Philips HTS2501/12/94 Schematic

1 - 1

DVD Home Theater System

HTS2501/12/94

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TfswjdfService

Service

Service Manual

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ABLE OF CONTENTS

Location of PCB Boards ............................................

Versions Variation ...................................................... 1-2

Specifications ............................................................ 1-3

Measurement Setup .................................................. 1-4

Service Aids .............................................................. 1-5

ESD & Safety Instruction .......................................... 1-6

Lead-free soldering Information ................................ 1-7

Setting procedure & Repair Instructions........................ 2

Disassembly Instructions & Service positions .............. 3

Quick Start Guide .......................................................... 4

Block & Wiring Diagram ................................................ 5

VFD+USB Board............................................................ 6

Main Board .................................................................... 7

Power Board .................................................................. 8

Mechanical Exploded view ..........................................

Revision List ................................................................ 12

Chapter

1-2

11

©

Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands

All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or
transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise
without the prior permission of Philips.

Published by RY_LYF_1101 Service Audio Printed in The Netherlands Subject to modification

Version 1.0

3139 785 35560

GB

LOCATION OF PCB BOARDS

VFD PCB

1 - 2

MAIN PCB

POWER PCB

USB PCB

VERSION VARIATION:

Type/Versions

Features

Output Power - 240W

Output Power - 300W

Voltage (110-240V)

AUX

REPAIR SCENARIO MATRIX:

/12

x

x

x

HTS2501

/94

x

x

x

x

Type/Versions

Board in used

Main Board

Power Board

VFD+USB Board

*C = Component Level Repair

/12

C

C

C

HTS2501

/94

C

C

C

SPECIFICATIONS

1 - 3

Playback media

DVD-Video, DVD+R/+RW, DVD-R/-RW, CD-R/CD-RW, Audio
CD, Video CD/SVCD, Picture CD, MP3-CD, WMA-CD, DivX­CD, USB storage device

File Format

...................................................................... .mp3, .wma

Audio

Video ....... .divx, .divx ultra, .mpeg, .mpg, .wmv (simple pro le)

Picture ....................................................................... .jpeg, .jpg

Amplifier

Total output power ................ 300 W RMS (30% THD) (for:/12)

Total output power ............................. 240 W RMS (10% THD),

............................................ 300 W RMS (30% THD) (for:/94)

Frequency response .................................. 20 Hz-20 kHz /±3dB

Signal-to-noise ratio .................... > 65 dB (CCIR) /(A-weighted)

Input sensitivity ..........................................................................

AUX ........................................................................... 1000 mV

Video

Signal system ........................................................ PAL / NTSC

Audio

Sampling frequency ...................................................................

MP3 ................................................ 32 kHz, 44.1 kHz, 48 kHz

WMA ............................................................ 44.1 kHz, 48 kHz

Constant bit rate ........................................................................

MP3 ........................................................ 112 kbps - 320 kbps

WMA ......................................................... 48 kbps - 192 kbps

Subwoofer

Impedance .....................................................................

Speaker drivers .....................................133 mm (5.25”) woofer

Frequency response ...........................................40 Hz-150 kHz

Dimensions (WxHxD) ............................ 60 x 267.5 x 265 (mm)

Weight ............................................................................2.65 kg

Cable length ........................................................................ 2 m

Laser specification

Type .....................................Semiconductor laser GaAIAs (CD)

Wave length ............... 645 - 665 nm (DVD), 770 - 800 nm (CD)

Output power .............................6 mW (DVD), 7 mW (VCD/CD)

Beam divergence .................................................... 60 degrees.

Speci cations subject to change without prior notice.

12 ohm

Radio

Tuning range ..................................FM 87.5-108 MHz (50 kHz)

Signal-to-noise ratio ....................................................FM 50 dB

Frequency response ..........................FM 180 Hz-10 kHz/ ±6dB

USB

Compatibility ....................................................................... USB

Class support ......................... UMS (USB Mass Storage Class)

File system .........................................................FAT16, FAT32

Maximum memory support .......................................... < 160GB

Main Unit

Power supply .......................................... 110-240V, ~50-60 Hz;

Power consumption ........................................................... 55 W

Standby power consumption .........................................≤ 0.9 W

Dimensions (WxHxD) ................................ 360 x 58 x 303(mm)

Weight ..............................................................................2.3 kg

Speakers

System ........................................................... full range satellite

Speaker impedance ......................................................... 3 ohm

Speaker drivers ...................................................... 3” full range

Frequency response ...........................................150 Hz-20 kHz

Dimensions (WxHxD) ................................ 100 x 100 x 75(mm)

Weight ..........................................................0.30~0.66 kg/each

Cable length ..............................................................................

Center ................................................................................ 1 m

Front .................................................................................. 2 m

Rear ................................................................................. 10 m

MEASUREMENT SETUP

Tuner FM

1 - 4

Bandpass

LF Voltmeter

e.g. PM2534

RF Generator

e.g. PM5326

DUT

250Hz-15kHz

e.g. 7122 707 48001

Ri=50

S/N and distortion meter

e.g. Sound Technology ST1700B

Use a bandpass filter to eliminate hum (50Hz, 100Hz) and disturbance from the pilottone (19kHz, 38kHz).

CD

Use Audio Signal Disc
(replaces test disc 3)

DUT

SBC429 4822 397 30184

L

R

S/N and distortion meter

e.g. Sound Technology ST1700B

LEVEL METER

e.g. Sennheiser UPM550

with FF-filter

SERVICE AIDS

Service Tools:

Universal Torx driver holder .................................4822 395 91019

Torx bit T10 150mm ...........................................4822 395 50456

Torx driver set T6-T20 .........................................4822 395 50145

Torx driver T10 extended .....................................4822 395 50423

Compact Disc:

SBC426/426A Test disc 5 + 5A ...........................4822 397 30096

SBC442 Audio Burn-in test disc 1kHz .................4822 397 30155

SBC429 Audio Signals disc .................................4822 397 30184

Dolby Pro-logic Test Disc ....................................4822 395 10216

HANDLING CHIP COMPONENTS

1 - 5

GB

A

WARNING

1 - 6

ESD

WAARSCHUWING

NL

ll ICs and many other semi-conductors are
susceptible to electrostatic discharges (ESD).
Careless handling during repair can reduce life
drastically.
When repairing, make sure that you are
connected with the same potential as the mass
of the set via a wrist wrap with resistance.
Keep components and tools also at this
potential.

F

ATTENTION

Tous les IC et beaucoup d’autres
semi-conducteurs sont sensibles aux
décharges statiques (ESD).
Leur longévité pourrait être considérablement
écourtée par le fait qu’aucune précaution n’est
prise à leur manipulation.
Lors de réparations, s’assurer de bien être relié
au même potentiel que la masse de l’appareil et
enfiler le bracelet serti d’une résistance de
sécurité.
Veiller à ce que les composants ainsi que les
outils que l’on utilise soient également à ce
potentiel.

GB

Complete Kit ESD3 (small tablemat, wristband,

connection box, estention cable and earth cable ....... 4822 310 10671

Wristband tester ................................................................. 4822 344 13999

D

WARNUNG

Alle ICs und viele andere Halbleiter sind
empfindlich gegenüber elektrostatischen
Entladungen (ESD).
Unsorgfältige Behandlung im Reparaturfall kan
die Lebensdauer drastisch reduzieren.
Veranlassen Sie, dass Sie im Reparaturfall über
ein Pulsarmband mit Widerstand verbunden
sind mit dem gleichen Potential wie die Masse
des Gerätes.
Bauteile und Hilfsmittel auch auf dieses gleiche
Potential halten.

ESD PROTECTION EQUIPMENT

Alle IC’s en vele andere halfgeleiders zijn
gevoelig voor electrostatische ontladingen
(ESD).
Onzorgvuldig behandelen tijdens reparatie kan
de levensduur drastisch doen verminderen.
Zorg ervoor dat u tijdens reparatie via een
polsband met weerstand verbonden bent met
hetzelfde potentiaal als de massa van het
apparaat.
Houd componenten en hulpmiddelen ook op
ditzelfde potentiaal.

I

AVVERTIMENTO

Tutti IC e parecchi semi-conduttori sono
sensibili alle scariche statiche (ESD).
La loro longevità potrebbe essere fortemente
ridatta in caso di non osservazione della più
grande cauzione alla loro manipolazione.
Durante le riparazioni occorre quindi essere
collegato allo stesso potenziale che quello della
massa dell’apparecchio tramite un braccialetto
a resistenza.
Assicurarsi che i componenti e anche gli utensili
con quali si lavora siano anche a questo
potenziale.

GB

Safety regulations require that the set be restored to its original
condition and that parts which are identical with those specified,
be used.

Safety components are marked by the symbol

!

.

CLASS 1

LASER PRODUCT

NL

Veiligheidsbepalingen vereisen, dat het apparaat bij reparatie in
zijn oorspronkelijke toestand wordt teruggebracht en dat onderdelen,
identiek aan de gespecificeerde, worden toegepast.

De Veiligheidsonderdelen zijn aangeduid met het symbol

!

.

3122 110 03420

F

Les normes de sécurité exigent que l’appareil soit remis à l’état
d’origine et que soient utiliséés les piéces de rechange identiques
à celles spécifiées.

Less composants de sécurité sont marqués

!

.

D

Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu
beachten. Der Original zustand des Geräts darf nicht verändert werden;
für Reparaturen sind Original-Ersatzteile zu verwenden.

Sicherheitsbauteile sind durch das Symbol

!

markiert.

I

Le norme di sicurezza esigono che l’apparecchio venga rimesso
nelle condizioni originali e che siano utilizzati i pezzi di ricambio
identici a quelli specificati.

Componenty di sicurezza sono marcati con

!

.

GB

After servicing and before returning set to customer perform a leakage
current measurement test from all exposed metal parts to earth ground
to assure no shock hazard exist, The leakage current must not
exceed 0.5mA.

GB

Warning !

Invisible laser radiation when open.
Avoid direct exposure to beam.

S

Varning !

Osynlig laserstrålning när apparaten är öppnad och spärren
är urkopplad. Betrakta ej strålen.

Varoitus !

SF

Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina
näkymättömälle laserisäteilylle. Älä katso säteeseen!

DK Advarse !

Usynlig laserstråling ved åbning når sikkerhedsafbrydere er
ude af funktion. Undgå udsaettelse for stråling.

F

"Pour votre sécurité, ces documents doivent être utilisés par
des spécialistes agréés, seuls habilités à réparer votre
appareil en panne".

Pb(Lead) Free Solder

When soldering , be sure to use the pb free solder.

INDENTIFICATION:

Regardless of special logo (not always indicated)

onemusttreatallsetsfrom1 Jan 2005 onwards,according
next rules:

Important note: In fact also products of year 2004 must
be treated in this way as long as you avoid mixing solder­alloys (leaded/ lead-free). So best to always use SAC305
and the higher temperatures belong to this.

Due to lead-free technology some rules have to be
respected by the workshop during a repair:

• Use only lead-free solder alloy Philips SAC305 with

order code 0622 149 00106. If lead-free solder-paste
is required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste
within workshops should be avoided because paste is
not easy to store and to handle.

• Use only adequate solder tools applicable for lead-

free solder alloy. The solder tool must be able
– To reach at least a solder-temperature of 400@C,
– To stabilize the adjusted temperature at the solder-

tip

– To exchange solder-tips for different applications.

• Adjust your solder tool so that a temperature around

360@C – 380@C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400@C otherwise
wear-out of tips will rise drastically and flux-fluid will
be destroyed. To avoid wear-out of tips switch off un­used equipment, or reduce heat.

• Mix of lead-free solder alloy / parts with leaded solder

alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed solder alloy types (leaded and
lead-free).
If one cannot avoid or does not know whether product
is lead-free, clean carefully the solder-joint from old
solder alloy and re-solder with new solder alloy
(SAC305).

• Use only original spare-parts listed in the Service-

Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.

• Special information for BGA-ICs:
– Always use the 12nc-recognizable soldering

temperature profile of the specific BGA (for de­soldering always use the lead-free temperature profile,
in case of doubt)

– Lead free BGA-ICs will be delivered in so-called ‘dry-

packaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening,

1 - 7

dependent of MSL-level seen on indicator-label in the
bag, the BGA-IC possibly still has to be baked dry.
(MSL=Moisture Sensitivity Level). This will be
communicated via AYS-website.
Do not re-use BGAs at all.

• For sets produced before 1.1.2005 (except products

of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.

• On our website www.atyourservice.ce.Philips.com

you find more information to:

• BGA-de-/soldering (+ baking instructions)

• Heating-profiles of BGAs and other ICs used in
Philips-sets

You will find this and more technical information
within the “magazine”, chapter “workshop news”.

For additional questions please contact your local
repair-helpdesk.

Setting procedure & Repair instruction

2 - 12 - 1

c) Remove solder joint on the ESD protection point.

1) Restore factory setting

a) Press <SETUP> button on R/C.

b) Select <preference setup> ,then press < OK >.

c) Select <default>,then press <OK> to con rm.

2) Version control change

a) Open the Door,then,press “1” “5” “9” on RC.

b) Press <OK> button on RC.

c) TV will show message as follow:

Current model: 2501-12/94
Version:00.07.02_0 Release:2010.06.10
Region:0 Servo:62.10.00.07
8032: 0F.01.00.09 Risc:01.00.00.04
MCU: 07.00 BootLoader: Er

if current model doesnot match your set,
use down arrow key on the remote to change

OK

d) If current model doesnot match your set, use down arrow key on

the remote to change.

3) Password change

a) Press <SETUP> button on R/C.

b) Select <preference setup> ,then press <OK>.

c) Select <password> <change>,then press <OK> to con

“0000” is default password supplied.

4) Trade model

a) Press <Open/Close>button on R/C.

b) Press “2” “5” “9” on R/C,VFD will display “TRA ON “ or “TRA

OFF“.

rm

6) Upgrading new software

a) Check for the latest software version on

www.philips.com/support.

Search for your model and click on ‘software&drivers’.

b) Copy the latest upgrading software onto a CD-R or USB storage

device.

c) Insert the CD-R program disc or connect the USB storage device

to the home theater.

d) Press <USB> button on R/C.

e) TV will show message as follow:

Upgrade fi le detected
Upgrade?

Press PLAY

f) Press <PLAY> “u” button on R/C.
g) TV will show message as follow:

to start

Upgrade fi le detected
Upgrade?

Press PLAY

to start

Upgrading

h) When the updated is complete ,the home theater automatically
switch to standby.

Note: when upgrade in progress, please do not unplug or switch off
the device.

7) How to replace the defective DVD Loader

a) Remove the defective DVD Loader (see chapter 3).

b) Accordingly connect DVD Loader and “CN201”, “CN203” on the

top of main board as shown below

The ESD protection point on the Top side view of OPU

Note: The ESD protection point on t

be soldered if

- the DVD Loader is OK and needs to be disconnected from

connector “CN201” and “CN203” of the main board.

- the defective DVD Loader is needed to be send back to supplier

for failure analysis and to support back charging evidence.

8) Produce to change Tuner grid (only for /98 version)

In some countries, you can switch the FM tuning grid between 50

kHz and 100 kHz. Changing the tuning grid erases all preset radio

stations.

a) Press<radio> button on R/C

b) Press <Stop> button on R/C.

c) Press and hold <Play> until (50 kHz) or (100 kHz) is displayed.

Note: repeaing the same action will toggle back to it previous

tunning grid setting.

The Top side view of OPU

he Top side view of OPU must

5) Check on software version

a) Press <SETUP> button on R/C.

b) Select <preference setup> ,then press <OK>.

c) Select <version info>,then press <OK>.

d) TV will show message as follow:

Current model: 2501-12/94
Version:00.07.02_0 Release:2010.06.10
Region:0 Servo:62.10.00.07
8032: 0F.01.00.09 Risc:01.00.00.04
MCU: 07.00 BootLoader: Er

OK
Press SETUP

to exit menu

CN203

CN201

CAUTION!
This information is confi dential and may not be

distributed.Only a qualifi

ed service person should

reprogram the Region Code.

REPAIR INSTRUCTION

2 - 22 - 2

G

Power Supply

No working

G

Power Supply

No working

All Voltage

No Output

Check F901

Bad Causc Damage

Check BK3.3V

Working or Not

AC1 AC2 Voltage

No Output

+32.5V Voltage

No Output

-27V Voltage
No Output

+12V Voltage

No Output

+5.1V Voltage

No Output

BK3.3V Voltage

No Output

Check Requir IC901 IC904

And Its conn circuit

Check D905 Q901 IC901 ZD903

And Its Conjoint Part

Check D908 Q901 IC901

And Its Conjoint Part

Check D906 Q901 IC901

And Its Conjoint Part

Check D904 Q901 IC901

And Its Conjoint Part

Check D902 Q901 IC901

And Its Conjoint Part

Check D910 IC904 Q901 IC901

And Its Conjoint Part

DISASSEMBLY INSTRUCTIONS

3 - 1 3 - 1

Dismantling of theTop & Front Panel Assemble

1) Open the DVD Tray by using the Open/Close Button while the Set is ON and disconnect the mains supply after removing the Tray
Cover.

Note: If this is not possible, the DVD Tray has to be open manually.

Take a mini screw driver about 2mm diameter and make a marking 24mm from the tip as shown in  gure 2 . Place the set on its

side, insert the mini screw driver till the marking and slide it towards the left as shown in  gure 1 until the Tray moves out of the Front
Panel.

2) Return the set to its upright position and remove the Tray Cover as shown in Figure 3 and close the tray manually by pushing it back
in.

Push

3) Loosen 6 screws and remove the Top Cover by lifting the rear portion upwards before sliding it out towards the rear.

- 4 screws “A” at the back panel as shown in  gure 4.

- 1 screw “B” each on the left & right side as shown in  gure 5.

A

Figure 4

B

Figure 5

mm2

24mm

Figure 1

Figure 2

Dismantling of the DVD Loader Module

1) Loosen 4 screws “ C “ at the DVD Loader Module as shown in  gure 6.

C

Figure 3

Figure 6

3 - 2 3 - 2

Dismantling of the VFD+USB Board

1) Loosen 7 screws “D” on the top of VFD+USB Board as shown in  gure 7.

Figure 7

Dismantling of the POWER Board

1) Loosen 5 screws “G ” on the top of Power Board as shown in  gure 10.

D

Dismantling of the MAIN Board

1) Loosen 4 screws “ E ” on the top of MAIN Board as shown in  gure 8.

2) Loosen 5 screws “ F ” at the back panel as shown in  gure 9.

E

Figure 8

G

Figure 10

SERVICE POSITIONS

Figure 9

F

Note:In some service positions the components or copper patterns of one board may risk touching its neighbouring pc boards or
metallic parts. To prevent such short-circuit use a piece of hard paper or other insulating material between them.

4 - 1 4 - 1

SUBWOOFER

SUBWOOFER

FRONT

RIGHT

FRONT

RIGHT

FRONT

LEFT

FRONT

LEFT

FRONT

CENTER

FRONT

CENTER

REAR

RIGHT

REAR

RIGHT

REAR

LEFT

REAR

LEFT

REAR

LEFT

REAR

RIGHT

FRONT

LEFT

FRONT

CENTER

FRONT
RIGHT

SUBWOOFER

CIRCUIT DIAGRAM

The following excerpt of the QSG/DFU serves as an introduction to the set.
The complete Direction for Use can be download in the different languages from the internet site of Philips Consumer care Center: www.support.philips.com

1

User Manual

2

Composite

FM Antenna