Copyright 2003 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.
Published by LM 0369 Service PaCEPrinted in the NetherlandsSubject to modificationEN 3122 785 12511
EN 2LCD1.15E1.
Technical Specifications, Connections and Chassis Overview
1.Technical Specifications, Connections and Chassis Overview
1.1Technical Specifications
1.1.1Reception
Tuning system: PLL
Colour systems: PAL B/G,
: PAL D/K,
: PAL I
: SECAM B/G,
: SECAM D/K,
: SECAM L,
: SECAM L1,
: NTSC Play Back
Ambient temperature: +5 to +40 deg. C
Relative humidity: 10% to 80% R.H.
Weight: 5 kg
Dimension (WxHxD): 315x44x51 m
Safety Instructions, Warnings, and Notes
2. Safety Instructions, Warnings, and Notes
EN 3LCD1.15E2.
2.1Safety Instructions
•Always connect the TV set via an Insulation transformer.
Use a transformer of adequate power to protect the
technician from injury by electrical shocks. It will also
protect the TV set and it's components from being
damaged by accidental shorts of the circuitry, which may
be occurred during the service operation.
•Replace safety components, indicated by the symbol i in
the Schematic diagram and Replacement parts list, only by
the identical components to the original ones. Any other
component substitution (other than original type) may
increase risk of fire or electrical shock hazard.
•If any fuse (or Fusible resistor) in this TV set is blown,
replace it as specified.
•While replacing a high wattage resistor (Oxide Metal Film
Resistor, over 1 W), keep the resistor 10 mm away from
PCB.
•Keep wires away from high voltage or high temperature
parts.
2.1.1AC Leakage Current Check
Before returning the TV set to the customer, always perform an
AC leakage current check on the exposed metallic parts of
the cabinet, such as antennas, terminals, etc., to be sure the
set is safe to operate without damage by electrical shock.
Leakage Current Cold Check (Antenna Cold Check)
1. Unplug the AC cord, and connect an electrical jumper
between the two plug prongs of the AC cord.
2. Turn “on” the AC power switch (keep the AC cord
unplugged!).
3. Measure the resistance value between the plug prongs of
the AC cord and the metal shielding of the tuner or the
aerial connection of the TV set. The measured resistance
should be between 1 Mohm and 5.2 Mohm. When the
metal shielding has no return path to the chassis, the
measured resistance must be infinite.
4. Switch the TV set “off’” and remove the electrical jumper
between the two plug prongs of the AC cord.
5. Check the cabinet for defects, to prevent the possibility of
the customer touching any internal parts.
Leakage Current Hot Check
1. Plug the AC cord directly into the AC outlet.
2. Connect 1.5 kohm/10 W resistor in parallel with a 0.15 uF
capacitor between a good known earth ground (Water
Pipe, Conduit, etc.) and the exposed metallic parts.
3. Measure the AC voltage across the resistor, using the AC
voltmeter with 1000 ohm/V or higher sensitivity.
4. Plug again the AC cord into the AC outlet and repeat AC
voltage measurements for each exposed metallic part. Any
voltage measured must not exceed 0.75 V_rms, which
corresponds to 0.5 mA.
5. If any measurement is out of the specified limits, there is a
possibility of a shock hazard, and the set must be checked
and repaired before returning to the customer.
2.2Warnings:
Before servicing TV sets, covered by this service manual and
its supplements and addenda, read and follow the Safety
Instructions of this manual.
Note: If unforeseen circumstances create conflict between the
following Servicing Precautions and any of the Safety
Instructions of this manual, always follow the Safety
Instructions. Remember: Safety First.
2.2.1General Servicing Precautions
1. Always unplug the TV set AC power cord from the AC
power source before:
1. Removing or reinstalling any component, circuit board
module, or any other receiver assembly;
2. Disconnecting or reconnecting any TV set electrical
plug or other electrical connection;
3. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
Caution: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result to an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device
(DVM, FETVOM, etc), equipped with a suitable high
voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this TV set or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to
the contacts with a pipe cleaner, cotton-tipped stick or
comparable nonabrasive applicator; 10% (by volume)
Acetone and 90% (by volume) Isopropyl alcohol (90%-99%
strength).
Caution: This is a flammable mixture.
5. Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks, with
which the TV sets might be equipped.
7. Do not apply AC power to this TV set and/or any of its
electrical assemblies, unless all solid-state device heat
sinks are correctly installed.
8. Always connect the test TV set ground lead to the TV set
chassis ground before connecting the test TV set positive
lead.
9. Always remove the test TV set ground lead last.
10. Use with this TV set only the test fixtures, specified in this
service manual.
Figure 2-1 Leakage current hot check circuit
Note: Do not use a line Insulation transformer during this
check.
Caution: Do not connect the test fixture ground strap to any
heat sink in this TV set.
EN 4LCD1.15E2.
Safety Instructions, Warnings, and Notes
2.2.2Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged
easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of
typical ES devices are integrated circuits and some field-effect
transistors and semiconductor "chip" components. The
following techniques should be used to help to reduce the
incidence of component damage, caused by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known
earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly, equipped with ES
devices, place the assembly on a conductive surface, such
as aluminium foil, to prevent electrostatic charge build-up
or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some
solder removal devices, not classified as "anti-static", can
generate electrical charges, sufficient to damage ES
devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges, sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package, until immediately before you are ready to install
it. (Most replacement ES devices are packed r with leads
electrically shorted together by conductive foam,
aluminium foil or comparable conductive material).
7. Immediately before removing the protective material from
the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly, into which the
device will be installed.
Caution: Be sure no power is applied to the chassis or
circuit, and observe all other safety precautions.
8. Minimize bodily motions, when handling unpackaged
replacement ES devices. (Otherwise harmless motion,
such as the brunching together of your clothes fabric or the
lifting of your foot from a carpeted floor, can generate static
electricity, sufficient to damage an ES device).
2.2.3General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape, that will maintain tip
temperature within the range of 500 deg. F to 600 deg. F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a small
wire-bristle brush (0.5 inch or 1.25cm) with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique:
1. Allow the soldering iron tip to reach normal
temperature (500 deg. F to 600 deg. F).
2. Heat the component lead until the solder melts.
3. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder braid.
Caution: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique:
1. Allow the soldering iron tip to reach the normal
temperature (500 deg. F to 600 deg. F).
2. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
3. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold
there only until the solder flows onto and around of the
both of the component lead and the printed circuit foil.
Caution: Work quickly to avoid overheating the circuit
board printed foil.
4. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
2.3Maintenance Instructions
2.3.1 IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong),
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type, the
following technique should be used to remove and replace the
IC.
Removal
1. Desolder and straighten each IC lead in one operation, by
gently prying up the lead with the soldering iron tip, as the
solder melts.
2. Draw away the melted solder with an anti-static suction
type solder removal device (or with solder braid) before
removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush. It
is not necessary to reapply acrylic coating to the areas.
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads,
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads, extending from the circuit board, and
crimp the "U" with long nose pliers to insure metal to metal
contact. Then solder each connection.
2.3.3 Power Output, Transistor Device Removal/ Replacement
1. Heat and remove all solder all around from the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert a new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace the heat sink.
2.3.4 Diode Removal/ Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints
of the two "original" leads. If they are not shiny, reheat them
and, if necessary, apply additional solder.
2.3.5 Fuse and Conventional Resistor Removal/ Replacement
1. Clip each fuse or resistor lead at the top of the circuit board
hollow stake.
Safety Instructions, Warnings, and Notes
EN 5LCD1.15E2.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
Caution: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
2.3.6Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board, causing the foil to separate from or "lift-off" the board.
The following guidelines and procedures should be followed
whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections, use the
following procedure to install a jumper wire on the copper
pattern side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely
necessary).
2. Carefully scratch away the solder resist and acrylic coating
(if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire
and carefully crimp it around the IC pin. Solder the IC
connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped end
of the good copper pattern. Solder the overlapped area and
clip off any excess jumper wire.
2.4Notes
2.4.1Schematic Notes
•All resistor values are in ohms and the value multiplier is
often used to indicate the decimal point location (e.g. 2K2
indicates 2.2 kohm).
•Resistor values with no multiplier may be indicated with
either an "E" or an "R" (e.g. 220E or 220R indicates 220
ohm).
•All capacitor values are expressed in micro-farads (µ= x
10^-6), nano-farads (n= x 10^-9), or pico-farads (p= x 10^-
12).
•Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
•An "asterisk" (*) indicates component usage varies. Refer
to the diversity tables for the correct values.
•The correct component values are listed in the Electrical
Replacement Parts List. Therefore, always check this list
when there is any doubt.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections, other than IC Pins. This technique
involves the installation of a jumper wire on the component side
of the circuit board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of
the nearest component on one side of the pattern break to
the lead of the nearest component on the other side.
4. Carefully crimp and solder the connections.
Caution: Be sure the insulated jumper wire is dressed so it
does not touch components or sharp edges.
EN 6LCD1.15E3.
B
M
a
AUTO
AUTO
w
Y-Z
C
h
fg
c
b
e
k
Ò
‡
π
®
†
U
D
1
2
9
3
6
5
7
4
8
0
0
LIST
MENU
OK
P
¬
V
V Volum e
Press + or - to adjust the
vo lum e.
¬ Mute
Tem porarily interrupt the
sound or restore it.
P Programme selection
•to brow se through the TV
channels which are no t
skipped
•to sw itch the TV on fro m
standb y.
®Ò‡π† Video
reco rd er keys
U Time disp lay
The time,downloaded fro m the
TV channel (with teletext
broadcast) stored on
programme num ber 1 or the
low est not sk ipped programme
num ber,is displayed on the
screen.
0/9Digit keys
To select a TV channel.
0 Previous programme
To disp lay the previously
selectedTV channel.
LIST
Programme list
To disp lay the programme list.
b Teletext on/off
Teletext functions
hUfgcek
D
Sleep timer
With this key you can set a
time period after which the
TV sho uld sw itch itself to
standb y.
Press the key rep e atedly to
select the num ber of minutes.
The counter runs fro m B 0,
10,20,30...to 240 minutes.
The timer begins to count
dow n fro m the num ber of
minutes selected.
Note:To view the rem aining time,
pre ss the
D
key once.To can cel
the sleep time,repeatedly press
the
D
key until B 0 appears.
MENU
Press rep e a tedly to
display each menu.
O K Press this key to activate
yo ur cho ice,w hen in the menus.
3. Directions for Use
Directions for Use
picture
keys
AUTO
a
and sound se ttings.
To select predefined picture
AUTO
standb y or off to standb y.
Sw itche s the TV on fro m
B Standby
D
B
M
AUTO
a
AUTO
w
Y-Z
selected,corresponding with
different picture se tting is
Each time it is pre ssed,a
9
3
6
LIST
2
8
5
0
0
7
4
1
sound
AUTO
Contrast,Brigh tne ss,C o lour
and Sharpness.
M
spe c ific factory settings of
OK
MENU
different sound se tting is
Each time it is pre ssed,a
P
¬
V
refers to the personal
in the picture and sound menu.
and sound se lected an d stored
preference se ttings of picture
treb le an d bass.
selected,corresponding with
spe c ific factory settings of
Perso nal
π
k
b
‡
e
fg
C
h
Ò
c
U
†
®
DESCRIPTION OF CONTROLS
AV1,AV2,S-VIDEO
,
TV
Source
peripherals:p re ss rep e atedly to
select
Select you r com puter or other
w
monitor mode.
PC
or
X Bilingual cho ice an d
to
Nicam
Stereo
to
sound in case of
Mono
Nicam Stereo
stereo tran sm ission,or fro m
• to sw itch fro m
Press this key
sound mode selection
,in case of digital
Mono
tran sm ission
lY,
Dua
Z or
Nicam Dual
• to sw itch fro m
X in case
X in case of
Dual
Z or
Nicam Dual
Y to
Nicam Dual
Y se nd s the primary
of bilingual tran sm ission:
Dual
Dual
Nicam Dual tran sm ission
broadcast language to the
• to choose betw een
Z se nd s the seco n d ar y
loudspeakers;
Dual
loudspeakers;
broadcast language to the
X se nd s a se p ara te
Dual
lan guage to each loudspeaker.
Nica m stereo transm ission,select
sound sign als,w ith stereo or
Note:in case of weak stereo
fro m the aud io R input to the righ t loudspeaker
•R+R:the audio sign al fro m the au d io R input is se nt to the left and right loudspeakers.
•L+L:the audio sign al fro m the au d io L input is sent to the left an d righ t loudspeakers
•L+R:the audio signal fro m the au d io L input is sent to the left loudspeaker,the au dio signal
Press the X ke y rep e atedly to select:
Sound output se lection in AV mode
mono reception.
In AV mode,you can select the output sound for the left and right loudspeakers.
Directions for Use
EN 7LCD1.15E3.
Personal Notes:
ON/OFF
B
+
CH/PR
_
+
VOL
_
OK
TV/VIDEO MENU
monitor mode
PC
or
AV
,
TV
key to sw itch the TV on or off
ON/OFF
:P ress the power
in fro nt of the TV.
Sho uld your rem o te co n trol be lost or bro ken yo u can still operate yourTV with the keys
ON/OFF
:Keep the OK key p re ssed for abo u t 10 sec o n d s.
:P ress rep e atedly to select
Auto dem onstration
All the menus are being disp layed autom atically one after the other.
To stop Auto dem o nstratio n ,p re ss any key on the fro n t panel.
-
:P ress rep e atedly to display each menu
TV/VIDEO
MENU
OK: - P re ss this key to activate yo u r choice when in the menu
:- P ress - or + to brow se through the TV channels which are not sk ipped;
- Pre ss - or + to adjust the menu settings.
- Pre ss - or + to adjust the vo lum e;
:- P ress - or + to select a menu item ;
-V O L +
- CH /PR +
sw itch ed on.
-To sw itch the TV on fro m standb y.
- Pre ss - or + to select a menu item ;
TheB indicator ligh ts up brigh tly when the TV is in standby,dims when the TV is
B:Switches the TV on fro m stan db y or off to standb y.
EN 8LCD1.15E4.
Mechanical Instructions
4.Mechanical Instructions
Notes:
•To gain access to the boards of the TV set, after removing
the cover cup, unstick carefully supportive stickers.
•Place the stickers aside, adhesive side upwards.
•When you re-assemble the TV set, don’t forget to put the
stickers back.
•If the stickers are not adhesive anymore, you can order
them by ordering number 3104 301 24501
Service Modes, Error Codes, and Fault Finding
5.Service Modes, Error Codes, and Fault Finding
5.1General Features
Table 5-1 General Features
No. SymptomCauseCheck Point
1Soft touch doesn't
function properly
2Soft touch doesn't
function
3No screenInput error of inverter connector 1) Bend the pin legs of P801 connector -> recheck them
4Dark screen1) Defective LCD lamp
5Defective OSD display Defective the IC508Check and replace the IC508
Defective speaker wire and inverter wire
1) Broken components and soldering of them
2) P101 connector error
P502 and Pin 21 connector being
slipped out
Cracked components and soldering at tuner board
2) Defective inverter
3) Input error of inverter connector
1) Make some space between the speaker wire and the Soft touch Board
by sticking the speaker wire to the guide hole of the cabinet.
2) Arrange working state of A1. Tape in the inverter wire and correct working state of the Shield case.
1) Check Soft touch with eyes Check and repair soldering
2) Check and repair the P101 connector
2) Check and repair the IC801, 802 SI4925
1) Check and fix P502 connector
2) Check and fix the components at P502 LCD module and at main board
3) Check Pin21
1) Check and repair tuner board and main board
2) Solder Q403, Q402 and C153
1) Replace the LCD lamp2) Replace the inverter
2) Check the connector input
EN 9LCD1.15E5.
5.2PC Mode
Table 5-2 PC Mode
No. SymptomCauseCheck Point
6Screen noiseClock or phase being not able to
7Screen position errorScreen position error horizontally
8Colour beat noiseSoldering AD converter or mak-
5.3TV and External Input
Table 5-3 TV and External Input
No. SymptomCauseCheck Point
9No sound
- Speaker
- Earphone
10Video colour beat
noise
1) Resetting is needed according to the video card of each PC
be adjusted
or vertically
ing it short
Defective Reset IC of IC603
Defective MSP3400D of IC601
Defective B+ (8 V, 5 V) of
ICC604, 605.
Earphone shield case being
touched
Soldering IC301 and IC507Check and re-solder
2) Horizontal noise: adjust phase until no horizontal noise occurs3) Vertical noise: adjust clock in menu until no vertical noise occurs
1) Play the Auto Configure in Menu
2) Adjust horizontal and vertical position until the screen displays normally
Recheck and repair AD9884
1) Check volume and speaker- Sound comes out only when being inputted
into Audio L/R
2) Check after replacing IC6033) Replace IC6014) Check and replace B+
of IC604, 605
Check the mould of the shield and JA401. Replace the shield case
EN 10LCD1.15E5.
Personal Notes:
Service Modes, Error Codes, and Fault Finding
Block Diagrams, Testpoint Overview, and Waveforms
11LCD1.15E6.
6.Block Diagrams, Testpoint Overview, and Waveforms