Philips MBD-3000 Service Manual

Blue-Ray Disc Player

MBD3000/12/93

Contents

Page

1 Technical Specification and Connection Facilities

.............................................................1-1 to 1-2

2 Laser Beam Safety Precautions................................. 2-1

3 Important Safety Precautions .................................... 3-1 to 3-2

4 Safety Check After Servicing .................................... 4-1

5 Safety Information General Notes & Lead Free

Requirement ...................................... 5-1

6 Standard Notes For Servicing，Lead Free

Requirements & Handling Flat Pack Ic...................... 6-1 to 6-4

7 Direction of Use ........................................................ 7-1 to 7-9

8 Cabinet Disassembly Instructions ............................ 8-1 to 8-2

9 Troubleshooting ..................................................... 9-1

10 Software Version Check &Upgrad......................... 10-1 to 10-2

11 Block Diagram ....................................................... 11-1

12 Wiring Diagram ...................................................... 12-1

13 USB and Headphone Board

Circuit Diagram ................................ 13-1

Layout Diagram ............................... 13-1

Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.

Contents

Page

14 AMP And MCU Board

Circuit Diagram ................................. 13-2

Layout Diagram ................................ 13-3

15 VFD Display Board

Circuit Diagram .................................. 13-4

Layout Diagram ................................. 13-5

16 Decoder Board

Circuit Diagram ................................ 13-6 to 13-17

Layout Diagram ................................13-18

17 Power Board

Circuit Diagram ............................... 13-19

Layout Diagram .............................. 13-20

18 Exploded View ...................................................... 14-1

19 Revision List ......................................................... 15-1

VERSION VARIATION

Board in used:

DISPLAY BOARD

USB BOARD HEDAPHONE BOARD BLURAY MAIN BOARD POWER BOARD

MCU BOARD

Features

RDS VOLTAGE SELECTOR ECO STANDBY

DTS

* TIPS : C -- Component Lever Repair.

Type /Versions:

Service policy

Type /Versions:

Feature diffrence

M -- Module Lever Repair

√

-- Used

/12

C C C M

M M

12/

√

MBD3000

/93

/73

/98

C C

/73

/93

/98

√

Published by LX-KM 1036 AVM Printed in the Netherlands

Version 1.1

Subject to modi cation EN

3141 785 35441

Technical Specification and Connection Facilities

1. Technical Specification and Connection Facilities

1.1 PCB Locations

Headphone Board

Power Board

VFD Display Board

USB Board

MCU and AMP Board

1.2 General

Power supply : 110-240V, 50Hz~60Hz Power consumption : 50W

Standby power consumption : < 0.5 W

1.3 Radio

Tuning range : 87.5~108MHz Signal to noise ration : >55dB

Search selectivity : > 28dBf Tuning Grid : 50KHz Distortion : <1%

1.4 Connectivity

Audio Performance

HUM : 150nW

Acoustical noise/hum : 26dB

MP3_link(front)

Digital Audio Outputs

LPCM MPEG 1, MPEG 2, AC3 ：according IEC 61937 DTS ：according IEC 61937 +

according IEC 60958-3

addendum

Decoder Board

Coaxial

DC Output voltage : < 0.05V

Video Supporting Format

Signal system :PAL/NTSC HDMI output :480p,576p,720p,1080i,

1080p,1080p24

Video output :480/576i,480/576p,

720p,1080i

CVBS Output Component

Chroma / Luminunce Delay(2T pulse) ：

Video Output Component

1-1

Technical Speci¿cations and Connection Facilities

USB

Compatibility ：USB2.0 Type of connector : Series A Connector

Class support : UMS(USB Mass Storage Class) File System : FAT12,FAT16,FAT32

HDMI Output

Compatibility : HDMI Version 1.4 Type of connector : Type A Connector(19pins)

1.5 Dimension and Weight

Set Dimension WxHxD : 277x98x247(mm) Net Weight : 2.5kg Speakers Dimension WxHxD : 160x255x231(mm) Net Weight : 3.5kg

1.6 Laser Output Power & Wavelength

Output power : 20mW

Wavelength : 405 +5nm/-5nm

DVD

Output power : 7mW

Wavelength : 650 +5nm/-10nm

Output power :7mW Wavelength :790 +10nm/-20nm

1.7 Playability

Video Playback

1. Playback Media: CD-R/CD-RW, DVD+R/+RW, DVD-R/-RW, DVD-Video, Video CD/SVCD, DVD+R DL, DVD-R

'/86%ÀDVKGULYH

2. Compression Formats: MPEG2, MPEG1, DivX 3.11, DivX

4.x, DivX 5.x, DivX 6.0, MPEG4

Audio Playback

1. Playback Media: Audio CD, CD-R/RW, DVD+R DL, DVD+R/+RW, DVD-R/-RW, MP3-

&'03'9'86%ÀDVKGULYH

WMA-CD

2. Compression Format: Dolby Digital, MP3, MPEG2 Multichannel, PCM, WMA

3. MPEG1 bit rates: 64-384 kbps and VBR

Still Picture Playback

1. Playback Media: CD-R/RW, DVD+R DL, DVD+R/+RW, DVDR/-RW, Picture CD, USB Digital

&DPHUD37386%ÀDVKGULYH

2. Picture Compression Format: JPEG, JPEG digital camera photos

3. Picture enhancement: Slideshow with MP3 playback, Create albums, Rotate, Slideshow with music playback, Zoom

1-2

Laser Beam Safety Precautions

This Blu-Ray player uses a pickup that emits a laser beam.

Do not look directly at the laser beam coming from the pickup or allow it to strike against your skin.

The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser beam.

CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in hazardous radiation exposure.

Drive Mechanism Assembly

Laser Beam Radiation

Laser Pickup

Turntable

Location: Inside Top of Blu-Ray mechanism.

2-1

Important Safety Precautions

Important

Read and understand all instructions before you use your home theater. If damage is caused by failure to follow instructions, the warranty does not apply.

Safety

Riskof electricshockor ¿re!



Neverexposetheproductand accessoriestorainorwater.Neverplace liquid containers, such as vases, near the product.Ifliquidsarespiltonorintothe product, disconnect it from the power outlet immediately. Contact Philips Consumer Care to have the product checkedbeforeuse. Neverplacetheproductandaccessories



near naked Àames or other heat sources, including direct sunlight. Neverinsertobjectsintotheventilation



slots

orotheropeningsontheproduct.



Wherethemainsplugoranappliance couplerisusedasthedisconnectdevice, thedisconnectdeviceshallremainreadily operable. Disconnect the product from the power



outlet before lightning storms.



Whenyoudisconnectthepowercord, always pull the plug, never the cable.

Riskof short circuit or ¿re!

Before you connect the product to the



poweroutlet,ensurethatthepower voltagematchesthevalueprintedonthe back or bottom of the product. Never connec

ttheproducttothepoweroutlet

if the voltage is different.

Risk of injury or damage to the home theater!

For wall-mountable products, use only



the supplied wall mount bracket. Secure the wall mount to a wall that can support the combined weight of the product and the wall mount. Koninklijke Philips

Electronics N.V. bears no responsibility forimproperwallmountingthatresultsin accident,injuryordamage.



For speakers with stands, use only the supplied stands. Secure the stands to thespeakerstightly.Placetheassembled stands on ÀDt,levelsurfacesthatcan support the combined weight of the speaker and stand.

Neverplacetheproductoranyobjects



on power cords or on other electrical equipment. If the product is transported in



temperatures below 5°C, unpack the product and wait u

matches room temperature before connecting it to the power outlet.



Visible and invisible laser radiation when open. Avoid exposure to beam.



Do not touch the disc optical lens inside

thedisccompartment.

Risk of overheating!

Never install this product in a con¿ned



space. Always leave a space of at least four inches around the product for ventilation.Ensurecurtainsorother objectsnevercovertheventilationslots on the product.

Risk of contamination!

Do not mix batteries (old and new or



carbon and alkaline,



Remove batteries if they are exhausted oriftheremotecontrolisnottobeused for a long time.



Batteries contain chemical substances, they should be disposed of properly.

ntil its temperature

etc.).

Product care



Donotinsertanyobjectsotherthandiscs intothedisccompartment.



Donotinsertwarpedorcrackeddiscs intothedisccompartment.



Remove discs from the disc compartment ifyouarenotusingtheproductforan extended period of time.

Only use microfiber cloth to clean the



product.

3-1

Important Safety Precautions

Disposal of your old product and batteries

Yourproductisdesignedandmanufactured with high quality materials and components, which can be recycled and reused.

When this crossed-out wheeled bin symbol is attached to a product it means that the productiscovered by theEuropeanDirective 2002/96/EC.Pleaseinformyourselfaboutthe local separate collection system for electrical and electronic products. Please act according to your local rules and donotdispose of youroldproductswithyour normal household waste. Corr

ect disposal of your old product helps to preventpotentialnegativeconsequencesfor the environment and human health.

Your product contains batteries covered by theEuropeanDirective2006/66/EC,which cannotbedisposedwithnormalhousehold waste. Please inform yourself about the local rules on separate collection of batteries because correctdisposalhelpstopreventnegative consequences for the environmental and human health.

User manual CD

To read the complete user manual, which includes information on advanced features, use the CD supplied with your home theater. For a printed copy of the complete user manual, contact Philips Consumer Care in your country.

To access the user manual

Caution

TheusermanualCDisforPCorMaconly.Do



notinserttheusermanualCDintothedisc compartment of the home theater.

Requirements:



A PC (Microsoft Windows compatible)orMac(OSX)with CD-ROM Adobe Reader



1 InserttheusermanualCDintotheCD-

ROMtray of thePCorMac.

2 Close the CD-ROM tray.

The user manual screen appears. If the

user manual screen does not appear, skip Step 3 and navigate to the ‘pdf ’ folder in the CD-ROM, double-clicking the PDF of your choice.

3 Click a user manual language.

Acrobat Reader launches, displaying the complete user manual in the language of your choice.

3-2

Safety Check after Servicing

Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts, and wires have been returned to their original positions. Afterwards, do the following tests and confirm the specified values to verify compliance with safety standards.

1. Clearance Distance

When replacing primary circuit components, confirm specified clearance distance (d) and (d’) between soldered terminals, and between term surrounding metallic parts. (See Fig. 1)

Table 1: Ratings for selected area

inals and

Chassis or Secondary Conductor

Primary Circuit

AC Line Voltage Clearance Distance (d), (d

110V~220V  3.2 mm (0.126 inches)

Note: This table is unofficial and for reference only. Be

sure to confirm the precise values.

’)

2. Leakage Current Test

Confirm the specified (or lower) leakage current between B (earth ground, power cord plug prongs) and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and output terminals, microphone jacks, earphone jacks, etc.) is

than or equal to the specified value in the table

lower below.

Measuring Method (Power ON):

Insert load Z between B (earth ground, power cord plug prongs) and exposed accessible parts. Use an AC voltmeter to measure across the terminals of load Z. See Fig. 2 and the following table.

d' d

Fig. 1

Exposed Accessible Part

AC Voltmeter (High Impedance)

Earth Ground

Power Cord Plug Prongs

Table 2: Leakage current ratings for selected areas

AC Line Voltage Load Z Leakage Current (i) Earth Ground (B) to:

110V~220V

Note: This table is unofficial and for reference only. Be sure to confirm the precise values.

0.15 μF CAP. & 1.5 k RES. Connected in parallel

i  0.5 mA Peak Exposed accessible parts

4-1

Fig. 2

Safety Information, General Notes & Lead Free Requirements

1 Safety Instructions

1.1 General Safety

Safety regulations require that during a repair:

 Connect the unit to the mains via an isolation transformer.  Replace safety components, indicated by the symbol

only by components identical to the original ones. Any other component substitution (other than original type)

PD\LQFUHDVHULVNRI¿UHRUHOHFWULFDOVKRFNKD]DUG

Safety regulations require that after a repair, you must return the unit in its original condition. Pay, in particular, attention to the following points:

 Route the wires/cables correctlyDQG¿[WKHPZLWKWKH

mounted cable clamps.

 &KHFNWKHLQVXODWLRQRIWKHPDLQVOHDGIRUH[WHUQDO

damage.

 Check the electrical DC resistance between the mains

plug and the secondary side:

1. Unplug the mains cord, and connect a wire between the two pins of the mains plug.

2. Set the mains switch to the ‘on’ position (keep the mains cord unplugged!).

3. Measure the resistance value between the mains plug and the front panel, controls, and chassis bottom.

4. Repair or correct unit when the resistance

PHDVXUHPHQWLVOHVVWKDQ0ȍ

5. Verify this, before you return the unit to the customer/ user (ref. UL-standard no. 1492).

6. Switch the unit ‘off’, and remove the wire between the two pins of the mains plug.

1.2 Laser Safety

This unit employs a laser2QO\TXDOL¿HGVHUYLFHSHUVRQQHO may remove the cover, or attempt to service this device (due to possible eye injury).

2 Warnings

2.1 General

2.2 Laser

 All ICs and many other semiconductors are susceptible to

electrostatic discharges (ESD,

). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are at the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential. Available ESD protection equipment: – Complete kit ESD3 (small tablemat, wristband,

FRQQHFWLRQER[H[WHQVLRQFDEOHDQGHDUWKFDEOH

4822 310 10671.

– Wristband tester 4822 344 13999.

 Be careful during measurements in the live voltage

section. The primary side of the power supply, including the heatsink, carries live mains voltage when you connect the player to the mains (even when the player is ‘off’!). It is possible to touch copper tracks and/ or components in this unshielded primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A ‘lightning stroke’ and a stripe-marked printing on the printed wiring board, indicate the primary side of the power supply.

 Never replace modules, or components, while the unit is

‘on’.

 The use of optical instruments with this product, will

LQFUHDVHH\HKD]DUG

 Only quali¿ed service personnel may remove the cover or

attempt to service this device, due to possible eye injury.

 Repair handling should take place as much as possible

with a disc loaded inside the player.

 TH[WEHORZLVSODFHGLQVLGHWKHXQLWRQWKHODVHUFRYHU

shield:

Laser Device Unit

epyT

:AIGalnN(BD)

:AIGalnP(DVD) : AIGalnP(CD)

Wavelength : 650 nm (DVD)

)DC/DCV(mn087:

405nm(BD):

Output Power : 20 mW

)gnitirwWR+DVD(

Wm8.0:

)gnidaerDVD(

Wm3.0:

daerDC/DCV(

Beam divergence : 60 degree

CLASS 1

LASER PRODUCT

1-2erugiF

Note: Use of controls or adjustments or performance of procedure other than those speci¿ed herein, may result in KD]DUGRXVUDGLDWLRQH[SRVXUH AYRLGGLUHFWH[SRVXUHWREHDP

CAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPENAVOID EXPOSURE TO BEAM ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING VED ÅBNING UNDGÅ UDSÆTTELSE FOR STRÅLING ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES UNNGÅ EKSPONERING FOR STRÅLEN VARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA EJ STRÅLEN VARO!AVATTAESSA OLET ALTTIINA NÄKYVÄLLE JA NÄKYMÄTTÖMÄLLE LASER SÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN VORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEÖFFNETNICHT DEM STRAHL AUSSETSEN DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPENAVOID DIRECT EXPOSURE TO BEAM ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU

Figure 2-2

5-1

Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC

Circuit Board Indications

1. The output pin of the 3 pin Regulator ICs is indicated as shown.

Top View

Out

2. For other ICs, pin 1 and every fifth pin are indicated as shown.

Pin 1

3. The 1st pin of every male connector is indicated as shown.

Pin 1

Input

Bottom View

Instructions for Connectors

1. When you connect or disconnect the FFC (Flexible Foil Connector) cable, be sure to first disconnect the AC cord.

2. FFC (Flexible Foil Connector) cable should be inserted parallel into the connector, not at an angle.

FFC Cable

Connector

CBA

* Be careful to avoid a short circuit.

Pb (Lead) Free Solder

When soldering, be sure to use the Pb free solder.

Information about lead-free soldering

Philips CE is producing lead-free sets from 1.1.2005 onwards.

IDENTIFICATION

Regardless of special logo (not always indicated)

One must treat all sets from onwards, according to the next rule: Serial Number gives a 14-digit. Digit 5&6 shows the YEAR, and digit 7&8 shows the WEEK.

So from onwards=from 1 Jan 2005 onwards

0501

Important note :Infactalsoproductsofyear2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.

Due to lead-free technology some rules have to be respected by the workshop during a repair:

 Use only lead-free solder alloy Philips SAC305 with

order code 0622 149 00106. If lead-free solderpaste is required, please contact the manufacturer of your sol paste within workshops should be avoided because paste is not easy to store and to handle.

 Use only adequate solder tools applicable for lead-

free solder alloy. The solder tool must be able

 To reach at least a solder-temperature of 400°C,  To stabilize the adjusted temperature at the solder-

tip

 To exchange solder-tips for different applications.

 Adjust your solder tool so that a temperature around

360°C solder joint. Heating-time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat.

 Mix of lead-free solder alloy / parts with leaded

solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305).

 Use only original spare-parts listed in the Service-

Manuals. Not listed standard-material (commodities) has to be purchased at external companies.

der-equipment. In general use of solder-

- 380°C is reached and stabilized at the

and lead-free).

1 Jan 2005

6-1

Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC

 Special information for BGA-ICs:

- always use the 12nc-recognizable soldering temperature profile of the specific BGA (for desoldering always use the lead-free temperature profile, in case of doubt)

- lead free BGA-ICs will be delivered in so-called 'dry-packaging' (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensit will be communicated via AYS-website. Do not re-use BGAs at all.

 For sets produced before 1.1.2005 (except products

of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes.

 On our website

www.atyourservice.ce.Philips.com information to:

 BGA-de-/soldering (+ baking instructions)  Heating-profiles of BGAs and other ICs used in

Philips-sets

You will find this and more technical information within the “magazine”, chapter “workshop news”.

For additional questions please contact your local repair-helpdesk.

ivity Level). This

you find more

How to Remove / Install Flat Pack-IC

1. Removal

With Hot-Air Flat Pack-IC Desoldering Machine:

1. Prepare the hot-air flat pack-IC desoldering machine, then apply hot a (about 5 to 6 seconds). (Fig. S-1-1)

2. Remove the flat pack-IC with tweezers while applying the hot air.

3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)

4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)

ir to the Flat Pack-IC

Fig. S-1-1

CAUTION:

1. The Flat Pack-IC shape may differ by models. Use an appr machine, whose shape matches that of the Flat Pack-IC.

2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)

opriate hot-air flat pack-IC desoldering

6-2

Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC

3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.

Hot-air Flat Pack-IC Desoldering

CBA

Masking Tape

Tweezers

With Soldering Iron:

1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)

Flat Pack-IC

Desoldering Braid

Machine

Flat Pack-IC

Fig. S-1-2

4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)

With Iron Wire:

1. Using desoldering braid, remove all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)

2. Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5.

3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5.

4. Bottom of the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)

5. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)

Note: When using a soldering iron, care must be

taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be dama

flat pack-IC is fixed with glue to the

the solder from

ged if force is applied.

Soldering Iron

Fig. S-1-3

2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to whic not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)

Fine Tip Soldering Iron

h solder will

Sharp Pin

Fig. S-1-4

6-3

To Solid Mounting Point

CBA

Tweezers

Hot Air Blower

Iron Wire

Soldering Iron

Fig. S-1-5

Fine Tip Soldering Iron

Flat Pack-IC

Fig. S-1-6

Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC

2. Installation

1. Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily.

2. The “ (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.)

3. Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges.

” mark on the flat pack-IC indicates pin 1.

Example :

Pin 1 of the Flat Pack-IC is indicated by a " " mark.

Fig. S-1-7

Instructions for Handling Semiconductors

Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic c

1. Ground for Human Body

Be sure to wear a grounding band (1 M) that is properly grounded to remove any static electricity that may be charged on the body.

2. Ground for Workbench

Be sure to place a conductive sheet or copper plate with proper grounding (1 M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body grounding band, be with your clothing.

harge during unpacking or repair work.

careful to avoid contacting semi-conductors

CBA

Presolder

Flat Pack-IC

Fig. S-1-8

1M

CBA

Grounding Band

1M

CBA

Conductive Sheet or Copper Plate

6-4

Direction of Use

*The following excerpt of the DFU/QSG serves as an introduction to the set.

The Complete Direction for Use can be download in different languages from the internet site of Philips Customer care Center : www.Support.philips.com

Product overview

Main unit

Disc compartment

STANDBY-ON

Turn on this productorswitchtothe EcoPowerstandbymode.

SRC

Select a source.

Skip to the previous/next track. Skiptotheprevious/nexttitleor chapter. Tune to a radio station.

Start or pause play.

Stop play. Erase a program.

Headphone socket.

MP3 LINK

Connect to an external audio device.

VOLUME

Adjust volume. Adjust time.

IR sensor

Detect signals from the remote control. Always point the remote controlattheIRsensor.

Open or close the disc compartment.

Display panel

7-1

Remote control