Exploded Views
Mechanical and Electrical Parts Lists
Sec. 2: Standard Maintenance
Mechanism Alignment Procedures
Disassembly / Assembly of Mechanism
Deck Exploded Views
Deck Parts List
c Copyright 2006 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval
system or transmitted, in any form or by any means, electronic, mechanical, photocopying,
or otherwise without the prior permission of Philips.
Published by FU-KC 0623 Service AV Systems Printed in Netherlands Subjection to modification EN 3139 785 32220
Version 1.0
MAIN SECTION
VCR Module
Sec. 1: Main Section
I Schematic Diagrams and CBA’s
I Exploded Views
I Mechanical and Electrical Parts List
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Pin 1
Input
In
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
Information about lead-free soldering
Philips CE is producing lead-free sets from 1.1.2005
onwards.
IDENTIFICATION
Regardless of special logo (not always
indicated)
One must treat all sets from
onwards, according to the next rule:
Serial Number gives a 9-digit. Digit 2&3 shows the
WEEK, and digit 4 shows the YEAR.
So from onwards=from 1 Jan 2005 onwards
Important note: In fact also products of year 2004
must be treated in this way as long as you avoid
mixing solder-alloys (leaded/ lead- free) . So bes t to
always use SAC305 and the higher temperatures
belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solderpaste is required, please contact the manufacturer
of your solder-equipment. In general use of solderpaste within workshops should be avoided because
paste is not easy to store and to handle.
• Use only adequate solder tools applicable for leadfree solder alloy. The solder tool must be able
• To reach at least a solder-temperature of 400°C,
• To stabilize the adjusted temperature at the solder-
• To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360°C
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400°C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed solder alloy
types (leaded and lead-free).
If one cannot avoid or does not know whether
product is lead-free, clean carefully the solder-joint
from old solder alloy and re-solder with new solder
alloy (SAC305).
• Use only original spare-parts listed in the ServiceManuals. Not listed standard-material (commodities)
has to be purchased at external companies.
015
tip
- 380°C is reached and stabilized at the
1 Jan 2005
1-1-1HK100_SN
• Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for desoldering always use the lead-free temperature
profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be
baked dry. (MSL=Moisture Sensitivity Level). This
will be communicated via AYS-website.
Do not re-use BGAs at all.
• For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
• On our website
www.atyourservice.ce.Philips.com
information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information within
the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
you find more
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
1-1-2HK100_SN
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Machine
Flat Pack-IC
Tweezers
Fig. S-1-2
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
Hot Air Blower
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
To Solid
Mounting Point
CBA
Tweezers
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
1-1-3HK100_SN
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
2. The “●” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-cond uc tors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
<Incorrect>
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
<Correct>
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-1-4HK100_SN
SIGNAL NAME ABBREVIATIONS
Signal NameFunction
4.43MHz4.43MHz clock
A-COMAudio Head Common
A-MODEHi-Fi Tape Detection Signal
AE-HAudio Erase Head
AE-H/FE-HAudio Erase Head
AL+12V
AL+20V/+12V
AL+5V
AMPCCTL AMP Connected Terminal
AMPVccAMPVcc
AMPVREF INV-Ref for CTL AMP
AMPVREF OUTV-Ref for CTL AMP
CCTL AMP Capacit or
C-CONTCapstan Motor Control Signal
C-F/R
C-FG
C-POW-SWCapstan Power Switching Pulse
C-ROTA
C-SYNCComposite Synchronized Pulse
CLKSELClock Select
CTLTo Monitor for CTL AMP Output
CTL (+)
CTL (-)
D-CONTDrum Motor Control Signal
Always +12V with AC Plug
Connected
Always +20V/+12V with AC Plug
Connected
Always +5V with AC Plug
Connected
Audio Mute Control Signal
(Mute=“H”)
Normal Audio Play Back/Record
Signal
A/D Converter Power Input/
Standard Voltage Input
Capstan Motor FWD/REV
Control Signal (FWD=”L”/
REV=”H”)
Capstan Motor Rotation
Detection Pulse
Color Phase Rotary Changeover
SIgnal
Playback/Record Control Signal
(+)
Playback/Record Control Signal
(-)
Signal NameFunction
D-PFGDrum Motor Pulse Generator
D-REC-HDelayed Record Signal
D-V-SYNCDummy V-sync Output
END-STape End Position Detect Signal
FE-HFull Erase Head
FE-H-GNDGround for Full Erase Head
FSC-IN
[4.43MHz]
GNDGround
H-A-COMPHead Amp Comparator Signal
H-A-SW
Hi-Fi-AUDIO(L)Hi-Fi Audio L Head
Hi-Fi-AUDIO(R)Hi-Fi Audio R Head
Hi-Fi-COM Hi-Fi Audio Head Common
Hi-Fi-H-SW
HLFLPF Connected Terminal (Slicer)
IIC-BUS SCL
IIC-BUS SDA
KEY-1Key Scan Input Signal 1
KEY-2Key Scan Input Signal 2
LD-SW
LM-FWD/REVLoading Motor Control Signal
N-A-PB Normal Audio Playback
N-A-REC Normal Audio Recording
OSCinClock Input for letter size
OSCoutClock Output for letter size
OSD-V-INOSD Video Signal Input
OSD-V-OUTOSD Video Signal Output
OSDVccOSDVcc
OSDVssOSD Ground
P-ON+5V+5V at Power-On Signal
P-ON+9V+9V at Power-On Signal
P-ON-LPower On Signal at Low
PB-H-OUTPlayback control/Signal (PB=“H”)
PG-DELAY
POW-SAF
4.43MHz Clock Input
Video Head Amp Switching
Pulse
Hi-Fi Audio Head Switching
Pulse
2
C BUS Control Clock
I
2
I
C BUS Control Data
Deck Mode Position Detector
Signal
Video Head Switching Pulse
Signal Adjusted Voltage
P-ON Power Detection Input
Signal
1-2-1HK100SNA
Signal NameFunction
REC-SAF-SW
REMOTERemote Control Sensor
RESETSystem Reset Signal (Reset=“L”)
RF-SWVideo Head Switching Pulse
S-CLOCKSerial clock
S-CSChip Select Signal
S-DATA-INSerial Data Input
S-DATA-OUTSerial Data Output
S-REELSupply Reel Rotation Signal
Recording Safety SW Detect
(With Record tab=“L”/With out
Record tab=“H”)
SECAM-C-IN
SECAM-FM-
OUT
SECAM-HSECAM Mode at High
ST-S
T-REELTake Up Reel Rotation Signal
TRICK-H
V-ENV
VccVcc
VG+18V
VIDEOVideo Signal
VIDEO(L)-1/2Video L Head 1/2
VIDEO(R)-1/2Video R Head 1/2
VIDEO-COMVideo Head Common
SECAM CHROMA Signal from
PAL/SECAM DETECTOR
PB video Signal to PAL/SECAM
DETECTOR
Tape Start Position Detector
Signal
Trick Play Control Signal
(Trick=“H”)
Video Envelope Comparator
Signal
Always +18V with AC Plug
Connected
VIDEO-INVideo Signal Input
VIDEO-OUTVideo Signal Output
VssVss(GND)
X-INMain Clock Input
X-OUTMain Clock Input
1-2-2HK100SNA
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electri cal adjustm ents are re quired after re placing
circuit components and certain mechanical par ts.
It is impor tant to do these adjustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perfor m these alignment / confirmation procedures, make sure that the tracking control is set in
the center position : Press either "PR -5??" or "PR +"
button on the remote control unit first, then the "B"
button (Front Panel only).
Te st Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (9965 000 14514)
Head Switching Position Adjustment
Purpose:
To determ ine the Head Switching position during
playback.
Symptom of Misadjustment:
May cause Head Switch ing noise or vertical jit ter
in the picture.
Test pointAdj.PointModeInput
J909(V-OUT)
TP504(RF-SW)
GND
Tape
9965 000 14514Oscilloscope
Connections of Measurement Equipment
Main CBA
TP504
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
J909
GND
PLAY
(SP)
6.5H±1H
(416µs±64µs)
Oscilloscope
-----
Spec.
CH1 CH2
Trig. (+)
Figure 1
EXT. Syncronize Trigger Point
CH1
CH2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edg e of the CH1 video out put waveform is at the 6.5H±1H (416µs±64µs) delayed position
from the rising edge o f the CH2 head switching pulse
waveform.
1.0H
6.5H+/-1H (416µs+/-64µs)
Switching Pulse
0.5H
V-Sync
1-3-1HK100EA
BLOCK DIAGRAMS
Servo / System Control Block Diagram
AL+20V/+12V
AL+5V
RESET
1 VG+18V
CN252
VG+18V
3
4 AL+12V
6 AL+12V
8 AL+5V
Q151
+9V REG.
AL+5V
AL+12V
P-ON+9V
AL+20V/+12V
10 C-POW-SW
Q153
P-ON+5V
CN653
TP505 SENS-INH
1 S-CLOCK
3 S-DATA-IN
7 S-CS
8 RESET
2 REMOTE
1 KEY-1
5 S-DATA-OUT
CN505
WF8WF9WF10WF11
Q515
Q152
SDA
SCL
IC502 (MEMORY)
5
6
TO AUDIO
BLOCK DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-H
TO Hi-Fi AUDIO
BLOCK DIAGRAM
A-MODE
Hi-Fi-H-SW
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-H
RF-SW
D-REC-H
IIC-BUS SCL
IIC-BUS SDA
C-ROTA
D-V-SYNC
TO VIDEO
BLOCK DIAGRAM
V-ENV
H-A-SW
C-SYNC
TRICK-H
H-A-COMP
SECAM-H
8
7
14
KEY- 1
:INDICATES A TEST POINT WITH A JUMPER WIRE ACROSS A HOLE IN THE PCB.
:USED TO INDICATE A TEST POINT WITH A COMPONENT LEAD ON FOIL SIDE.
:USED TO INDICATE A TEST POINT WITH NO TEST PIN.
:USED TO INDICATE A TEST POINT WITH A TEST PIN.
TEST POINT INFORMATION
“ “ = SMD
NOTE FOR WIRE CONNECTORS:
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
KEY- 2
REMOTE
IC501
(SERVO/SYSTEM CONTROL)
AL+5V
D555
S-LED
SW507
(WIRE IS SOLDERED DIRECTLY.)
LD-SW
MAIN CBA
CTL(+)
LD-SW
9
95
AL+5V
CN504
5 CTL(+)
67
66
S-CLOCK
S-DATA-IN
CTL(-)
94
6 CTL(-)
65
64
S-CS
S-DATA-OUT
34
RESET
END-S
ST-S
10480
60
C-POW-SW
T-REEL
S-REEL
79
END-S
TP502
PS502
Q506
S-REEL
T-REEL
75
P-ON-L
CTL
97
CTL
TP503
AL+5V
PG-DELAY
2
VR501
SW-POINT
83
AUDIO-MUTE-H
REC-SAF-SW
31
SW506
AL+5V
REC-SAFETY
CAPSTAN MOTOR
P-ON+5V
AL+20V/+12V
CN502
AL+20V/+12V
1
2 P-ON+5V
33
71
72
19
32
A-MODE
Hi-Fi-H-SW
C-FG
C-F/R
8778768177
C-F/R5C-CONT6GND7LM-FWD/REV
3 C-FG
4
IIC-BUS SCL
IIC-BUS SDA
C-CONT
LM-
MOTOR
DRIVE
CAPSTAN
D-REC-H
FWD/REV
D-CONT
D-CONT9D-PFG10GND11AL+12V
8
CIRCUIT
MOTOR
15
18
RF-SW
C-ROTA
D-PFG
90
M
17
16
13
H-A-SW
D-V-SYNC
H-A-COMP
AL+12V
VG+18V
VG+18V
12
M
6
58
V-ENV
C-SYNC
61
62
TRICK-H
SECAM-H
ACE HEAD ASSEMBLY
(DECK ASSEMBLY)
CONTROL
HEAD
Q504
ST-S
SENSOR CBA
Q503
1-4-1
END-S
SENSOR CBA
M
PG
SENSOR
DRUM
CYLINDER ASSEMBLY
MOTOR
LOADING
MOTOR
HK100BLS
Video Block Diagram
MODE: SP/RECPB-VIDEO SIGNAL DVD VIDEO SIGNAL
VIDEO (L)-1
HEAD
VIDEO (R)-1
HEAD
VIDEO (L)-2
HEAD
CYLINDER ASSEMBLY
VIDEO (R)-2
HEAD
MAIN CBA
REC-VIDEO SIGNAL
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
:INDICATES A TEST POINT WITH A JUMPER WIRE ACROSS A HOLE IN THE PCB.
:USED TO INDICATE A TEST POINT WITH A COMPONENT LEAD ON FOIL SIDE.
:USED TO INDICATE A TEST POINT WITH NO TEST PIN.
:USED TO INDICATE A TEST POINT WITH A TEST PIN.
TEST POINT INFORMATION
(DECK ASSEMBLY)
TO SERVO/SYSTEM
CONTROL BLOCK
456
123
CN251
VIDEO(L)-1
VIDEO(L)-2
VIDEO(R)-1
VIDEO-COM
969594
7978
4643
6968
SERIAL
DECORDER
65
50
55
P
R
Y. DELAY
VIDEO-COM
93
SP
HEAD
AMP
SP
EP
LUMINANCE
SIGNAL
PROCESS
AGC
BYPASS
VIDEO(R)-2
908988
WF1
EP
CHARA.
RF-SW
D-REC-H
RF-SW
TP504
87
80
HEAD
AMP
D-REC-H
REC FMAGC
+
Y
C
CCD 1H DELAY
1/2
FBC
INS.
DIAGRAM
H-A-SW
C-ROTA
D-V-SYNC
H-A-COMP
83
71
62
70
H-A-SW
D-V-SYNC
H-A-COMP
RF-SW/C-ROTA
RPRP
CHROMINANCE
SIGNAL
PROCESS
V-ENV
C-SYNC
84
V-ENV
Y/C
PR
TRICK-H
SECAM-H
67
C-SYNC
VXO
MIX
AGC
PAL/SECAM
DETECTOR
IC370 (PAL/SECAM DECTECTOR)
1
171418216
29
28
44
PB-H OUT
21
WF2
C-PB
TP301
25
2928
X301
4.43MHz
5859
“ “ = SMD
NOTE FOR WIRE CONNECTORS:
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
(WIRE IS SOLDERED DIRECTLY.)
WF3
IC501 (OSD)
OSD-V-OUT
J909
COLOR
-IN
OSD
CHARACTER
MIX
52
BUFFER
Q301
VIDEO SIGNAL PROCESS
/HEAD AMP
IC301
CN253
WF7
VIDEO-OUT 9
50
VIDEO-IN7
WF6
1-4-2
HK100BLV
Audio Block Diagram
Mode : SP/REC
ALC
12
DET
11
MUTE
LINE
ALC
AMP
REC-ON
SERIAL
DECODER
71
68 69
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-H
PB-AUDIO SIGNALREC-AUDIO SIGNAL
MAIN CBA
15
IC301
(AUDIO SIGNAL PROCESS)
INV
PB-ON
P
R
ATT
98
7
EQ
AMP
SP/LP-ON
5
6
P-ON+5V
Q404
Q403
BIAS
OSC
REC
AUTO
1
AMP
100
3
BIAS
2
Q406
16
AUDIO HD-SW
CONTROL
P-ON+5V
SWITCHING
D-REC-OFF
Q405
Q401
(PB=ON)
NOTE FOR WIRE CONNECTORS:
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
(WIRE IS SOLDERED DIRECTLY.)
“ “ = SMD
N-A-PB
N-A-REC
TO Hi-Fi AUDIO
BLOCK DIGRAM
1-4-3
CN504
ACE HEAD ASSEMBLY
(DECK ASSEMBLY)
AUDIO-PB/REC
4
3 A-COM
1 AE-H
2 AE-H/FE-H
AUDIO
HEAD
AUDIO
ERASE
HEAD
CN501
2 FE-H
FE HEAD
FULL
ERASE
HK100BLA
1 FE-H-GND
HEAD
Hi-Fi Audio Block Diagram
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
CN253
73
MUTE-ON
AUDIO(R)-OUT
AUDIO(L)-OUT
5
4
74
767775
WF5
MUTE-ON
A-MODE
IIC-BUS SCL
IIC-BUS SDA
Q451
37
38
LOGIC
FROM/TO
SERVO/SYSTEM
CONTROL BLOCK
AUDIO-MUTE-H
21
53
MUTE
Hi-Fi-H-SW
39
Hi-Fi
AUDIO
(R) HEAD
CYLINDER
ASSEMBLY
(DECK ASSEMBLY)
-COM 8
CN251
Hi-Fi-AUDIO(R)7Hi-Fi
242627
R
Hi-Fi
9
Hi-Fi-AUDIO(L)
L
AUDIO
(L) HEAD
MAIN CBA
R-CH
SW
OUTPUT
SELECT
ALC
(Hi-Fi AUDIO SIGNAL PROCESS)
BPF
COMP
NOISE
R-CH
ENV
NOISE
PPR
PNR
DET
DET
34 33
LIM
L-CH
DET
PNR
ALC
BPF
COMP
SW
NOISE
+
HOLD
PULSE
15
VCO
LIMDEV
DO
R
L-CH
LPF
MIXV/I
VCO
LIMDEV
47
48
LPF
14
NOTE FOR WIRE CONNECTORS:
“ “ = SMD
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
(WIRE IS SOLDERED DIRECTLY.)
IC451
1-4-4
52
2AUDIO(R)-IN
CN253
WF4
1AUDIO(L)-IN
6
78
80
N-A-REC
N-A-PB
TO AUDIO BLOCK
HK100BLH
SCHEMATIC DIAG RAMS / CBA'S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using
replacement components rated for higher voltage,
wattage, etc. Replacement parts that have these special safety character istics are id entified in th is manual
and its supplements; electrical components having
such features are identified by the mark " ! " in the
schematic diagram and the par ts list. Before replacing
any of these components, read the parts list in this
manual carefully. The use of substitute replacement
parts that do not have the same safety characterist ics
as specified in the pa r ts list may create sh ock, fire, or
other hazards.
Capacitor Temperature Markings
Mark
(B)
(F)
(SR)
(Y)
Capacity
change rate
±10%
±30 - 80%
±15%
±22.5%
Capacitors and transistor s are represente d by the following symbols.
1. Do not use the part number shown on th ese drawings for ordering. The correct part number is
shown in the parts list, and may be slightly different
or amended since these drawings were prepared.
2. To maintain original function and reliability of
repaired units, use only orig inal replacement par ts
which are listed with their part numbers in the parts
list section of the service manual.
3. How to read converged lines.
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to the line number
"1" of the area "D3".
2. "1-B1" means that line number "1" goes to the line number
"1" of the area "B1".
4. All resistance values are indicated in ohms
3
(K=10
, M=106).
5. Resistor wattages ar e 1/4W or 1/6 W unless otherwise specified.
6. All capacitance values are indicated in µF
-6
(P=10
µF).
7. All voltages are DC voltages unless otherwise
specified.
8. Voltage indications for PLAY and REC modes on
the schematics are as shown below.
3
AREA D3
2
1
AREA B1
1-D3
ABCD
1-B1
< PCB Symbols >
(Top View) (Bottom View)
+
(Bottom View)
Transistor or Digital Transistor
E C B
(Top View)
NPN Transistor
E C B
(Top View)
NPN Digital Transistor
E C B
Electrolytic Capacitor
(Top View)
E C B
(Top View)
E C B
Unit: Volts
The same voltage for
both PLAY & REC modes
PNP Transistor
PNP Digital
Transistor
PLAY mode
REC mode
5.0
231
5.0
(2.5)
Indicates that the voltage
is not consistent here.