DISCRETE SEMICONDUCTORS
DATA SH EET
MTB10010U
NPN microwave power transistor
Product specification
Supersedes data of November 1994
1997 Feb 20
Philips Semiconductors Product specification
NPN microwave power transistor MTB10010U
FEATURES
• Input prematching cell allows an
easier design of circuits
• Diffused emitter ballasting resistors
providing excellent current sharing
and withstanding a high VSWR
• Interdigitated structure provides
high emitter efficiency
• Gold metallization realizes very
good characteristics stability and
excellent lifetime
• Multicell geometry gives good
balance of dissipated power and
low thermal resistance.
APPLICATIONS
Common base class C narrowband
pulsed power amplifiers at 1030 MHz
for IFF applications.
DESCRIPTION
NPN silicon planar epitaxial
microwave transistor with internal
input prematching cell in a SOT440A
metal ceramic package with base
connected to flange.
QUICK REFERENCE DATA
Microwave performance for T
=25°C in a common base class C
mb
narrowband amplifier.
MODE OF
OPERATION
Class C t
CONDITIONS
=1µs;
p
f
V
CC
(MHz)
(V)
1030 24 >9.5 >9.5 >50 see
δ =1%
PINNING - SOT440A
PIN DESCRIPTION
1 collector
2 emitter
3 base connected to flange
handbook, 4 columns
Top view
Marking code: 10010U.
1
3
2
P
L
(W)
MAM131
b
G
PO
(dB)
η
(%)
Zi/Z
C
L
(Ω)
Figs 5
and 6
c
e
Fig.1 Simplified outline and symbol.
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
1997 Feb 20 2
Philips Semiconductors Product specification
NPN microwave power transistor MTB10010U
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
CES
V
EBO
I
C
P
tot
T
stg
T
j
T
sld
Note
1. Up to 0.3 mm from ceramic.
collector-base voltage open emitter − 40 V
collector-emitter voltage open base − 15 V
collector-emitter voltage RBE=0Ω−40 V
emitter-base voltage open collector − 3V
collector current (average) − 0.75 A
total power dissipation Tmb<75°C; tp=1µs; δ =1% − 36 W
storage temperature −65 +200 °C
junction temperature − 200 °C
soldering temperature t ≤ 10 s; note 1 − 235 °C
50
handbook, halfpage
P
tot
(W)
40
30
20
10
0
–50 50
P
= 36W under the nominal pulse conditions.
tot max
0 100 200
150
Fig.2 Power derating curve.
MGA037
Tmb (
o
250
C)
12
handbook, halfpage
P
L
(W)
8
4
0
0
VCC= 24V; tp=1µs; δ =1%; f = 1030 MHz.
0.5
12
1.5
Fig.3 Load power as a function of input power.
MGA038
Pi (W)
1997 Feb 20 3
Philips Semiconductors Product specification
NPN microwave power transistor MTB10010U
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MAX. UNIT
R
th j-mb
R
th mb-h
Z
th j-mb
Note
1. See “
CHARACTERISTICS
=25°C unless otherwise specified.
T
mb
SYMBOL PARAMETER CONDITIONS MAX. UNIT
I
CBO
I
CES
I
EBO
thermal resistance from junction to mounting base Tj= 100 °C 10.5 K/W
thermal resistance from mounting base to heatsink note 1 0.7 K/W
thermal impedance from junction to mounting base tp=1µs; δ = 1%;
2.5 K/W
note 1
Mounting recommendations in the General part of handbook SC19a”
.
collector cut-off current VCB=30V; IE=0 45 µA
collector cut-off current VCE=30V; RBE= 0 300 µA
emitter cut-off current VEB= 1.5 V; IC = 0 4.5 µA
APPLICATION INFORMATION
Microwave performance up to T
=25°C and working in pulsed conditions in a narrowband test circuit as shown in
mb
Fig.4.
MODE OF
OPERATION
Class C t
CONDITIONS
=1µs; δ = 1 % 1030 24 >9.5;
p
f
(MHz)
V
CC
(V)
typ. 11
P
(W)
L
G
po
(dB)
>9.5;
typ. 10
η
C
(%)
>50;
typ. 55
Zi/Z
L
(Ω)
see Figs 5 and 6
List of components (see Fig.4)
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE NO.
L1 0.4 mm diameter copper wire − rectangular loop −
C1 tuning capacitor 0.5 − 5pF − Tekelec 5855
C2 chip capacitor 3 pF − Eurofarad CEC 23
C3 chip capacitor 10 pF − Eurofarad CEC 23
C4 chip capacitor 47 pF − Eurofarad CEC 23
C5 tantalum capacitor 10 µF, 50 V −−
C6 feedthrough bypass capacitor −− Erie 1250-003
C7 capacitor 220µF, 63 V −−
1997 Feb 20 4