•USB storage device
Compatibility: Hi-Speed USB (2.0)•
Class support: MSC (Mass Storage Class)•
Filesystem:FAT16,FAT32•
Maximum number of albums/folders: 300•
Maximum number of tracks/titles: 648•
Video
Signalsystem:PAL,NTSC•
Composite video output: 1 Vp-p (75 Ohm)•
Component video output: 0.7 Vp-p (75 Ohm)•
Audio
2-channel analog output•
Audio Front L&R : 2 Vrms (47k Ohm)•
Digital output: 0.5 Vp-p (75 Ohm)•
Coaxial•
Sampling frequency:•
MP3: 8 kHz,11kHz,12kHz,16kHz,22kHz,
•
24kHz, 32 kHz,44.1kHz,48kHz
WMA: 44.1 kHz, 48 kHz•
for DVP3800/79
Constant bit rate:•
MP3: 8 kbps - 320 kbps•
WMA: 64 kbps - 192 kbps•
Main unit
Dimensions (W x H x D): 360 x 42 x 209 (mm)•
Net Weight: 1.34 kg•
Power
Powersupplyrating:230-240V~,50Hz•
Power consumption: < 8 W•
Power consumption in standby mode: < 0.3 W•
Accessories supplied
Remote control and one battery•
Audio/Video cables•
One must treat all sets from 1.1.2005 onwards, according
next rules.
Important note: In fact also products a little older can also
be treated in this way as long as you avoid mixing
solder-alloys (leaded/ lead-free). So best to always use
SAC305 and the higher temperatures belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
x Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste is
required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste within
workshops should be avoided because paste is not easy
to store and to handle.
x Use only adequate solder tools applicable for lead-free
solder alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C,
o To stabilize the adjusted temperature at the
solder-tip
o To exchange solder-tips for different applications.
x Adjust your solder tool so that a temperature around
360°C
– 380°C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400°C otherwise
wear-out of tips will rise drastically and flux-fluid will be
destroyed. To avoid wear-out of tips switch off un-used
equipment, or reduce heat.
x Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed
solder alloy types (leaded and lead-free). If one cannot
avoid, clean carefully the
solder-joint from old solder alloy and re-solder with new
solder alloy (SAC305).
x Use only original spare-parts listed in the
Service-Manuals. Not listed standard-material
(commodities) has to be purchased at external
companies.
xSpecial information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for
de-soldering always use highest lead-free
temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
‘dry-packaging’ (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on
indicator-label in the bag, the BGA-IC possibly
still has to be baked dry. This will be
communicated via AYS-website.
Do not re-use BGAs at all.
x For sets produced before 1.1.2005, containing
leaded soldering-tin and components, all needed
spare-parts will be available till the end of the
service-period. For repair of such sets nothing
changes.
x On our website:
www.atyourservice.ce.Philips.com
You find more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
The following guidelines show how to dismantle the player.
Step1: Remove 5 screws around the Top Cover, and then remove the Top Cover (Figure 1).
The sample is DVP3800/93.
Detailed information please refer to the model set.
Figure 1
Step2: If it is necessary to dismantle Loader or Front Panel, the Front door should be removed first. (Figure 2)
Note: Make sure to operate gently otherwise the guider would be damaged.
Please kindly note that dismantle the front door
assembly carefully to avoid damage tray and the front door.
Figure 2
2-2
XP2
XP4
XP3
XP7
XP82
XP1
Mechanical and Dismantling Instructions
Dismantling Instruction
Step3: If the tray can’t open in normal way, you can make it through the instruction as below (Figure 3).
Note: Make sure to operate gently otherwise the guider would be damaged.
Detailed information please refer to the model set.
Step4: Dismantling Front Panel, disconnect the connectors (XP7, XP82), need release 4 snaps of Front Panel & 2 snaps
of bottom cabinet , then gently pull the Panel out from the set. (Figure 4 - Figure 6)
Figure 3
Figure 4
Loading...
+ 32 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.