Option 3 Not allowed for external memory accesses as
10.3.2 I/O A
Option 1 When writing a logic 1 to the port latch, the
Option 2 Open-drain; quasi-directional I/O with n-channel
Option 3 Push-Pull; output with drive capability in both
EA = 0 or access above the built-in memory
XTERNAL MEMORY ACCESSES
the external memory (strong pull-up to be used).
external accesses.
the port can only be used as output.
CCESSES
strong pull-up ‘p1’ will be on for 2 oscillator
periods. No weak pull-up exists. Without an
external pull-up, this option can be used as a
high-impedance input.
open-drain output. Use as an output requires the
connection of an external pull-up resistor.
See Fig.8(b).
polarities. Under this option pins can only be
used as outputs. See Fig.8(c).
10.2 Port options
The pins of port 1 (except P1.6 and P1.7; with option 2S
only), port 2 and port 3 may be individually configured with
one of the following options. These options are also shown
in Fig.8.
Option 1 Standard Port; quasi-bidirectional I/O with
pull-up. The strong booster pull-up ‘p1’ is turned
on for two oscillator periods after a
LOW-to-HIGH transition in the port latch;
Fig.8(a).
Option 2 Open-drain; quasi-bidirectional I/O with
n-channel open-drain output. Use as an output
requires the connection of an external pull-up
resistor; see Fig.8(b).
1997 Apr 10 14
10.4 SET/RESET options
Individual mask selection of the post-reset state is
available with any of the above pins. The required
selection is made by appending ‘S’ or ‘R’ to Options 1, 2,
or 3 above.
Option R RESET, at reset this pin will be initialized LOW.
Option S SET, at reset this pin will be initialized HIGH.
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
handbook, full pagewidth
from port latch
read port pin
input data
2 oscillator
periods
Q
strong pull-up
INPUT
BUFFER
(a) Standard
P80CL410; P83CL410
+5 V
p2
p1
n
p3
I/O pin
+5 V
from port latch
read port pin
from port latch
Q
input data
Q
n
INPUT
BUFFER
(b) Open-drain
strong pull-up
+5 V
external
pull-up
I/O pin
p1
I/O pin
n
(c) Push-pull
Fig.8 Port configuration options.
1997 Apr 10 15
MGD677
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
11 TIMERS/EVENT COUNTERS
The P8xCL410 contains two16-bit timer/event counter
registers; Timer 0 and Timer 1, which can perform the
following functions:
• Measure time intervals and pulse durations
• Count events
• Generate interrupt requests.
In the ‘Timer’ operating mode the register is incremented
every machine cycle. Since a machine cycle consists of 12
oscillator periods, the count rate is1⁄12× f
In the ‘Counter’ operating mode, the register is
incremented in response to a HIGH-to-LOW transition.
Since it takes 2 machine cycles (24 oscillator periods) to
recognize a HIGH-to-LOW transition, the maximum count
1
rate is
should be held for at least one complete machine cycle.
Timer 0 and Timer 1 can be programmed independently to
operate in four modes:
Mode 0 8-bit timer or 8-bit counter each with divide-by-32
Mode 1 16-bit time-interval or event counter.
Mode 2 8-bit time-interval or event counter with automatic
Mode 3 Timer 0 establishes TL0 and TH0 as two
⁄24× f
. To ensure a given level is sampled, it
osc
prescaler.
reload upon overflow.
separate counters.
osc
.
P80CL410; P83CL410
The following functions remain active during the Idle
mode:
• Timer 0 and Timer 1
2
C-bus
• I
• External interrupt.
These functions may generate an interrupt or reset; thus
ending the Idle mode.
There are two ways to terminate the Idle mode:
1. Activation of any enabled interrupt will cause IDL
(PCON.0) to be cleared by hardware thus terminating
the Idle mode. The interrupt is serviced, and following
the RETI instruction, the next instruction to be
executed will be the one following the instruction that
put the device in the Idle mode. The flag bits GF0
(PCON.2) and GF1 (PCON.3) may be used to
determine whether the interrupt was received during
normal execution or during the Idle mode.
For example, the instruction that writes to PCON.0 can
also set or clear one or both flag bits. When the Idle
mode is terminated by an interrupt, the service routine
can examine the status of the flag bits.
2. The second way of terminating the Idle mode is with an
external hardware reset. Since the oscillator is still
running, the hardware reset is required to be active for
two machine cycles (24 oscillator periods) to complete
the reset operation. Reset redefines all SFRs but does
not affect the on-chip RAM.
12 REDUCED POWER MODES
There are two software selectable modes of reduced
activity for further power reduction: Idle and Power-down.
12.1 Idle mode
Idle mode operation permits the external interrupts,
2
C-bus, and timer blocks to continue to function while the
I
clock to the CPU is halted.
Idle mode is entered by setting the IDL bit in the Power
Control Register (PCON.0, see Table 3). The instruction
that sets IDL is the last instruction executed in the normal
operating mode before the Idle mode is activated
Once in Idle mode, the CPU status is preserved along with
the Stack Pointer, Program Counter, Program Status
Word and Accumulator. The RAM and all other registers
maintain their data during Idle mode. The status of the
external pins during Idle mode is shown in Table 4.
1997 Apr 10 16
12.2 Power-down mode
Operation in Power-down mode freezes the oscillator.
The internal connections which link both Idle and
Power-down signals to the clock generation circuit are
shown in Fig.9.
Power-down mode is entered by setting the PD bit in the
Power Control Register (PCON.1, see Table 2).
The instruction that sets PD is the last executed prior to
going into the Power-down mode.
Once in the Power-down mode, the oscillator is stopped.
The contents of the on-chip RAM and the SFRs are
preserved. The port pins output the value held by their
respective SFRs. ALE and
In the Power-down mode, VDD may be reduced to
minimize circuit power consumption. The supply voltage
must not be reduced until the Power-down mode is
entered, and must be restored before the hardware reset
is applied which will free the oscillator. Reset should not be
released until the oscillator has restarted and stabilized.
PSEN are held LOW.
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
12.3 Wake-up from Power-down mode
When in Power-down mode the controller can be
woken-up with either the external interrupts INT2 to INT9,
or a reset operation. The wake-up operation has two basic
approaches as explained in Section 12.3.1; 12.3.2 and
illustrated in Fig.10.
12.3.1 W
If any of the interrupts INT2 to INT9 are enabled, the
device can be woken-up from the Power-down mode with
the external interrupts. To ensure that the oscillator is
stable before the controller restarts, the internal clock will
remain inactive for 1536 oscillator periods. This is
controlled by an on-chip delay counter.
12.3.2 W
To wake-up the P8xCL410, the RST pin must be kept
HIGH for a minimum of 24 periods. The on-chip delay
counter is inactive. The user must ensure that the oscillator
is stable before any operation is attempted.
AKE-UP USING INT2 TO INT9
AKE-UP USING RST
P80CL410; P83CL410
12.4 Power Control Register (PCON)
See Tables 2 and 3. Idle and Power-down modes are
activated by software using this SFR. PCON is not
bit-addressable.
12.5 Status of external pins
The status of the external pins during Idle and Power-down
mode is shown in Table 3. If the Power-down mode is
activated whilst accessing external Program Memory, the
port data that is held in the Special Function Register P2 is
restored to Port 2.
If the data is a logic 1, the port pin is held HIGH during the
Power-down mode by the strong pull-up transistor ‘p1’;
see Fig.8(a).
Table 2 Power Control Register (address 87H)
76543210
−−−−GF1 GF0 PD IDL
Table 3 Description of PCON bits
BIT SYMBOL DESCRIPTION
7, 6, 5, 4 − reserved
3 and 2 GF1 and GF0 General purpose flag bits
1PDPower-down bit; setting this bit activates the Power-down mode
0 IDL Idle mode bit; setting this bit activates the Idle mode
Table 4 Status of external pins during Idle and Power-down modes
MODE MEMORY ALE
Idle internal 1 1 port data port data port data port data port data
external 1 1 floating port data address port data port data
Power-down internal 0 0 port data port data port data port data port data
external 0 0 floating port data port data port data port data
PSEN PORT 0 PORT 1 PORT 2 PORT 3 PORT 4
1997 Apr 10 17
Philips Semiconductors Product specification
Low voltage 8-bit microcontrollers with
2
I
C-bus
book, full pagewidth
OSCILLATOR
PD
P80CL410; P83CL410
XTAL1XTAL2
interrupts
serial ports
CLOCK
GENERATOR
timer blocks
CPU
IDL
MLA563
handbook, full pagewidth
power-down
RST pin
external
interrupt
oscillator
Fig.9 Internal clock control in Idle and Power-down mode.
delay counter
1536 periods
24 periods
MGD679
Fig.10 Wake-up operation.
1997 Apr 10 18
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