Philips HTS7140 Schematic
1 - 1
Service
Service
BD Home Theater System
HTS7140/12/98/93/51/78
Tfswjdf
Tfswjdf
Service
Service Manual
TABLE OF CONTENTS
Location Of PCB Boards............................................ 1-2
Versions Variation ...................................................... 1-2
Specifications ............................................................ 1-3
Measurement Setup .................................................. 1-4
Service Aids .............................................................. 1-5
ESD & Safety Instruction .......................................... 1-6
Lead-free Soldering Information ................................ 1-7
Setting Procedure & Repair Instructions ...................... 2
Disassembly Instructions, Service Positions & Bly-ray
Loader Mechanism Handling ........................................ 3
Quick Start Guide .......................................................... 4
Block & Wiring Diagram ................................................ 5
VFD Board .................................................................... 6
Main+MP3+Led+Support1+Support2 Board ................ 7
Power Board .................................................................. 8
BD Board........................................................................ 9
Touch Board ................................................................ 10
AMP+USB Board ........................................................ 11
Mechanical Exploded &Packing View ........................ 12
Revision List ................................................................ 13
Chapter
©
Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or
transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise
without the prior permission of Philips.
Published by KC-RL1047 AVM Service Audio Printed in The Netherlands Subject to modification
Version 1.3
3139 785 35403
GB
LOCATION OF PCB BOARDS
MAIN
VERSION VARIATION:
1 - 2
POWER
Type/Versions
Features
Output Power - 500W
Voltage (110-127V
Voltage (220-240V)
MP3 LINK
)
REPAIR SCENARIO MATRIX:
Type/Versions
Board in used
Main+MP3+Led+Support1+Support2 Board
/12
x
x
x
/12
C
/98
x
x
x
x
HTS7140
/98
C
/51
x
x
x
HTS7140
/51
C
/93
x
x
x
/93
C
/78
x
x
x
x
/78
C
Power Board
VFD Board
BD Board
Touch Board
AMP+USB Board
*Bd = Board Level Replacement
*C = Component Level Repair
C
C
Bd
C
C
C
C
Bd
C
C
C
C
Bd
C
C
C
C
Bd
C
C
C
C
Bd
C
C
SPECIFICATIONS
1 - 3
Playback media
AVCHD, BD-RE, BD-Video, DVD-Video, DVD+R/+RW,
DVD-R/-RW, DVD+R/-R DL, CD-R/CD-RW, Audio CD, Video
CD/SVCD, Picture CD, MP3-CD, WMA-CD, DivX (Ultra)-CD,
USB storage device
File Format
Audio ............................................................ .mp3, .wma, .wav
Video ........................ .avi, .asf, .divx, .mkv, .mpg, .mpeg, .wmv
Picture ................................................................. .jpg, .gif, .png
Amplifier
Total output power ............................... 500 W RMS, 10% THD
Frequency response ................................ 40 Hz-20 kHz / ±3dB
Signal-to-noise ratio .................. > 65 dB (CCIR) / (A-weighted)
Input sensitivity ..........................................................................
AUX .......................................................................... 1500 mV
MP3 LINK ................................................................... 750 mV
Video
Signal system ........................................................ PAL / NTSC
Component video output: 480i/576i, 480p/576p, 720p, 1080i
HDMI output .......... 480i/576i, 480p/576p, 720p, 1080i, 1080p,
..................................................................................... 1080p24
Audio
S/PDIF Digital audio input .........................................................
Coaxial ................................................................ IEC 60958-3
Optical ..................................................................... TOSLINK
Sampling frequency ...................................................................
MP3 ................................................ 32 kHz, 44.1 kHz, 48 kHz
WMA ............................................................ 44.1 kHz, 48 kHz
Constant bit rate ........................................................................
MP3 ........................................................ 110 kbps - 320 kbps
WMA ......................................................... 48 kbps - 192 kbps
Radio
Tuning range .............................................................................
Europe/China ................................ FM 87.5-108 MHz (50 kHz)
Asia Paci c/Russia/Latin America ..........................................
................................................. FM 87.5-108 MHz (50/100 kHz)
Signal-to-noise ratio ................................................... FM 55 dB
Frequency respose ........................ FM 60 Hz-12.5 kHz / ±3dB
Main Unit
Power supply .............................................................................
Europe/China/Russia/India ... 220-240V, ~50 Hz; (for:/12/51/93)
Latin America/Asia Paci c ..................... 110-127V/220-240V,
............................................................... ~50-60Hz; (for:/98/78)
Power consumption ........................................................ 115 W
Standby power consumption ...................................... < 0.22 W
Center speaker ..........................................................................
Speaker impedance ...................................................... 4 ohm
Speaker driver .............................. 2 X 64 mm (2.5”) full range
Frequency response ........................................ 150 Hz-20 kHz
Front/Rear speakers ..................................................................
Speaker impedence ...................................................... 6 ohm
Speaker drivers ............................ 4 x 64 mm (2.5”) full range
Frequency response ........................................ 150 Hz-20 kHz
Dimensions (WxHxD) ................................. 955 x 155 x 96 mm
Weight ............................................................................. 6.4 kg
Subwoofer
Impedance ...................................................................... 4 ohm
Speaker drivers ...................................... 165 mm (6.5”) woofer
Frequency response ........................................... 20 Hz-150 Hz
Dimensions (WxHxD) ............................ 196 x 397 x 342 (mm)
Weight ........................................................................... 6.03 kg
Wall Mount
Dimensions (WxHxD) .............................. 682 x 108 x 17 (mm)
Weight ............................................................................. 1.3 kg
Laser specification
Laser Type (Diode) ....................................................................
.................... InGaN/AIGaN (BD),InGaAIP (DVD), AIGaAs (CD)
Typical W avelength ..................................................................
...............................405 mm (BD), 660 nm (DVD), 783 nm (CD)
Output power (Max. ratings) ......................................................
............................. 20mW (BD), 130 mW (DVD), 160 mW (CD)
Speci cations subject to change without prior notice.
USB
Compatibility .............................................. Hi-Speed USB (2.0)
Class support ........................ UMS (USB Mass Storage Class)
File system ........................................................ FAT16, FAT32
Maximum memory support ........................................ < 160GB.
MEASUREMENT SETUP
Tuner FM
1 - 4
Bandpass
LF Voltmeter
e.g. PM2534
RF Generator
e.g. PM5326
DUT
250Hz-15kHz
e.g. 7122 707 48001
Ri=50
S/N and distortion meter
e.g. Sound Technology ST1700B
Use a bandpass filter to eliminate hum (50Hz, 100Hz) and disturbance from the pilottone (19kHz, 38kHz).
CD
Use Audio Signal Disc
(replaces test disc 3)
DUT
SBC429 4822 397 30184
L
R
S/N and distortion meter
e.g. Sound Technology ST1700B
LEVEL METER
e.g. Sennheiser UPM550
with FF-filter
SERVICE AIDS
Service Tools:
Universal Torx driver holder .................................4822 395 91019
Torx bit T10 150mm ...........................................4822 395 50456
Torx driver set T6-T20 .........................................4822 395 50145
Torx driver T10 extended .....................................4822 395 50423
Compact Disc:
SBC426/426A Test disc 5 + 5A ...........................4822 397 30096
SBC442 Audio Burn-in test disc 1kHz .................4822 397 30155
SBC429 Audio Signals disc .................................4822 397 30184
Dolby Pro-logic Test Disc ....................................4822 395 10216
HANDLING CHIP COMPONENTS
1 - 5
GB
A
WARNING
1 - 6
ESD
WAARSCHUWING
NL
ll ICs and many other semi-conductors are
susceptible to electrostatic discharges (ESD).
Careless handling during repair can reduce life
drastically.
When repairing, make sure that you are
connected with the same potential as the mass
of the set via a wrist wrap with resistance.
Keep components and tools also at this
potential.
F
ATTENTION
Tous les IC et beaucoup d’autres
semi-conducteurs sont sensibles aux
décharges statiques (ESD).
Leur longévité pourrait être considérablement
écourtée par le fait qu’aucune précaution n’est
prise à leur manipulation.
Lors de réparations, s’assurer de bien être relié
au même potentiel que la masse de l’appareil et
enfiler le bracelet serti d’une résistance de
sécurité.
Veiller à ce que les composants ainsi que les
outils que l’on utilise soient également à ce
potentiel.
GB
Complete Kit ESD3 (small tablemat, wristband,
connection box, estention cable and earth cable ....... 4822 310 10671
Wristband tester ................................................................. 4822 344 13999
D
WARNUNG
Alle ICs und viele andere Halbleiter sind
empfindlich gegenüber elektrostatischen
Entladungen (ESD).
Unsorgfältige Behandlung im Reparaturfall kan
die Lebensdauer drastisch reduzieren.
Veranlassen Sie, dass Sie im Reparaturfall über
ein Pulsarmband mit Widerstand verbunden
sind mit dem gleichen Potential wie die Masse
des Gerätes.
Bauteile und Hilfsmittel auch auf dieses gleiche
Potential halten.
ESD PROTECTION EQUIPMENT
Alle IC’s en vele andere halfgeleiders zijn
gevoelig voor electrostatische ontladingen
(ESD).
Onzorgvuldig behandelen tijdens reparatie kan
de levensduur drastisch doen verminderen.
Zorg ervoor dat u tijdens reparatie via een
polsband met weerstand verbonden bent met
hetzelfde potentiaal als de massa van het
apparaat.
Houd componenten en hulpmiddelen ook op
ditzelfde potentiaal.
I
AVVERTIMENTO
Tutti IC e parecchi semi-conduttori sono
sensibili alle scariche statiche (ESD).
La loro longevità potrebbe essere fortemente
ridatta in caso di non osservazione della più
grande cauzione alla loro manipolazione.
Durante le riparazioni occorre quindi essere
collegato allo stesso potenziale che quello della
massa dell’apparecchio tramite un braccialetto
a resistenza.
Assicurarsi che i componenti e anche gli utensili
con quali si lavora siano anche a questo
potenziale.
GB
Safety regulations require that the set be restored to its original
condition and that parts which are identical with those specified,
be used.
Safety components are marked by the symbol
!
.
CLASS 1
LASER PRODUCT
NL
Veiligheidsbepalingen vereisen, dat het apparaat bij reparatie in
zijn oorspronkelijke toestand wordt teruggebracht en dat onderdelen,
identiek aan de gespecificeerde, worden toegepast.
De Veiligheidsonderdelen zijn aangeduid met het symbol
!
.
3122 110 03420
F
Les normes de sécurité exigent que l’appareil soit remis à l’état
d’origine et que soient utiliséés les piéces de rechange identiques
à celles spécifiées.
Less composants de sécurité sont marqués
!
.
D
Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu
beachten. Der Original zustand des Geräts darf nicht verändert werden;
für Reparaturen sind Original-Ersatzteile zu verwenden.
Sicherheitsbauteile sind durch das Symbol
!
markiert.
I
Le norme di sicurezza esigono che l’apparecchio venga rimesso
nelle condizioni originali e che siano utilizzati i pezzi di ricambio
identici a quelli specificati.
Componenty di sicurezza sono marcati con
!
.
GB
After servicing and before returning set to customer perform a leakage
current measurement test from all exposed metal parts to earth ground
to assure no shock hazard exist, The leakage current must not
exceed 0.5mA.
GB
Warning !
Invisible laser radiation when open.
Avoid direct exposure to beam.
S
Varning !
Osynlig laserstrålning när apparaten är öppnad och spärren
är urkopplad. Betrakta ej strålen.
Varoitus !
SF
Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina
näkymättömälle laserisäteilylle. Älä katso säteeseen!
DK Advarse !
Usynlig laserstråling ved åbning når sikkerhedsafbrydere er
ude af funktion. Undgå udsaettelse for stråling.
F
"Pour votre sécurité, ces documents doivent être utilisés par
des spécialistes agréés, seuls habilités à réparer votre
appareil en panne".
Pb(Lead) Free Solder
When soldering , be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (not always indicated)
onemusttreatallsetsfrom1 Jan 2005 onwards,according
next rules:
Important note: In fact also products of year 2004 must
be treated in this way as long as you avoid mixing solderalloys (leaded/ lead-free). So best to always use SAC305
and the higher temperatures belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste
is required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste
within workshops should be avoided because paste is
not easy to store and to handle.
• Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
– To reach at least a solder-temperature of 400@C,
– To stabilize the adjusted temperature at the solder-
tip
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360@C – 380@C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400@C otherwise
wear-out of tips will rise drastically and flux-fluid will
be destroyed. To avoid wear-out of tips switch off unused equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed solder alloy types (leaded and
lead-free).
If one cannot avoid or does not know whether product
is lead-free, clean carefully the solder-joint from old
solder alloy and re-solder with new solder alloy
(SAC305).
• Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
• Special information for BGA-ICs:
– Always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for desoldering always use the lead-free temperature profile,
in case of doubt)
– Lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening,
1 - 7
dependent of MSL-level seen on indicator-label in the
bag, the BGA-IC possibly still has to be baked dry.
(MSL=Moisture Sensitivity Level). This will be
communicated via AYS-website.
Do not re-use BGAs at all.
• For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
• On our website www.atyourservice.ce.Philips.com
you find more information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
System , Region Code , etc. Setting Produre
1) Restore factory setting
a) Press “ ” <Home> button on R/C.
b) Select <SETUP>, then press “OK” button on R/C.
c) Select <Advanced setup> ,then press < OK > button on R/C.
d) Select <Restore default settings>,then press <OK> to con rm.
2) Password change
a) Press “
” <Home> button on R/C.
b) Select <SETUP>, then press “OK” button on R/C.
c) Select <preference setup>, then press <OK> button on R/C.
d) Select <Change Password> <Con rm>, then press <OK> button
on R/C.
“0000” is default password supplied.
3) Trade model
5) Upgrading new software
Note: After Update Blu-ray loader (see chapter 3-1), must upgrade
software.
Method 1: Update software from a USB storage device or CD-R
a) Create a folder named “UPG” in your CD-R or USB storage
device, and Copy the latest upgrading software into the folder.
b) Insert the CD-R program disc or connect the USB storage device
to the set.
c) Press “
d) Select <Advance Setup> <Software Update> <USB>.
e) TV will show message as follow:
Now searching for upgrade software!
Please wait...!
” <Home> button on R/C, and select <Setup>.
f) Select <Start>, press <OK> button on R/C.
Software upgrade will take 5 minutes
Do not switch off!
Package version: 000022.0
Software BE 80%
Software FE Completed
Software MCU1:
Software Dock:
Software MCU3:
Software upgrade will take 5 minutes
2 - 12 - 1
Method 2: Update software from the network
Note: To check for new updates, compare the current software
version of your home theater with the latest software version (if
available) on the Philips web site, and for BD-Live application and
software update, make sure that the network router has access to
the Internet and the rewall is disabled.
a) The “LAN” jack at the back panel of the set must be connected
to the network router via network cables, and with the HDMI cable
to connect to the set and TV. Prepare the internet connection as
shown follow:
a) Press <Open/Close> button on R/C.
b) Press “2” “5” “9” on R/C,VFD will display “TRA ON” or “TRA
OFF”.
4) Check software version
a) Press “
” <Home> button on R/C
b) Select <Setup>, then press <OK> button on R/C.
c) Select <Advanced Setup> <Version Info.>,then press <OK>
button on R/C.
d) TV will show message as follow:
Model:HTS7140/12/98/93/51/78
Versions
System SW:30.00 NetTV:10.82
Subsystem SW:22-00-00-00
Ethernet MAC:00-25-01-01-8F-52
Software updates for this player have been found. Do you want to
upgrade?
Cancel
Start
Do not switch off!
Package version: 000022.0
Software BE Completed
Software FE Completed
Software MCU1: Not started
Software Dock: 2%
Software MCU3: Not started
Software upgrade will take 5 minutes
Do not switch off!
Package version: 000022.0
Software BE Completed
Software FE Completed
LAN
www
b) Press “ ” <Home> button on R/C, and select <Setup>.
c) Select <Advance Setup> <Software Update> <Network>.
d) TV will show message as follow:
Now searching for upgrade software!
Please wait...!
http://www.philips.com/support
Close
Software MCU1: 1%
Software Dock: Failed
Software MCU3:
g) The set will shut down automatically when the software upgrade
is completed.
Software updates for this player have been found. Do you want to
upgrade?
Cancel
Start
e) Select <Start>, press <OK> button on R/C.
Software upgrade will take 5 minutes
Do not switch off!
Package version: 000022.0
Software BE 80%
Software FE Completed
Software MCU1:
Software Dock:
6) OSD Language setup (only for 51 version)
a) Press “
” <Home> button on R/C.
b) Select <SETUP>, then press “OK” button on R/C.
c) Select <preference setup>, then press <OK> button on R/C.
d) Select <Menu language>, then press <OK> button on R/C.
C) Select <English>, then press <OK> button on R/C.
2 - 22 - 2
7) Produce to change Tuner grid (only for /98/51 version)
In some countries, you can switch the FM tuning grid between 50
kHz and 100 kHz. Changing the tuning grid erases all preset radio
stations.
a) Press<radio> button on R/C
b) Press <Stop> button on R/C.
c) Press and hold <Play> until (50 kHz) or (100 kHz) is displayed.
Note: repeaing the same action will toggle back to it previous
tunning grid setting.
8) DVD Region Code Change
a) In open mode, press “8” “6” “8” “9” “3” “1” on R/C,then input
Software MCU3:
Software upgrade will take 5 minutes
Do not switch off!
Package version: 000022.0
Software BE Completed
Software FE Completed
Software MCU1: Not started
Software Dock: 2%
Software MCU3: Not started
Software upgrade will take 5 minutes
Do not switch off!
desired number to change region code:
1 USA
2 EU
3 APAC
4 Australia ,NZ, Latam
5 Russia ,India
6 China
CAUTION!
This information is confi dential and may not be
distributed.Only a qualifi ed service person should
reprogram the Region Code.
Package version: 000022.0
Software BE Completed
Software FE Completed
Software MCU1: 1%
Software Dock: Failed
Software MCU3:
f) The set will shut down automatically when the software upgrade
is completed.
REPAIR INSTRUCTIONS (One)
2 - 32 - 3
3 - 1 3 - 1
Disassembly Instructions, Service Positions and Blu-ray Loader Mechanism
handling
Dismantling of the Front Assembly
1) According to gure 1, the mark to remove wire cover left & right.
2) Loosen 4 screws “A” to remove the Foot Stand assembly as shown in gure 2.
3) Loosen 14 screws “B” at the back cover as shown in gure 3.
4) Loosen 7 screws “C” to remove the PCBA/Brackets assembly as shown in gure 4.
Dismantling of the Blu-ray Loader
1) Loosen 4 screws “D” at the Blu-ray Loader as shown in gure 5.
D
Figure 5
Dismantling of the Touch Board
1) Loosen 7 screws “E” to remove Touch Board as shown in gure 6.
Figure 1
A
Figure 2
B
Figure 3
E
Figure 6
Dismantling of the USB+MP3 Board & Loudspeaker boxes
1) Loosen 4 screws “F” on the top of USB & MP3 Board as shown in gure 7.
2) Loosen 8 screws “G” & “H” to remove the left & right Loudspeaker boxes as shown in gure 8 & 9.
F
Figure 7
Dismantling of the VFD Board
1) Loosen 1 screw “J” on the top of VFD Board as shown in gure 10.
2) Remove the VFD Board by lifting screw mounting side up and outwards from the 2 catches for the VFD Board as shown in Figure
11.
G
Figure 8
H
Figure 9
C
Figure 4
J
Figure 10
Figure 11
3 - 2 3 - 2
Dismantling of the Bd Board
1) Loosen 4 screws “K” as shown in gure 12.
2) Loosen 4 screws “L” on the top of BD Board as shown in gure 13.
Dismantling of the AMP Board
1) Loosen 4 screws “O” on the bottom of AMP Bard as shown in gure 16.
K
Figure 12
Dismantling of the Main Board
1) Loosen 4 screws “M” as shown in gure 14.
2) Loosen 4 screws “N” on the top of Main Board as shown in gure 15 to remove Main Board.
Figure 13
N
L
O
Figure 16
Dismantling of the Power Board
1) Loosen 4 screws “P” on the bottom of Power Bard as shown in gure 17.
M
Figure 14
P
Figure 15
Figure 17
Service Positions
Service Position A - PCBA Bracket_Vertical
3 - 3 3 - 3
Service Position C – VFD, AMP & Power Board
Service Position B - AMP & Power Board
Service Position D – All Boards
Note:In some service positions the components or copper patterns of one board may risk touching its neighbouring pc boards or
metallic parts. To prevent such short-circuit use a piece of hard paper or other insulating material between them.
3 - 4 3 - 4
Blu-ray Loader mechanism handling
Note: This Manual describes how to handle TEAC BD-LN150 drives to prevent the unnecessary damages to the drives.
1) Loosen 4 screws “Q” & “R” to remove Blu-ray Loader bracket as show in gure 19 & 20.
R
Q
> Hold by the top and bottom: this holding method may cause damage of chassis since aluminum chassis is used and not recommended.
Note: Bottom chassis of BD-LN150 is steel.
2) How to hold BD-LN150.
> Hold by the front and rear: hold the drive as indicated by arrow marks.
Figure 19
Figure 20
> Do not touch any parts on the top and do not touch Spindle motor cover on the bottom.
> Hold by the sides with your both hands if your hand is small to grab it with one hand at the front and rear: hold the drive as indicated by
arrow marks.
Top Bottom
3) How to insert a disc into BD-LN150.
> Do not touch any parts on the top while inserting / ejecting a disc.
> Do not touch any parts on the top even after disc is loaded (while reading a disc).
> The other example of bad handling while inserting / ejecting a disc.
4) How to mount BD-LN150.
> Utilize Self tap screw holes on the front and rear.
> Do not use double side tape to x it. It may cause frame deformation when it is removed.
3 - 5 3 - 5
5) Application notes and design recommendation in mounting.
> The drive frame is using 0.8t aluminum plate. Pay attention not to occur any distortion when mounting the drive. Any distortion may
cause Load/Eject issue.
> If the drive will be used in the dusty environment, cover the drive to avoid the dust. If the dust is stuck on the roller or OPU lens, it may
cause Load/Eject issue or Read issue.
> In case that drive is mounted with Disc opening up, pay caution not to insert foreign material such as coins.
> Make sure that the drive is used in the speci ed temperature. (5 degree C to 50 degree C).
> Make sure that the appropriate handling is applied to the drive as shown in Handling Manual. Applying to the parts may cause Load/Eject
issue.
4 - 1 4 - 1
QUICK START GUIDE
The following excerpt of the QSG/DFU serves as an introduction to the set.
The complete Direction for Use can be download in the different languages from the internet site of Philips Consumer care Center: www.support.philips.com
1
User Manual
India only
Power Cord
Latin America
* Adaptador fornecido como acessório não deverá ser usado nas redes elétricas do Brasil, seu uso é destinado exclusivamente a
outros países da América Latina.
only
Adapter
Power Cord
2 x
FM AntennaHDMI MP3 Link
2
4 - 2 4 - 2
SUBWOOFER
110 - 127 V
220 - 240V
3
4
HDMI
FM
Antenna
6
Asia Pacic and
Latin America only
7
2
Latin America only
1
5
HDMI
Cable
8
TV
HDMI
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Lmjohpo
HOME THEATER
4 - 3 4 - 3
1
9
10
2
3
AAA
x 2
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