Philips DVP-3960 Service manual

DVD Player

DVP3960

DVP3960/37

Service

Service Manual

All rights reserved. No part of this publication may be reproduced, stored in aretrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.

Published by TCL-HY 0702 Service Audio Printed in The Netherlands Subject to modification

Version 1.0

TABLE OF CONTENTS

Page

. Technical Specifications……………………………………..............1-2

. Safety Instruction, Warning & Notes….……………………....….....1-3

. Mechanical and Dismantling Instructions…………........................2-1

. Region Code, Software Version& Upgrades……………...............

. Wiring Diagram………………………………………..………..….….5-1

. Electrical Diagrams and Print-layouts..….…………………....….…6-1

. Set Mechanical Exploded view .................…………………..….….7-1

.3-1

LASER PRODUCT

CLASS 1

3139 785 32460

PHILIPS

Technical Specifications

TV standard (PAL/50Hz) (NTSC/60Hz)

Number of lines 625 525 Playback Multi standard (PAL/NTSC)

Video performance

Video DAC 12 bit, 108MHz YPbPr: 0.7Vpp ---- 75 ohm Video output 1Vpp ----- 75 ohm

Video format

Digital Compression MPEG 2 for DVD,SVCD

MPEG 1 for VCD

DVD 50Hz 60Hz Horiz resolution 720 pixels 720 pixels 1920pixels 1920pixels Vertical resolution 576lines 480 lines 1080lines 1080lines

VCD 50Hz 60Hz

Horiz. resolution 352 pixels 352 pixels Vertical resolution 288lines 240 lines

Audio format

Digital MPEG/AC-3/ Compressed Digital

PCM 16, 20, 24bits

Analogue Sound Stereo Dolby surround compatible downmix from Dolby Digital multi-channel sound

DivX®

fs, 44.1, 48, 96KHz

MP3(ISO 9660) 96,112,128,256kbps

& variable bit rate fs,32,

44.1,48 kHz

1-2

Audio performance

DA converter 24bits, 192KHz DVD fs 96kHz 4Hz----44kHz fs 48kHz 4Hz----22kHz SVCD fs 48kHz 4Hz----22kHz fs 44.1kHz 4Hz----20kHz CD/ VCD fs 44.1kHz 4Hz----20kHz Signal-Noise (1kHz) >90dB Dynamic Range (1kHz) >80dB Cross talk (1kHz) >80dB Distortion/Noise (1kHz) >80dB MPEG MP3 MPEG Audio L3

Connections

YpbPr output Cinch 3x Video output Cinch( yellow) Audio output (L+R ) Cinch (white/red) Digital output 1 coaxial IEC60958 for CDDA/ LPCM IEC61937 for MPEG1/2,

Dolby Digital

HDMI Out

Cabinet

Dimensions (w X h X d) 360 x 37 x 235 mm Weight Approximately 2.0 kg

Power consumption

Power supply Rating 120V; 60HZ Power consumption <10W Power consumption in standby mode <1W

Specifications subject to change without prior notice.

Safety instruction, Warning & Notes

1-3

Safety instruction

1. General safety

Safety regulations require that during a repair: . Connect the unit to the mains via an isolation transformer.

. Replace safety components indicated by the symbol ,

only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard.

Safety regulations require that after a repair, you must return the unit in its original condition. Pay, in particular, attention to the following points: . Route the wires/cables correctly, and fix them with the

mounted cable clamps.

. Check the insulation of the mains lead for external

damage.

. Check the electrical DC resistance between the mains

plug and the secondary side:

1) Unplug the mains cord, and connect a wi re b etw een the two pins of the mains plug.

2) Set the mains switch the “on” position (keep the mains cord unplug).

3) Measure the resistance value between the mains plug and the front panel, controls, and chassis bottom.

4) Repair or correct unit when the resistance measurement is less than 1M

5) Verify this, before you return the unit to the customer/user (ref. UL-standard no. 1492).

6) Switch the unit “off”, and remove the wire between the two pins of the mains plug.

2.Laser safety

This unit employs a laser. Only qualified service personnel may remove the cover, or attempt to service this device (due to possible eye injury). Laser device unit Type : Semiconductor laser GaAlAs Wavelength : 650nm (DVD) : 780nm (VCD/CD) Output power : 7mW (DVD) : 10mW (DVD /CD) Beam divergence: 60 degree Note: Use of controls or adjustments or performance of procedure other than those specified herein, may result in hazardous radiation exposure. Avoid direct exposure to beam.

Warning

1.General

. All ICs and many other semiconductors are susceptible to

electrostatic discharges (ESD). Careless handing during repair can reduce life drastically. Make sure that, during repair, you are at the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential. Available ESD protection equipment:

1) Complete kit ESD3 (small tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671.

2) Wristband tester 4822 344 13999.

. Be careful during measurements in the live voltage

section. The primary side of the power supply , including the heat sink, carries live mains voltage when you connect the player to the mains (even when the player is “off”!). It is possible to touch copper tracks and/or components in this unshielded primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A “lighting stroke” and a stripe-marked printing on the printed wiring board, indicate the primary side of the power supply.

. Never replace modules, or components, while the unit is

“on”.

1-4

2. Laser

. The use of optical instruments with this product, will

increase eye hazard.

. Only qualified service personnel may remove the cover

or attempt to service this device, due to possible eye injury.

. Repair handing should take place as much as possible

with a disc loaded inside the player.

. Text below is placed inside the unit, on the laser cover

shield:

CAUTION: VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN, AVOID EXPOSURE TO BEAM.

1-5

Notes

Lead-Free requirement for service INDENTIFICATION:

Regardless of special logo (not always indicated)

One must treat all sets from 1.1.2005 on wards, according next rules.

Important note be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.

Due to lead-free technology some rules have to be respected by the workshop during a repair:

• Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle.

• Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able

o To reach at least a solder-temperature of 400°C, o To stabilize the adjusted temperature at the

o To exchange solder-tips for different applications.

• Adjust your solder tool so that a temperature around 360°C joint. Heating-time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat.

• Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305).

: In fact also products a little older can also

solder-tip

– 380°C is reached and stabilized at the solder

• Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies.

• Special information for BGA-ICs:

- always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use highest lead-free temperature profile, in case of doubt)

- lead free BGA-ICs will be delivered in so-called ‘dry-packaging’ (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. This will be communicated via AYS-website. Do not re-use BGAs at all.

• For sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes.

• On our website:

www.atyourservice.ce.Philips.com You find more information to:

BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets

You will find this and more technical i nformation

within the “magazine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk.

2-1

Mechanical and Dismantling Instructions

Dismantling Instruction

The following guidelines show how to dismantle the player.

Step1: Remove 5 screws around the Top Cover, then remove the Top Cover (Figure 1).

Step2: If it is necessary to dismantle Loader or Front Panel, It should be remove the Front door assembly first. (Figure 2)

Note: Make sure to operate gently otherwise the guider would be damaged.

Please kindly note that dismantle the front door assembly carefully to avoid damage tray and the front door assembly.

Figure1

Figure 2

2-2

Mechanical and Dismantling Instructions

Dismantling Instruction

Step3: If the tray can’t open in normal way, you can make it through the instruction as below (Figure 3).

Note: Make sure to operate gently otherwise the guider would be damaged.

Push the guider until the tray out. Make sure to operate gently to avoid damage happening.

Step4: Dismantling Loader, disconnect the 3 connectors aiming in the below figure, and remove 4 screws around the Loader. (Figure 4)

CON 1

CON 2

CON 3

Figure 4

Figure 3

2-3

Mechanical and Dismantling Instructions

Dismantling Instruction

Step5: Dismantling Front Panel, disconnect the 1 connector, then release the snaps on the both sides of Front Panel and bottom

cabinet , then gently pull the Panel out from the set. (Figure 5 & 6 & 7)

CON 4

Figure 5

Snap 1

Snap 2

Figure 6

Figure 7

2-4

Mechanical and Dismantling Instructions

Dismantling Instruction

Step6: Dismantling Main Board, first disconnect the 1 connector, and then remove 5 screws to dismantle Main board. (Figure 8)

Step7: Remove the 2 screws on Power Board to dismantle the Power Board. (Figure 9)

CON 5

Figure 8

Figure 9

+ 18 hidden pages