The NE/SA/SE5534/5534A are single high-performance low noise
operational amplifiers. Compared to other operational amplifiers,
such as TL083, they show better noise performance, improved
output drive capability, and considerably higher small-signal and
power bandwidths.
This makes the devices especially suitable for application in high
quality and professional audio equipment, in instrumentation and
control circuits and telephone channel amplifiers. The op amps are
internally compensated for gain equal to, or higher than, three. The
frequency response can be optimized with an external
compensation capacitor for various applications (unity gain amplifier,
capacitive load, slew rate, low overshoot, etc.)
FEATURES
•Small-signal bandwidth: 10 MHz
•Output drive capability: 600 Ω, 10V
Ǹ
Hz
•Input noise voltage:
4nV
at VS = ±18 V
RMS
•DC voltage gain: 100000
•AC voltage gain: 6000 at 10 kHz
•Power bandwidth: 200 kHz
•Slew rate: 13 V/µs
•Large supply voltage range: ±3 to ±20 V
PIN CONFIGURATIONS
NE/SA/SE5534/5534A
D, N Packages
BALANCE
INVERTING INPUT
NON-INVERTING
1
2
3
V–
TOP VIEW
Figure 1. Pin Configuration
APPLICATIONS
•Audio equipment
•Instrumentation and control circuits
•Telephone channel amplifiers
•Medical equipment
BALANCE/
8
COMPENSATION
V+
7
OUTPUT
6
COMPENSATION
54
SL00336
ORDERING INFORMATION
DESCRIPTIONTEMPERATURE RANGEORDER CODEDWG #
8-Pin Plastic Small Outline (SO) package0 °C to +70 °CNE5534DSOT96-1
8-Pin Plastic Dual In-Line Package (DIP)0 °C to +70 °CNE5534NSOT97-1
8-Pin Plastic Small Outline (SO) package0 °C to +70 °CNE5534ADSOT96-1
8-Pin Plastic Dual In-Line Package (DIP)0 °C to +70 °CNE5534ANSOT97-1
8-Pin Plastic Dual In-Line Package (DIP)–40 °C to +85 °CSA5534NSOT97-1
8-Pin Plastic Small Outline (SO) package–40 °C to +85 °CSA5534ADSOT96-1
8-Pin Plastic Dual In-Line Package (DIP)–40 °C to +85 °CSA5534ANSOT97-1
8-Pin Plastic Dual In-Line Package (DIP)–55 °C to +125 °CSE5534NSOT97-1
8-Pin Plastic Dual In-Line Package (DIP)–55 °C to +125 °CSE5534ANSOT97-1
1. Diodes protect the inputs against over voltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential
input voltage exceeds 0.6 V . Maximum current should be limited to ±10 mA.
2. For operation at elevated temperature, derate packages based on the following junction-to-ambient thermal resistance:
8-pin plastic DIP 105 °C/W
8-pin plastic SO 160 °C/W
3. Output may be shorted to ground at V
rating is not exceeded.
Supply voltage±22V
Input voltage±V supplyV
Differential input voltage
1
±0.5V
Operating temperature range
NE0 to +70°C
SA–40 to +85°C
SE–55 to +125°C
Storage temperature range–65 to +150°C
Junction temperature150°C
Power dissipation at 25 °C
2
SO8 package750mW
DIP8 package1150mW
Output short-circuit duration
3
Indefinite
Lead soldering temperature (10 sec max)230°C
= ±15 V, T
S
= 25 °C. Temperature and/or supply voltages must be limited to ensure dissipation
amb
DC ELECTRICAL CHARACTERISTICS
T
= 25 °C; VS = ±15 V , unless otherwise specified.
amb
V
OS
Offset voltageOver temperature53mV
∆VOS/∆T55µV/°C
I
OS
Offset currentOver temperature400500nA
∆IOS/∆T200200pA/°C
I
B
Input currentOver temperature20001500nA
∆IB/∆T55nA/°C
I
CC
Supply current4846.5mA
per op ampOver temperature109mA
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[1]
status
Development
Qualification
Production
[2]
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Contact information
For additional information please visit
http://www.semiconductors.philips.com .Fax: +31 40 27 24825
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Definitions
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
This data sheet contains data from the preliminary specification. Supplementary data will be
published at a later date. Philips Semiconductors reserves the right to change the specification
without notice, in order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply.
Changes will be communicated according to the Customer Product/Process Change Notification
(CPCN) procedure SNW-SQ-650A.
Koninklijke Philips Electronics N.V. 2001
All rights reserved. Printed in U.S.A.
Date of release: 12-01
Document order number:9397 750 09179
2001 Aug 03
12
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