The table below gives the summary of all the files in the service package.
Please refer to this document for the various information required.
Chapter No. Reference Document & Instructions
Chapter 1 Technical Specifications and
Connection Facilities
"DVDR3430V_3432V
Technical Specification_ver2.1_1SEP06.pdf"
Chapter 2 Safety Information, General notes
& Lead-free Requirements
Safety_requirements
.pdf
Chapter 3 Directions for Use / QUG Direction for use is available at website:
HTUwww.p4c.philips.comUTH
DVDR3430V_3432V_
euqsg_eng_22171_wk635.pdf
Chapter 4 Mechanical Instructions
DVDR3430V_Euro_Di
smantling_Inst_wk628_ver2.0.pdf
to remove the tape from loader_wk635_ver1.0.pdf"
Chapter 5 Firmware Upgrading
Euro Firmware Upgrade VER2.0_1SEP06.pdf"
Chapter 6 Block Diagram & Wiring Diagram
Chapter 7 Electrical Circuits & Layout
drawings
Refer to “2_Drawings.zip for the various pc
board’s circuit & layouts.
Chapter 8 Circuit Descriptions
Cctdescription_wk628.pdf
"Manual Procedure
"DVDR3430V_3432V
DVDR3430V_Eu_Bloc
k_diagram.pdf
DVDR3430V_3432V_
DVDR3430V_Wirin
3139-249-35241.pdf
Chapter 9 Exploded view & Service parts list
Funai VCR Module (2422 549 01124)
(For Information only)
DVDR3430V_Explode
dview_wk628.pdf
DVDR3432V_3430V_
ServicePartlistwk635.pdf
VCR_Module_HK100
ED_DVDR3430V_Eur_2006-6-14.pdf
CLASS 1
LASER PRODUCT
2. Safety Information, General Notes & Lead Free Requirements
2.1 Safety Instructions
2.1.1 General Safety
Safety regulations require that during a repair:
• Connect the unit to the mains via an isolation transformer.
• Replace safety components, indicated by the symbol
only by components identical to the original ones. Any
other component substitution (other than original type)
may increase risk of fire or electrical shock hazard.
Safety regulations require that after a repair, you must return
the unit in its original condition. Pay, in particular, attention to
the following points:
• Route the wires/cables correctly, and fix them with the
mounted cable clamps.
• Check the insulation of the mains lead for external
damage.
• Check the electrical DC resistance between the mains
plug and the secondary side:
1. Unplug the mains cord, and connect a wire between
the two pins of the mains plug.
2. Set the mains switch to the ‘on’ position (keep the
mains cord unplugged!).
3. Measure the resistance value between the mains
plug and the front panel, controls, and chassis
bottom.
4. Repair or correct unit when the resistance
measurement is less than 1 MΩ.
5. Verify this, before you return the unit to the customer/
user (ref. UL-standard no. 1492).
6. Switch the unit ‘off’, and remove the wire between the
two pins of the mains plug.
2.1.2 Laser Safety
This unit employs a laser. Only qualified service personnel
may remove the cover, or attempt to service this device (due
to possible eye injury).
2.2 Warnings
2.2.1 General
• All ICs and many other semiconductors are susceptible
to electrostatic discharges (ESD,
during repair can reduce life drastically. Make sure that,
,
during repair, you are at the same potential as the mass
of the set by a wristband with resistance. Keep
components and tools at this same potential.
Available ESD protection equipment:
– Complete kit ESD3 (small tablemat, wristband,
connection box, extension cable and earth cable)
4822 310 10671.
– Wristband tester 4822 344 13999.
• Be careful during measurements in the live voltage
section. The primary side of the power supply, including
the heatsink, carries live mains voltage when you
connect the player to the mains (even when the
player is ‘off’!). It is possible to touch copper tracks and/
or components in this unshielded primary area, when
you service the player. Service personnel must take
precautions to prevent touching this area or components
in this area. A ‘lightning stroke’ and a stripe-marked
printing on the printed wiring board, indicate the primary
side of the power supply.
• Never replace modules, or components, while the unit is
‘on’.
2.2.2 Laser
• The use of optical instruments with this product, will
increase eye hazard.
• Only qualified service personnel may remove the cover or
attempt to service this device, due to possible eye injury.
• Repair handling should take place as much as possible
with a disc loaded inside the player.
• Text below is placed inside the unit, on the laser cover
shield:
Note: Use of controls or adjustments or performance of
procedure other than those specified herein, may result in
hazardous radiation exposure. Avoid direct exposure to beam.
CAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM
ADVARSEL
SYNLIG OG USYNLIG LASERSTRÅLING VED ÅBNING UNDGÅ UDSÆTTELSE FOR STRÅLING
ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES UNNGÅ EKSPONERING FOR STRÅLEN
VARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA EJ STRÅLEN
VARO! AVATTAESSA OLET ALTTIINA NÄKYVÄLLE JA NÄKYMÄTTÖMÄLLE LASER SÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN
VORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEÖFFNET NICHT DEM STRAHL AUSSETSEN
DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAM
ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU
Figure 2-2
2.3 Lead Free Requirement
Information about Lead-free produced sets
Philips CE is starting production of lead-free sets from
1.1.2005 onwards.
INDENTIFICATION:
Regardless of special logo (not always indicated)
One must treat all sets from
next rules.
Example S/N:
1 Jan 2005 onwards, according
• Special information for BGA-ICs:
- always use the 12nc-recognizable soldering temperature
profile of the specific BGA (for de-soldering always use the
lead-free temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called ‘drypackaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening, dependent
of MSL-level seen on indicator-label in the bag, the
BGA-IC possibly still has to be baked dry. (MSL=Moisture
Sensitivity Level). This will be communicated via AYSwebsite.
Do not re-use BGAs at all.
•
For sets produced before 1.1.2005 (except products of
2004), containing leaded solder-alloy and components,
all needed spare-parts will be available till the end of the
service-period. For repair of such sets nothing changes.
Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is
the week number, so in this case 1991 wk 18
So from 0501 onwards = from 1 Jan 2005 onwards
Important note: In fact also products of year 2004 must be treated in this way as long as you
avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher
temperatures belong to this.
Due to lead-free technology some rules have to be respected by the
workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with order
code 0622 149 00106. If lead-free solder-pate is required,
please contact the manufacturer of your solder-equipment.
In general use of solder-paste within workshops should be
avoided because paste is not easy to store and to handle.
•
Use only adequate solder tools applicable for lead-free
solder alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C,
o To stabilize the adjusted temperature at the solder-tip
o To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around 360°C
– 380°C is reached and stabilized at the solder joint.
Heating-time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C otherwise wear-out of
tips will rise drastically and flux-fluid will be destroyed. To
avoid wear-out of tips switch off un-used equipment, or
reduce heat.
• Mix of lead-free solder alloy / parts with leaded solder alloy
/ parts is possible but PHILIPS recommends strongly to
avoid mixed solder alloy types (leaded and lead-free).
If one cannot avoid or does not know whether product is
lead-free, clean carefully the solder-joint from old solder
alloy and re-solder with new solder alloy (SAC305).
• Use only original spare-parts listed in the Service-Manuals.
Not listed standard-material (commodities) has to be
purchased at external companies.
•
On our website www.atyourservice.ce.Philips.com you
find more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs used in Philips-sets
You will find this and more technical information within the
“magazine”, chapter “workshop news”.
For additional questions please contact your local repair-helpdesk.
1.Technical Specifications and Connection Facilities
V
1.1 PCB Locations
Fronts Boards
HS Drive
Module
Analogue
Board
Digital Board
(below Basic
Engine)
PSU Board
1.2 Read / Write Speed
Type of Disc(Function) Disc Rotation Speed
Read Speed CD 7X CAV
Read Speed DVD 4X CAV
Write Speed DVD+R/RW 2.4X ZCAV
Write Speed DVD-R/RW 2X
1.3 General:
Mains voltage : 220V-240V
Mains frequency : 50Hz
Standby Power consumption : <3W
1.4 RF Tuner
Test Equipment :Fluke 54200 TV Signal generator
Test Stream:PAL BG Philips Standard test pattern
1.4.1.1 System:
PAL B/G, PAL D/K, SECAM L/L’, PAL I
1.4.1.2 RF – Loop Through
Frequency range : 43MHz-860MHz
Gain: (ANT IN-ANT OUT) : -4dB ± 2dB
1.4.1.3 Receiver:
PLL tuning with AFC for optimum reception
Frequency range : 45.25MHz - 857MHz
Sensitivity at 40dB S/N
(video unweighted) : ≤ 40dBµV at 75Ω
(high end)
≤ 60dBµV at 75Ω
(low end)
1.4.1.5 Video Performance:
Channel 25 / 503,25MHz,
Test pattern: PAL BG PHILIPS standard test pattern,
RF Level 74dBV
Measured on SCART 1
Frequency response : 0.1MHz - 4.00MHz ± 3dB Group delay (0.1MHz-4.4MHz) : 0 nsec ± 150 nsec
1.4.1.6 Audio Performance:
Audio Performance Analogue – HiFi:
Frequency response at SCART 1
(L + R) output : 100Hz -12kHz / 0 ± 3dB
Audio Performance NICAM: Frequency response at SCART 1
(L + R) output : 40 Hz – 15 kHz / 0 ± 3dB
S/N according to DIN 45405,7,1967
and PHILIPS standard test pattern
video signal : ≥ 40dB Harmonic distortion (1kHz) : ≤ 1.5%
1.4.1.7 Tuning
Automatic Search Tuning
scanning time without antenna : 3min. typical
stop level (vision carrier) : ≥ 37dBµV
Maximum tuning error(drift) during
operation : ± 100kHz
Tuning Principle
Automatic B, G, I, DK and L/L’ detection .Manual selection in “STORE” mode
1.5 Analogue Inputs / Outputs
1.5.1 SCART 1(Connected to TV)
Pin Signals:
1 - Audio-out R 1.8V RMS
2 - Audio-out R
3 - Audio-out L 1.8V RMS
4 - Audio GND
5 - Blue / Chroma GND
6 - Audio- in L
7 - Blue-out 0.7Vpp ± 0.1V into 75 W
8 - Function switch < 2V = TV
> 4.5V / < 7V = asp. Ratio 16:9 DVD
> 9.5V / < 12V = asp. Ratio 4:3 DVD
9 - Green GND
10 – P50 control not use
11 – Green out 0.7Vpp ± 0.1V into 75W (*)
12 - NC
13 - Red / Chroma GND
14 - Fast switch GND
15 - Red-out / Chroma-out 0.7Vpp ± 0.1V into 75W (*)
16 - Fast switch
RGB / CVBS or Y out < 0.4V into 75W = CVBS
>1V / < 3V into 75W = RGB
17 - Y/CVBS GND OUT
18 - CVBS GND IN
19 - CVBS-out 1Vpp ± 0.1V into 75W(*)
20 - CVBS-in
21 - Shield
1.5.2 SCART 2 (Connected to AUX)
Pin Signals:
1 - Audio-out R 1.8V RMS
2 - Audio-in R
3 - Audio-out L 1.8V RMS
4 - Audio GND
5 - Blue / Chroma GND
6 - Audio-in L
7 - Blue-in
8 - Function switch
9 - Green GND
10 - NC
11 - Green-in
12 - NC
13 - Red / Chroma GND
14 - Fast switch GND
15 - Red-in/Chroma-in
16 - Fast switch
RGB / CVBS or Y in
17 - CVBS-OUT GND
18 – Y/CVBS in GND
19 - CVBS out sync 1Vpp ± 0.1V into 75Ω
20 – CVBS in / Y-in
21 – Shield
1.5.3 Audio/Video Front Input Connectors
Audio – Cinch
Input voltage : 2.2Vrms
Input impedance : > 10kΩ
Video – Cinch
Input voltage : 1Vpp ± 3dB
Input impedance : 75Ω
Video – YC (Hosiden)
According to IEC 933-5
Superimposed DC-level on pin 4(load >100kΩ)
<2.4V is detected as 4:3 aspect ratio
>3.5V is detected as 16:9 aspect ratio
Input voltage Y : 1Vpp ± 3dB
Input impedance Y : 75Ω
Input voltage C : 300 mVpp ± 3dB
Input impedance C : 75Ω
1.6 Digital Inputs / Outputs
1.6.1 Digital Output
Digital Audio – Coaxial
LCM : according IEC 60958
MPEG 1,MPEG2,AC3 : according IEC 61937
DTS : according IEC 61937+addendum
Manual Procedure to remove the tape from the loader
Immediate action must be done to remove the Video Cassette on the set manually as described belo w :
Note : Item number refers to the Deck Parts List in VCR Module
(12NC:2422 549 01124) unless otherwise stated
1. Turn the B525 (LDG Belt MK11 ) in the direction
indicated by the arrow below in figure 1:
B525
Figure 1:Turning B525 by hand
2. Upon hearing the click sound , the Clip[B587] holding the VCR will be released as shown in figure 2.
Figure 2:Clip 587 released
3.The tape will be slackened as shown in figure 3.
Figure 3:Tape slackened
4.The video casette slowly reversed and raised to loading position in figure 4 .
Figure 4 :Video Casette Slowly reversed
5. Fold the slack of the video by hand to minimize damage by the front dust cover
cover upon approaching the B354 & B355 position will be closed and comes out of the Door Flap(112 of
exploded view of DVDR3430V)
of Videocasette.The front
Figure 5:The dust cover slowy cover the tape due to spring action
of the dust cover
6.Remove the cassette as you normally does from the front loading position
.
Mechanical Instructions
Note : The position numbers given here refers to the Exploded view
1.1 Dismantling of the DVD Tray Cover manually
1) Insert a screw-driver into the slot provided at the bottom of the set and
push in the direction as shown in figure 1 to unlock before sliding the Tray Cover 110
out.
Figure 1:Unlock DVD tray
1.2 Dismantling of the Basic Engine (Drive D4.5)
1) Remove 8 screws to loosen Top cover 240 .
2) Remove 4 screws to loosen the Basic Engine Holder D4.5
As shown in Figure 2.
Figure 2- Remove Basic Engine mounting
3) Remove 4 screw to detach the Holder from the Basic Engine and unscrew the Heatsin k
plate .
Basic Engine Service position as show once heatsink plate removed in Figure 4-4.
Remove the
Heatsink plate
Figure 3 – Basic Engine Service Position
1.3 Dismantling of the PSU Board
4) Remove 4 screws to loosen the PSU Board 1007 as shown in Figure …
5) Service position for PSU Board is given in Figure 8.
Figure 4 – Remove PSU mounting
1.5 Dismantling of the Digital Board
Remove 4 screws to loosen the Digital Board 1004 as shown in Figure 4-5.
Figure 5 :Remove Digital Board Mounting
1) Service Position for Digital Board is given in Figure 6.
Figure 6: Digital Board Service Position
1.5 Dismantling of the Analogue Board
1) Remove screws from the rear panel 230 to detach Analogue Board shown
in Figure 7.
2) Service Position of Analogue Board is given in Figure 8.
Figure 7:Detach Analogue Board
Figure 8 :Analogue Board Service Position
Insulation sheet
1.6 Dismantling of the VHS Drive Module
Note:For items name& number mentioned below , please refer to VCR
Module HK100ED (12NC:2422 549 01124)
1) Detach VHS Drive Module by unscrewing 5 screw shown on Figure 9
Figure 9:Remove VHS Module
2) While unscrewing the cross screws , great care must be taken with the
screw located near the helical drum at the VHS module to prevent
accidental scratches to the drum shown in figure 10.
Figure 10:Caution area
3) Make the VCR module upright and Insulation sheet must be inserted onto
the drum to prevent damage by contact to the Recorder frame shown in
Figure 11.
Insulation Sheet
Figure 11:Insulation sheet for precaution
Service Position of the VCR module is given in Figure 12.
Insulation
Sheet
Figure 12:Service Position of the VHS Drive Module
Firmware Upgrading
A. Preparation to upgrade firmware:
1. Unzip the zip-archive file
2. Copy the files into different folder for burning into separate CD-R/CDRW.
3. Start the CD Burning software and create a new CD project (data disc) with the following settings:
File system: Joliet
Format: MODE 2: CDROM XA
Recording mode: SINGLE SESSION (TRACK-AT-ONCE), FINALIZED CD
Note: Long file name is necessary for the preparation of the upgrade disc
4. Place the file into the root directory of the new CD project.
5. Burn the data onto blank CDR or CD-RW.
B. Procedure to apply the Drive upgrade:
1. Open the tray and load the Upgrade CDROM .
2. The tray closes and set will display:
“DRV UPG”
3. The OSD will display
“Loader Software Upgrade
Software Upgrade Disc detected . Select OK to start upgrading or CANCEL to exit.”
4. Click on the OK button .
5. The set will display:
“DRIVE UPGRADING”
With the OSD display
“Upgrading Software .Please Wait.Do not switch off the power.”
The whole process takes less than 5 minutes
6. When the upgrade is completed the tray will open automatically and the set will display:
“Loader Upgrade process has completed successfully .Press <OK> to reboot system.”
7. The tray open and the set will display:
8. The tray will display:
9. The OSD will display
10. Click on the OK button .
11. The set will display :
“DRV OK”
“SW UPGD”
“Software Upgrade Disc detected.Select OK to start upgrading or CANCEL to exit .”
“Upgrading SW”
12. And the OSD will display
“Upgrading Software .Please Wait.Do not switch off the power.”
The whole process takes less than 5 minutes
13. When the upgrade is completed the tray will open automatically and the set will display:
“System is successfully upgraded.Remove disc from tray and reset system.”
14. The tray open and the set will display:
“SW DONE”
15. Press <OK> and the set goes to standby .
B. How to read out the firmware version to confirm set has been upgraded:
1. Power up the set
2. Ensure no disc inside the loader,if no ,open the tray to remove the disc and close the tray.
3. Press <0> <0> <0><9> in succession
4. Press <OK> button
5. The TV connected to the set will display:
“DVDR3430V_EU_V04_02 , Region :2 , Drive 45.04.05
Build: 0097_PHILIPS_V03 JAN 11 2006 , 09:28:29 Stroke:31 ”
and the tray will open automatically for user to remove CD-ROM.
Note: Do not press any buttons or interrupt the mains supply during the upgrading
process, otherwise the set may becomes defective.
1.1 PSU Board
1.1.1General
Mains
Connection
The PSU board provides the following connection to the rest of the set:
• Connector A(Connector J1 on Analogue Board): Supply/Signal to Analog Board Conn. 1101
• Serve as supply to Digital Board
Pin
1
2
3
4
5
• Connector B(Connector J2 on Analogue Board): Supply/Signal to Analogue Board Conn. 1102
Pin Supply/
1 VGN
2 5N
3 GND
4 IPFAIL
5 GND
6 12V
Supply/
Signal
12V
GND
5V
3.3V
GND
Signal
Remarks
Remarks
HIGH>4.0v =
power good
LOW<0.5v =power
fail
The Mains must be disconnected from the Set before attempting the procedure mentioned
below:
The PSU is designed with short-circuit protection that will shutdown the power supply. When this
happen, the voltage stored in capacitor C1 and C40 will prevent the Pow er Su pply to turn-on,
therefore they must be discharged with a screwdriver with high electrical isol ation handle before the
PSU can function normally again.
Note :During the process of discharging the capacito rs ,spark can be observed which is typical of
the high voltage stored in Capacitor C1 and C40.
1.2 Front Board (Panel – Display + Key)
1.2.1 General
This board consists of the following parts:
• Slave µP
• Frontend (Audio & Video)
• VFD Heater voltage Generator
1.2.2 FIP Control Driver (IC 7105 : UPD16316GB)
The core element of the Front Display + Key board is the slave µP.
It runs on a 5V supply and is responsible for the following functions:
• Interface with the Domino chip on the Digital Board
• Evaluation of the keyboard matrix within Front board
• Decoding the remote control commands from the infra-red receiver
• Activation and control of the display
• Timer Wake-up activation
It runs on two clock frequencies namely:
• 5MHz for normal operation
• 32.768KHz for the real time clock
1.2.3 Interface to the Domino chip
It communicates with the Domino Host on the Digital board via a 6-wire synchonous serial interface. The Host
is always the master to generate the communication clock to the slave µP irrespective of the direction of data
transfer.
1.2.4 Evaluation of the keyboard matrix
A key matrix is used on the Front board. The FIP control driver does the key-scanning with FIP9 - FIP24 (pin
23-26 and 29-40) as output and KEY_A - KEY_C (pin 41-43) as input. Each key is assigned a key code based
on the output and input ports, and the slave µP will do the evaluation by getting the key codes.
1.2.5 IR receiver and signal evaluation
The IR receiver on the Front Board contains a selectively controlled amplifier as well as a photodiode. The
photo-diode changes the received infrared transmission to electrical pulses, which are then amplified and
demodulated. On the output of the IR receiver, a pulse sequence with TTL-level, which corresponds to the
envelope curve of the received IR remote control command, can be measured. This pulse sequence is fed into
the slave µP for further processing via pin 13.
The VFD is fully controlled and driven by the FIP control driver.
1.2.7 VFD Heater Voltage Generator
The oscillator circuit provided by [5100, 2101, 2102 & 7100] provides the necessary sine wave signal for
transistors [7101, 7102 & 7103] to generate the 50% duty-cycle 48KHz AC square-wave signal for the filament
of the VFD.
1.2.8 Timer Wake-up activation
During the Standby mode, the FIP ctrl driver provides a wakeup call (POWER_CTL-line switches to high) to the
Domino Host on the Digital Board. It will then starts up and asks for the wake-up reason.
1.3 Analog Board
1.3.1 General
The pc board consists of the following parts:
• Fan Control (optional)
• Power Supply Unit
• Tuner Frontend
• Audio ADC/DAC
1.3.2 Power Supply Unit Interface
This power supply unit Interfacing interfaces with a external power supply board ,draws the required voltage
level to the various supply lines to the requirement mentioned below:
The following are the various supply lines provided:
• 3V3SW to CU, DAC_ADC, Digital Board
• 5V to IOA, IOV, CU, CINCH, MSP, DIGIO and FV
• 5N to MSP (provision only) and Digital Board (provision only)
• 5VE to Basic Engine
• 5V_BE to Digital Board
• 5NSTBY to IOA, CINCH and DAC_ADC
• 5VSTBY to IOA, IOV, FV, MSP, DAC_ADC, Front Board
• 8VSTBY to MSP
• 12V to Digital Board,VCR module
• 12VSTBY to CU, IOV, DAC_ADC, Front Board
• 12VE to Basic Engine and Digital Board (provision only)
• 33VSTBY to FV
• VGNSTBY to Front Board
• 21V to VCR module loader motor
Standby modes:
In Standby mode the STBY control line is low, switching off the 3V3SW, 5V, 5N (provision), 5VE, 12V and 12VE
supply and thus reducing the power consumption.
1.3.3 Tuner Frontend [1151 : TMQZ2]
It has a RF IN for antenna connection and RF OUT which provides a RF loop through for connection to the TV.
The Frontend ( Tuner & IF-demodulator ) is controlled by I
Domino Host on the Digital board.
Complete video processing is done in this unit and the video output (CVBS) is taken out from the [VIDEO_OUT]
pin 13 via a transistor as CVBS_TV-line to the Video I/O circuitry. The audio-IF component SIF1 is taken out
from the [SIFOUT] pin 10 for the demodulation by the Multi-sound processor (MSP).
1.3.4 Audio demodulator
The sound demodulation is done by the MSP3415 [7315], which is also fully controlled via I
Domino Host. The audio signals are available at pin 26 and pin 27 and fed as AFER- & AFEL- line to the audio
I/O for further processing.
Audio Routing
2
C (SCL_5V- and SDA_5V-) lines coming from the
2
C bus by the
1.3.5 Audio routing
The sound processing is always done in stereo (that means separate left- and right- channel) and the complete
switching is realized by using HEF4052 which is a dual four-to-one multiplexer and MSP3415G which is a multisound processor.
a) Scart 1 – Output path
The multiplexer [7311] selects either signals from the Scart 2 Input (AIN2L/AIN2R) or the Audio DAC
(ALDAC/ARDAC) as the output source for Scart 1 (AOUT1L/AOUT1R).
b) Scart 2 – Output path
The MSP [7315] selects either signals from the Scart 1 Input (AIN1L/AIN1R), the Audio DAC (ALDAC/ARDAC)
or the Tuner Frontend as the output source for Scart 2 (AOUT2L/AOUT2R).
c) Record path (DVDR Recording )
The record-selector [7311] selects either signals from the Scart 1 Input (AIN1L/AIN1R), Scart 2 Input
(AIN2L/AIN2R), Front Cinch (AINFL/AINFR) or the MSP (AFEL/AFER) and routes to the audio ADC
(ALADC/ARADC) for record purposes. The switch is controlled via RSA1 and RSA2 signals coming from the
MSP.
d) Record path (VCR Recording )
Another record-selector Multiplexer HEF4052B [7319] , selects either audio signal from left (ALDAC) and right
(ARDAC) (from DVDRW), with PRE_R and PRE_L audio signal (from all external source other than DVDRW)
and routes to VCR for record purposes . The switch is controlled via V_AUD_SEL and V_AUD_MUTE signals
coming from the STV6618 matrix.
1.3.6 Audio ADC/DAC
The conversion of analog audio signals from the record-selector [7311] outputs (ALADC/ARADC) is done via
UDA1361TS [7704]. This IC can process input signals up to 2V
input pins. All required clock signals are generated on the digital board and only the audio data (A_DAT-line)
are routed to Digital board for further processing.
The transformation of digital audio back into analog domain is done by CS4351 [7411]. All necessary clock
signals are coming from the digital board and digital audio data (D_DATA0-line) are converted into analog
signals (pin 15 and 18). The output signals from the audio DAC part (ALDAC/ARDAC) are directly routed to the
rear cinch sockets. To avoid plops and any other audible noise on the output muting circuits are implemented
for each channel.Muting for the various other output lines are done via AKILL & BKILL-lines which is a
combination of the D_KILL from the Digital board and POWER_FAIL from power supply and AMUTE & BMUTE
(digital silence mute) from DAC-part.
VIDEO ROUTING OF DVDR3430V
by using external resistors in series to the
rms
1.3.7 Video-routing (DVDR Recording)
2
A matrix switch STV6618 [7210] controlled by the Domino Host via I
C-bus is used for Video I/O switching. All
used outputs excluding pin 21 (Y/CVBS-REC) have a 6dB-amplification and a 75 ohms-driver-stage inside.
This IC also includes several digital outputs, which are used for switching purposes on the Analog board.
This matrix switch routes the selected inputs to the correct output lines for TV viewing and further processing in
the Digital board.
The record selector inside the switch selects between the inputs from Tuner Frontend (CVBS_TV), CVBS
Scart1 (CVBSIN1), CVBS Scart2 (CVBSIN2) or D_CVBS from the DENC (on Digital board). The output signal
CVBS_RE together with the other signals CVBS_FIN, Y_FIN & C_FIN from the Front and RCB from Scart2 are
routed directly to the VIP (on Digital board) for further processing.
The signals D_C and D_Y are fed through [7216] (6dB amplification) and D_C via transistors [7221 & 7222] as
driver to the S-Video output socket. Likewise the signal D_CVBS is fed through [7216] (6dB amplification) to
the rear CVBS cinch socket.
1.3.8 Video-routing (VCR Recording)
On the other hand, 3-input Video SW NJM2235M[7208] selects Output from pin 21 of STV6618D[7210]
With CVBS_FIN from connector 1206 on Analog Board ,both Video routing signals is controlled by VCR_SW
on pin 18 of STV6618D[7210] .
1.4 Digital Board
The Digital Board is based on the highly integrated LSI ‘Domino’ BGA chip (Ball Grid Array), DMN-8602. This IC
has an on-chip ATAPI controller and integrates an analog video encoder, and provides build-in support for nonsimultaneous progressive and interlaced video output. A 1394 link layer function is also integrated so a simple
external physical layer device is required. The DMN-8602 also has a set of integrated USB Physical Layer
Interface.
The board encodes and multiplexes the analogue video and digital uncompressed audio (I
stream. This MPEG2 stream is formatted for recording by the DVD+RW engine. In the playback, the board will
decode the MPEG2 video into analogue video. In addition, a DV stream can be received via IEEE 1394 (i-Link),
and transformed to MPEG2 format.
2
S) into an MPEG2
1.4.1 Record Mode
1.4.1.1 Video Part
The analogue video input signals CVBS, YC and RGB are routed via the board to connector 1521 and sent to
Video Input Processor, L2146PFP [7401].
The digital video input signals from the DV-in on the Front board are routed from connector 1521 via the IEEE
1394 PHY IC [7301] to the Domino chip [7101].
The Video Input Processor encodes the analogue video to digital video stream (CCIR656 format). The output
stream, named VID_D(0:9), is then routed to the Domino chip. This IC encodes and decodes the digital video
stream into / from MPEG2 format.
1.4.1.2 Audio Part
2
S audio is sent from the Analog board to the Domino chip via connector 1536.
I
The Domino chip compresses the I
1.4.2 Front-end I
2
S
The Domino chip interfaces directly to the basic Engine via ATAPI connector 1571.
It buffers the data streams that are coming from (or going to) the Basic Engine.
In the Domino chip, the video MPEG2 stream and the audio AC3 stream are sent to the Basic Engine for
recording through ATAPI bus.
1.4.3 Playback mode
During playback, the data from the Basic Engine is going directly to the Domino chip via ATAPI interface. The
Domino chip has the following outputs:
2
S audio data into an MPEG1-L2 / AC3 audio stream.
• Analog video CVBS, YC and RGB outputs on connector 1521
2
• I
S audio (PCM format) on connector 1536
• SPDIF audio (digital audio output) on connector 1536
1.4.4 Basic Engine Interface
The Digital board is equipped with an IDE bus (ATAPI) for connecting to the Basic Engine.
1.4.5 Clock Distribution
The Domino chip has a complex system, which is needed to support the processes running at different
frequencies such as video decoding, audio decoding or peripheral I/O devices etc. To ensure a synchronous
initialization of all the registers and state machines, all the PLLs are switched to their default frequency 27MHz.
Then when the booting control unit is correctly initialized and once it has captured all the booting parameters, it
sets the PLLs to its functional frequencies. Thanks to a clock blocking mechanism, the frequency switching is
glitch free.
System clocks:
• DMN-8602 (7101, pin E1 and F1) : 13.5 MHz provided by the x’tal 1101
• TVP5146 (7401, pin 74 and 75) : 14.31818MHz provided by x’tal 1461
• SDRAM (7211 and 7231, pin 45 and 46) : 150MHz provided by the DMN-8602
• TSB41AB1PHP IEEE 1394 PHY IC (7301, pin 42 and 43) : 24.576MHz provided by x’tal 1351
1.4.6 Power Supply
The Digital board is not powered in standby mode. The control signal STBY on the analog board will enable the
PSU and power the digital board.
• STBY = Low : the digital board is in powered down standby mode
• STBY = High : the power supply to the digital board is enabled. The 3V3, +5V and +12V come from the
• 1.8V core voltage
• 2.5V supply for the SDRAM
• 1.25V DDR Termination Supply
1.4.7 Memory
PSU, while the following voltages are generated in the digital board:
FLASH IC7294: this memory contains the boot parameters and application firmware
1.4.8 Reset
Reset concept Digital board
The rest circuitry [7595] takes cares that the different devices on the digital board are boot-up in the correct
order. At power on the reset circuitry provides the following resets (delay τ1):
• SYSRST# to the Domino chip [7101] and Flash Memory [7294]
The Domino chip then generates other reset signals (delay τ2) via its GPIOs:
See the user manual that came with your
Philips recorder.
Online
go to www.philips.com/support.
3
Enjoy
Start recording
A
Record to DVD or VCR
A
Press DVD to record to a recordable DVD.
Or, press VCR to record to a VHS tape.
B
Load in a blank recordable DVD to the disc tray or a
VHS tape to the tape deck.
C
Press SOURCE repeatedly to select the source to
record from (eg, TUNER, CAM1, DV, EXT1 or EXT2).
z To record a TV programme, use P+/- on the
remote control to select a programme channel.
D
Press REC MODE repeatedly to select a desired
recording mode (refer to the Record Mode table).
E
Press REC to start recording.
Note To set the recording time, press
repeatedly to extend the recording time in 30-minute
increments. The recording will stop automatically at
the designated end time.
z If record from an external device, press PLAY on
the device to start playback.
F
To stop the recording, press STOP.
B
Dubbing (DVD î VCR)
A
Press DVD to dub from DVD to VCR.
Or, press VCR to dub from VCR to DVD.
B
Get ready the appropriate disc and VHS tape in the
recorder.
C
Press DIRECT DUBBING .
OK
SP
Rec. Mode
OKCancel
D
Select the desired recording mode, then move to
OK
in the menu and press
on the remote
control to start dubbing.
E
To stop the dubbing, press STOP.
DVD Recorder / VCRDVDR3430V
Connect
Set up
Enjoy
1
2
3
What’s in the box?
DVD Recorder / VCR
Remote Control
and 2 batteries
RF Coaxial Cable
User
Manual
Start playback
A
From a disc
A
Press DVD on the remote control.
B
Press OPEN/CLOSE , load a disc and close
the disc tray.
C
Press PLAY/PAUSE to start playback.
D
To stop playback, press STOP.
B
From a VHS tape
A
Press VCR on the remote control.
B
Insert a pre-record VHS tape into the tape deck.
Press REW to rewind the tape if necessary to the
beginning of the recording.
C
Press PLAY/PAUSE to start playback.
D
To stop playback, press STOP.
REC MODE
VCR
DVD
PLAY/PAUSE
SOURCE
1
Connect
2
Set up
D
Setup and install TV channels.
Highlight and press rightX.
Select { Channel Search } and press to start
automatic TV channel search.
p
t
t
h
h
Note This process may take several minutes. Once
complete, the total number of channels found and
stored appears on the TV.
E
Set the date and time.
Highlight and press rightX.
Select { Date (dd/mm/yy) } or { Time (hh/mm/ss) }
and press . Use the numeric keypad 0-9 to
input the date/time, then pressto confirm.
k
6
00:05:08
o
yy)
)
g
Note The settings will be updated according to the
broadcast channel information of preset Programme
Number 1.
F
Press SETUP to exit.
Basic Connection
Before Connecting
Select one of the following basic connections ( A or B ) according to the type of connecting devices you have.
If your TV is currently connected to a VCR, you have to unplug all the connections from your VCR and TV.
Your new Philips Recorder replaces the VCR for your recording needs.
Option A
Use this connection if you are connecting the antenna
cable directly from the antenna wall socket or from a
Cable Box without a Scart output socket.
A
Unplug the antenna cable that is currently connected
to your TV and plug in the antenna cable to the
ANTENNA socket on this recorder.
B
Use the supplied RF coaxial cable to connect the
TV socket on this recorder to the Antenna In
socket on the TV.
C
Use a scart cable (not supplied) to connect the
EXT1 TO TV-I/O socket on this recorder to the
Scart input socket on your TV.
D
Plug in the power cable from the recorder to an AC
power outlet.
~
MAINS
TO TV - I/O
EXT1
AUX - I/O
EXT2
S-VIDEO
(Y/C)
AUDIO
AUDIO
COMPONENT
VIDEO
R
L
P
R
P
B
Y
AUDIO / VIDEO OUT AUDIO / VIDEO OUT 1
VIDEO
(
CVBS
)
COAXIAL
DIGITAL AUDIO OUT
ANTENNA
TV
SCART IN
From an offair antenna
wall socket or
cable box
Television ( rear)
Note See the accompanying user manual for other possible connections (e.g. Composite Video, S-VIDEO).
Option B
Use this connection if your current antenna cable is
connecting through a Cable Box with Scart output
socket.
A
Keep the existing antenna connection from the Cable
box to your TV.
B
Use a scart cable (not supplied) to connect the
EXT1 TO TV-I/O socket on this recorder to the
Scart input socket on your TV.
C
Use another scart cable to connect the
EXT2 AUX-I/O socket on this recorder to the
Scart output socket on the Cable Box.
D
Plug in the power cable from the recorder to an AC
power outlet.
~
MAINS
TO TV - I/O
EXT1
AUX - I/O
EXT2
S-VIDEO
(Y/C)
AUDIO
AUDIO
COMPONENT
VIDEO
R
L
P
R
P
B
Y
AUDIO / VIDEO OUT AUDIO / VIDEO OUT 1
VIDEO
(
CVBS
)
COAXIAL
DIGITAL AUDIO OUT
ANTENNA
TV
SCART IN
Philips Recorder (rear)
From an off-air
antenna wall socket
Television ( rear)
Philips Recorder
(rear)
Cable Box (rear)
A
Finding the viewing channel
A
Press STANDBY-ON on the recorder.
B
Turn on the TV and other connected devices (e.g.
Cable Box, Satellite Receiver).
C
If your TV does not switch to the correct viewing
channel, press the Channel Down button (or AV,
SELECT, ° button) on the TV’s remote control
repeatedly until you see the blue DVD background
screen. This is the correct viewing channel for the
recorder.
B
Start basic setup
Use the recorder’s remote control and follow the onscreen instructions to complete the installation.
A
Press SETUP on the remote control.
y
r
l
y
h
On
OK
Note Use up S and down T keys to toggle
through the options. Select an item by pressing
right X. To con rm a setting, press
.
B
Select the country of your residence.
Highlight and press rightX.
Select { Country } and press to confirm your
selection.
C
Select the recorder’s menu display language.
Remain in mode, select { On Screen Display Language } and press right X.
Select the desired language option and press
to
con rm your selection.
Setup Menu - Channel Setu
Channel Searc
Sort Channels
Searc
Edi
Sor
Setup Menu - Genera
German
Englis
Countr
Screen Save
Reset Menu Settings
Setup Menu - Cloc
Date (dd / mm /
Time (hh : mm : ss
Date-Time Settin
01/01/0
Aut
SERVICE PART LIST
DVDR3430V/05/31/51/58
0110 3139 244 11691 COVER TRAY DVDR3430V
0182 3139 243 20502 SHIELD THERMAL VCR DVDR3430V
0190 3139 241 24433 BRACKET TOP DVDR3430V
0196 3139 241 24492 SHIELD EMC AV DVDR3430V
0200 3139 241 24522 SPRING EMC DVDR3430V
0201 3139 241 00042 EMC SPRING
0201 3139 241 25471 SPRING EMC 2 DVDR3430V
0206 3139 114 26671 BUSH
0208 2822 031 00024 FAN 12VDC 0.8W 3100RPM B
0230 3139 241 24461 PLATE BACK DVDR3430V
0240 3139 241 24441 COVER TOP DVDR3430V
0342 2422 549 00928 REMOTE CONTR DVDR3430V EU V B
0345 2422 070 98236 $ MAINSCORD UK 5A 1M8 VH BK B /05 /05
0345 2422 070 98231 $ MAINSCORD 2.0M - EU /31,/51,/58
0486 3103 140 25022 CONNECT. CABLE PAL
0900 3143 027 64732 FRONT ASSEMBLY DVDR3430V /05
0900 3143 027 64712 FRONT ASSEMBLY DVDR3430V /31,/51,/58
0920 3143 027 64722 FRAME ASSEMBLY DVDR3430V
1001 3139 248 88851 PCBAS DVDR3430V DIGITAL BOARD
1002 3139 248 88571 PCBAS DVDR3430V ANA E U BOARD
1003 3139 248 88611 PCBAS DVDR3430V FRONT BOARD
1004 3139 248 88591 PCBAS DVDR3430V FRONT AV BOARD
1005# 3139 248 00282 DRIVE D4.5 CLOSED
1005 3139 248 00401 DRIVE D6.1 CLOSED
1006 2422 549 01124 VHS DRIVE MODULE HK100ED B
1007 3139 247 12872 $ PSU 06V85 AC8100 LF PIE
8001 3104 157 02191 CBLE PH 10P/340/10P PH 26ST BK
8002 3139 111 02651 FFC FOIL 10P/100/10P AD
8003 3139 110 34841 FFC FOIL 08P/100/08P AD
8004 3103 308 91051 CWAS 06PH/06PH 100 6P BK 265
8006 3103 601 00472 CBLE EHR 4P/180/4P LC UL
8007 3139 241 01191 FFC FOIL 06P/280/06P AD 1MMP
8008 3139 241 02181 FFC FOIL 14P/280/14P BD 1MMP
8009 3139 241 02471 FFC FOIL 06P/180/06P AD 1MMP
8010 3139 241 02451 FFC FOIL 19P/220/19P AD 1MMP
8011 3139 241 02461 FFC FOIL 18P/220/18P AD 1MMP
8012 3139 241 02021 FFC FOIL 30P/100/30P AD 1MMP
8013 3139 110 28291 CBLE PH 12P/180/12P PH 26ST BK
8014 3139 241 02161 CBLE IDE 40P/220/40P IDE UL SP
8015 3139 110 27871 CBLE PH 06P/120/06P PH 26ST BK
DVDR3432V/05/12
0110 3139 244 11691 COVER TRAY DVDR3430V
0182 3139 243 20502 SHIELD THERMAL VCR DVDR3430V
0190 3139 241 24433 BRACKET TOP DVDR3430V
0196 3139 241 24492 SHIELD EMC AV DVDR3430V
0200 3139 241 24522 SPRING EMC DVDR3430V
0201 3139 241 25471 SPRING EMC 2 DVDR3430V
0206 3139 114 26671 BUSH
0208 2822 031 00024 FAN 12VDC 0.8W 3100RPM B
0230 3139 241 24461 PLATE BACK DVDR3430V
0240 3139 241 25581 COVER TOP DVDR3432V
0342 2422 549 00928 REMOTE CONTR DVDR3430V EU V B
0345 2422 070 98236 $ MAINSCORD UK 5A 1M8 VH BK B /05
0345 2422 070 98231 $ MAINSCORD 2.0M - EU /12
0486 3103 140 25022 CONNECT. CABLE PAL
0900 3143 027 66141 FRONT CAB ASSY DVDR3432V /05
0900 3143 027 66131 FRONT CAB ASSY DVDR3432V /12
0920 3143 027 64722 FRAME ASSEMBLY DVDR3430V
1001 3139 248 88851 PCBAS DVDR3430V DIGITAL BOARD
1002 3139 248 88572 PCBAS DVDR3430V ANA E U BOARD
1003 3139 248 88611 PCBAS DVDR3430V FRONT BOARD
1004 3139 248 88591 PCBAS DVDR3430V FRONT AV BOARD
# 3139 248 00282 DRIVE D4.5 CLOSED
1005
1005 3139 248 00401 DRIVE D6.1 CLOSED
1006 2422 549 01124 VHS DRIVE MODULE HK100ED B
1007 3139 247 12872 $ PSU 06V85 AC8100 LF PIE
8001 3104 157 02191 CBLE PH 10P/340/10P PH 26ST BK
8002 3139 111 02651 FFC FOIL 10P/100/10P AD
8003 3139 110 34841 FFC FOIL 08P/100/08P AD
8004 3103 308 91051 CWAS 06PH/06PH 100 6P BK 265
8006 3103 601 00472 CBLE EHR 4P/180/4P LC UL
8007 3139 241 01191 FFC FOIL 06P/280/06P AD 1MMP
8008 3139 241 02181 FFC FOIL 14P/280/14P BD 1MMP
8009 3139 241 02471 FFC FOIL 06P/180/06P AD 1MMP
8010 3139 241 02451 FFC FOIL 19P/220/19P AD 1MMP
8011 3139 241 02461 FFC FOIL 18P/220/18P AD 1MMP
8012 3139 241 02021 FFC FOIL 30P/100/30P AD 1MMP
8013 3139 110 28291 CBLE PH 12P/180/12P PH 26ST BK
8014 3139 241 02161 CBLE IDE 40P/220/40P IDE UL SP
8015 3139 110 27871 CBLE PH 06P/120/06P PH 26ST BK
# Basic Engine 1005 starts with Drive 4.5 and running change over to Drive D6.1
Items denoted with ”$“ are safety components.
Only the parts mentioned in this list are normal service spare parts.
1!
"
1
17
-
"?7
-
?
?
"
"""
"1/"0
@
1!31
--
"17
!
1!
1!
-
!
"71
-
%$,1!$'%:
33333
-
--
"
"
1
');+)$=>
1
9 !--
-
/"1-0
1"""
"
"
1!
1/ 20
89:;$$9;,<
"
1;:$$9;,<!)$=>;'<%'+8
/1$<;=0
()8A;#%
31!
3
31
3
/61$<;=0
-
-
. -
1
1
/1$<;=0
3"!
31
3
1!
1313"
1!31
-
1!3
3"!
3
-
/1$<;=0
""
.-
.
"""
.
3
- -
-
2
4 64
7
8
'
9
)
'
)$8
*,7
@
9
=
%
9
$
5
!
!
-
3!
3
3!
34
34
3-
3
3
3
.2
""1
1"
-!1"1
3"
-
-
-
!"/0
-
()$*+,
"!#$%$#&'%
.
-
!"/0
"
/1$<;=0
""
1
1
1
1
1
1
-
.
!"
()8A;#%
13"3
13"3
1313"/1!0
1313/1!0
133
61$<;=
.
133
1
$<;=
2.
-
-
5 1
3
5 7-1
-
.-
1
%;')7
1
1!
!
@
-
13"
13"
13"
13"
@
-
13"
51
-.
5 1
5 1
5 13
131
3
-2
-
4""
-
1"
4
1
6$%6
154
5 1
51
120
2
3
4
5
6
7
10
11
12
13
14
15
16
17
18
19
12
3
4
5
6
7891011121314
A
5112
SCL_5V
SDA_5V
3166
100R
*
12VSTBY
5V
4K7
3142
4K7
3143
3164
BSH103
7164
3165
BSH103
7165
7167
BSH103
1K0
3167
7168
BSH103
1K0
3168
7169
BSH103
4K7
3169
12VSTBY
1K0
1K0
100R
3131
4K7
3132
2121
GND
12VSTBY
3144
3145
7125
BC847BW
3146
12VE
5VE
3V3
3V3
3V3
100n
5V_BE
HDD_ON
22K
15K
1R0
3V3
3V3
IPK
OSC
CVBS_TV
to IOV
5152
2155
1m0
POWER_FAIL
10u
10n
VGNSTBY
12VSTBY
QRS
REFERENCE
REGULATOR
3125
47K
STBYn
3V3
SCL0
SDA0
3V3
VCR_S_CLK
D_GND
VCR_DA_IN
D_GND
VCR_DA_OUT
D_GND
from/to VCR
VCR_C_SEL
VCR_RESET
SWC1
SWE2
TIMC3
2117
GND4
1105
F192
HLW14S-2C7
frm/to FRONT Board
3135
1K0
3136
1K0
1116
1
F171
2
F172
3
4
F173
5
6
F174
7
F175
8
08FE-BT-VK-N
390p
2118
3160
F170
1
2
3
4
5
6
7
8
9
10
11
12
13
14
5VSTBY
6105
BAS316
F169
33VSTBY
50V100u
3124
GND
SCK
D_MCU
D_HOST
GND
RDY_MCU
ATN_MCU
HOST_RESETHOST_RESET
5VSTBY5VSTBY
STBYn
POWER_FAIL
12VSTBY
BSH103
7117
7118
BSH103
18K
3150
3137
18K
FAN_CTRL
4K7
5VSTBY5VSTBY
3138
4K7
I2C LEVEL SHIFTER
5VSTBY5VSTBY5VSTBY5VSTBY
4K7
4K7
4K7
4K7
3161
4K7
3170
3162
3163
3141
68R
7101
F105
BC847BW
F106
3119
220R
7115
TL431ACZ
3
2
1
7106
STS9NF30L
3106
18K
6102
1N4006
4R7
SI2306DS
3K3
3134
7105
GND
7111
SI2306DS
3K3
3110
BC847BW
GND
1
AK
2
GND
3117
5000mW
4103
500mA T
1113
F126
7112
2105
R
1n0
3113
3
F129
3107
220R
2110
3108
F125
3147
3154
GND
47K
GND
5110
100u
47K
4K7
4K7
47u
PDTC124EU
PDTC124EU
GND
33K
3104
GND
12V
7103
7113
3V3
2108
GND_M
12VSTBY
POWER_FAIL
5NSTBY
F107
SI2312DS
7102
12V
SI2312DS
7119
12V
50V
47u
3140
10K
10K
3155
SS14
6110
SB140
6108
5113
100u
33VSTBY
B
A
3101
100K
330u
2111
2113
3102
220K
GND
2114
GND
560u
560u
6103
1N4006
7110
PDTC143ZT
3139
1K0
2u2 50V
33VSTBY
50V
2u2
8
7
6
5
GND
3111
3112
GND
5.6V
2104
GND
GND
100K
220K
7104
SI2312DS
2u2 50V
4
C
GND
B
GND
GND_M
5114
220u 10V
1111
T 125mA
4104
2112
33u
1114
2.5A
4101
1108
4102
16V220u
4AT
T
3115
680R
12V_PSU
2103
GND
F128
2107
GND
500mW
5V_VCR
D
E
C
F
12V_PSU
GND
5V6_PSU
3V3_PSU
GND
21V_PSU
from PSU module
1101
1
2
3
4
5
6
B6P-VH
F100
F101
F102
F103
F104
GND
4110
4111
12V_PSU
GND_M
GND
D
3109
3K9
G
E
H
C102
SIG_GND
C103
GND
D_GND
VCR Grounding
3103
3105
1K8
2K2
47K
3114
BC369
7114
I
F
6109
6104
BZX79-C18
BZX384-C18
J
+18V
MOTOR_GND
G
KK
is prohibited without the written consent of the copyright
owner.
All rights reserved. Reproduction in whole or in parts
All rights reserved. Reproduction in whole or in parts
is prohibited without the written consent of the copyright
owner.
E
FRONT BOARD
VCR MODULE
A
FAN
B
C
PSU MODULE
D
ANALOG BOARD MODULE
E
F
F
FRONT AV BOARD
G
G
OPTICAL DRIVE
H
H
DIGITAL BOARD MODULE
I
0345
CHNSETNAMEDVDR3430V
CLASS_NO
--
1
I
SET WIRING
--
J
2005-12-23
1
2
DVDR3430V EU
3139 249 3524
J
NAME
KEK YEH HUAR
SV
1891011
234 5
6
7
CHECKDATE
SUPERS.
2005-12-23
11
C
13010
ROYAL PHILIPS ELECTRONICS N.V. 2005
1213
A3
The PSU Layout
is not available as it
is purchase part.
Exploded View
0900
0920
VCR Module
HK100ED
2422 549 01124
Service
Service
Service
Service Manual
Contents
Chapter
Sec. 1: Schematic Diagrams and CBA's
Exploded Views
Mechanical and Electrical Parts Lists
Sec. 2: Standard Maintenance
Mechanism Alignment Procedures
Disassembly / Assembly of Mechanism
Deck Exploded Views
Deck Parts List
c Copyright 2006 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval
system or transmitted, in any form or by any means, electronic, mechanical, photocopying,
or otherwise without the prior permission of Philips.
Published by FU-KC 0623 Service AV Systems Printed in Netherlands Subjection to modification EN 3139 785 32220
Version 1.0
MAIN SECTION
VCR Module
Sec. 1: Main Section
I Schematic Diagrams and CBA’s
I Exploded Views
I Mechanical and Electrical Parts List
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of e very male connector is indicated as
shown.
Pin 1
Input
In
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
Information about lead-free soldering
Philips CE is producing lead-free sets from 1.1.2005
onwards.
IDENTIFICATION
Regardless of special logo (not always
indicated)
One must treat all sets from
onwards, according to the next rule:
Serial Number gives a 9-digit. Digit 2&3 shows the
WEEK, and digit 4 shows the YEAR.
So from onwards=from 1 Jan 2005 onwards
Important note: In fact also products of year 2004
must be treated in this way as long as you avoid
mixing solder-alloys (leaded/ lead- free) . So bes t to
always use SAC305 and the higher temperatures
belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solderpaste is required, please contact the manufacturer
of your solder-equipment. In general use of solderpaste within workshops should be avoided because
paste is not easy to store and to handle.
• Use only adequate solder tools applicable for leadfree solder alloy. The solder tool must be able
• To reach at least a solder-temperature of 400°C,
• To stabilize the adjusted temperature at the solder-
• To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360°C
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400°C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed solder alloy
types (leaded and lead-free).
If one cannot avoid or does not know whether
product is lead-free, clean carefully the solder-joint
from old solder alloy and re-solder with new solder
alloy (SAC305).
• Use only original spare-parts listed in the ServiceManuals. Not listed standard-material (commodities)
has to be purchased at external companies.
015
tip
- 380°C is reached and stabilized at the
1 Jan 2005
1-1-1HK100_SN
• Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for desoldering always use the lead-free temperature
profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be
baked dry. (MSL=Moisture Sensitivity Level). This
will be communicated via AYS-website.
Do not re-use BGAs at all.
• For sets produced before 1.1.2005 (e xcept products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be a vailable
till the end of the service-period. For repair of such
sets nothing changes.
• On our website
www.atyourservice.ce.Philips.com
information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information within
the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
you find more
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pac k-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
1-1-2HK100_SN
3. The flat pac k-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Machine
Flat Pack-IC
Tweezers
Fig. S-1-2
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
With Iron Wire:
1. Using desolder i ng braid, rem ove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pac k-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
Hot Air Blower
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wir e). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
To Solid
Mounting Point
CBA
Tweezers
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pac k-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
1-1-3HK100_SN
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
2. The “●” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-cond uc tors may
occur due to a potential difference caused b y
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
<Incorrect>
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
<Correct>
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-1-4HK100_SN
SIGNAL NAME ABBREVIAT IONS
Signal NameFunction
4.43MHz4.43MHz clock
A-COMAudio Head Common
A-MODEHi-Fi Tape Detection Signal
AE-HAudio Erase Head
AE-H/FE-HAudio Erase Head
AL+12V
AL+20V/+12V
AL+5V
AMPCCTL AMP Connected Terminal
AMPVccAMPVcc
AMPVREF INV-Ref for CTL AMP
AMPVREF OUTV-Ref for CTL AMP
CCTL AMP Capacitor
C-CONTCapstan Motor Control Signal
C-F/R
C-FG
C-POW-SWCapstan Power Switching Pulse
C-ROTA
C-SYNCComposite Synchronized Pulse
CLKSELClock Select
CTLTo Monitor for CTL AMP Output
CTL (+)
CTL (-)
D-CONTDrum Motor Control Signal
Always +12V with AC Plug
Connected
Always +20V/+12V with AC Plug
Connected
Always +5V with AC Plug
Connected
Audio Mute Control Signal
(Mute=“H”)
Normal Audio Play Back/Record
Signal
A/D Converter Power Input/
Standard Voltage Input
Capstan Motor FWD/REV
Control Signal (FWD=”L”/
REV=”H”)
Capstan Motor Rotation
Detection Pulse
Color Phase Rotary Changeov er
SIgnal
Playback/Record Control Signal
(+)
Playback/Record Control Signal
(-)
Signal NameFunction
D-PFGDrum Motor Pulse Generator
D-REC-HDelayed Record Signal
D-V-SYNCDummy V-sync Output
END-STape End Position Detect Signal
FE-HFull Erase Head
FE-H-GNDGround for Full Erase Head
FSC-IN
[4.43MHz]
GNDGround
H-A-COMPHead Amp Comparator Signal
H-A-SW
Hi-Fi-AUDIO(L)Hi-Fi Audio L Head
Hi-Fi-AUDIO(R)Hi-Fi Audio R Head
Hi-Fi-COM Hi-Fi Audio Head Common
Hi-Fi-H-SW
HLFLPF Connected Terminal (Slicer)
IIC-BUS SCL
IIC-BUS SDA
KEY-1Key Scan Input Signal 1
KEY-2Key Scan Input Signal 2
LD-SW
LM-FWD/REVLoading Motor Control Signal
N-A-PB Normal Audio Playback
N-A-REC Normal Audio Recording
OSCinClock Input for letter size
OSCoutClock Output for letter size
OSD-V-INOSD Video Signal Input
OSD-V-OUTOSD Video Signal Output
OSDVccOSDVcc
OSDVssOSD Ground
P-ON+5V+5V at Power-On Signal
P-ON+9V+9V at Power-On Signal
P-ON-LPower On Signal at Low
PB-H-OUTPlayback control/Signal (PB=“H”)
PG-DELAY
POW-SAF
4.43MHz Clock Input
Video Head Amp Switching
Pulse
Hi-Fi Audio Head Switching
Pulse
2
C BUS Control Clock
I
2
I
C BUS Control Data
Deck Mode Position Detector
Signal
Video Head Switching Pulse
Signal Adjusted Voltage
P-ON Power Detection Input
Signal
1-2-1HK100SNA
Signal NameFunction
REC-SAF-SW
REMOTERemote Control Sensor
RESETSystem Reset Signal (Reset=“L”)
RF-SWVideo Head Switching Pulse
S-CLOCKSerial clock
S-CSChip Select Signal
S-DATA-INSerial Data Input
S-DATA-OUTSerial Data Output
S-REELSupply Reel Rotation Signal
Recording Safety SW Detect
(With Record tab=“L”/With out
Record tab=“H”)
SECAM-C-IN
SECAM-FM-
OUT
SECAM-HSECAM Mode at High
ST-S
T-REELTake Up Reel Rotation Signal
TRICK-H
V-ENV
VccVcc
VG+18V
VIDEOVideo Signal
VIDEO(L)-1/2Video L Head 1/2
VIDEO(R)-1/2Video R Head 1/2
VIDEO-COMVideo Head Common
SECAM CHROMA Signal from
PAL/SECAM DETECTOR
PB video Signal to PAL/SECAM
DETECTOR
Tape Start Position Detector
Signal
Trick Play Control Signal
(Trick=“H”)
Video Envelope Comparator
Signal
Always +18V with AC Plug
Connected
VIDEO-INVideo Signal Input
VIDEO-OUTVideo Signal Output
VssVss(GND)
X-INMain Clock Input
X-OUTMain Clock Input
1-2-2HK100SNA
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electri cal adjustm ents are re quired after re placing
circuit components and certain mechanical par ts.
It is impor tant to do these adjustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform these alignmen t / confir mation procedures, make sure that the tracking control is set in
the center position : Press either "PR -5??" or "PR +"
button on the remote control unit first, then the "B"
button (Front Panel only).
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (9965 000 14514)
Head Switching Position Adjustment
Purpose:
To determine the Head Switchi ng position during
playback.
Symptom of Misadjustment:
May cause Head Switch ing noise or vertical jit ter
in the picture.
Test pointAdj.PointModeInput
J909(V-OUT)
TP504(RF-SW)
GND
Tape
9965 000 14514Oscill os co pe
Connections of Measurement Equipment
Main CBA
TP504
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
J909
GND
PLAY
(SP)
6.5H±1H
(416µs±64µs)
Oscilloscope
-----
Spec.
CH1 CH2
Trig. (+)
Figure 1
EXT. Syncronize Trigger Point
CH1
CH2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edg e of the CH1 video out put waveform is at the 6.5H±1H (416µs±64µs) delayed position
from the rising edge o f the CH2 head switching pulse
waveform.
1.0H
6.5H+/-1H (416µs+/-64µs)
Switching Pulse
0.5H
V-Sync
1-3-1HK100EA
BLOCK DIAGRAMS
Servo / System Control Block Diagram
AL+20V/+12V
AL+5V
RESET
1 VG+18V
CN252
VG+18V
3
4 AL+12V
6 AL+12V
8 AL+5V
Q151
+9V REG.
AL+5V
AL+12V
P-ON+9V
AL+20V/+12V
10 C-POW-SW
Q153
P-ON+5V
CN653
TP505 SENS-INH
1 S-CLOCK
3 S-DATA-IN
7 S-CS
8 RESET
2 REMOTE
1 KEY-1
5 S-DATA-OUT
CN505
WF8WF9WF10WF11
Q515
Q152
SDA
SCL
IC502 (MEMORY)
5
6
TO AUDIO
BLOCK DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-H
TO Hi-Fi AUDIO
BLOCK DIAGRAM
A-MODE
Hi-Fi-H-SW
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-H
RF-SW
D-REC-H
IIC-BUS SCL
IIC-BUS SDA
C-ROTA
D-V-SYNC
TO VIDEO
H-A-SW
BLOCK DIAGRAM
V-ENV
C-SYNC
TRICK-H
H-A-COMP
SECAM-H
8
7
14
KEY- 1
:INDICATES A TEST POINT WITH A JUMPER WIRE ACROSS A HOLE IN THE PCB.
:USED TO INDICATE A TEST POINT WITH A COMPONENT LEAD ON FOIL SIDE.
:USED TO INDICATE A TEST POINT WITH NO TEST PIN.
:USED TO INDICATE A TEST POINT WITH A TEST PIN.
TEST POINT INFORMATION
“ “ = SMD
NOTE FOR WIRE CONNECTORS:
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
KEY- 2
REMOTE
IC501
(SERVO/SYSTEM CONTROL)
AL+5V
D555
S-LED
SW507
(WIRE IS SOLDERED DIRECTLY.)
LD-SW
MAIN CBA
CTL(+)
LD-SW
9
95
AL+5V
CN504
5 CTL(+)
67
66
S-CLOCK
S-DATA-IN
CTL(-)
94
6 CTL(-)
65
64
S-CS
S-DATA-OUT
34
RESET
END-S
ST-S
10480
60
C-POW-SW
T-REEL
S-REEL
79
END-S
TP502
PS502
Q506
S-REEL
T-REEL
75
P-ON-L
CTL
97
TP503
CTL
AL+5V
PG-DELAY
2
VR501
SW-POINT
83
AUDIO-MUTE-H
REC-SAF-SW
31
SW506
AL+5V
REC-SAFETY
CAPSTAN MOTOR
P-ON+5V
AL+20V/+12V
CN502
AL+20V/+12V
1
2 P-ON+5V
33
71
72
19
32
A-MODE
Hi-Fi-H-SW
C-FG
8778768177
3 C-FG
D-REC-H
IIC-BUS SCL
IIC-BUS SDA
C-CONT
LM-
FWD/REV
C-F/R
C-F/R5C-CONT6GND7LM-FWD/REV
4
D-CONT
D-CONT9D-PFG10GND11AL+12V
8
MOTOR
DRIVE
CIRCUIT
CAPSTAN
MOTOR
15
18
RF-SW
C-ROTA
D-PFG
90
M
17
16
13
H-A-SW
D-V-SYNC
H-A-COMP
AL+12V
VG+18V
VG+18V
12
M
6
58
V-ENV
C-SYNC
61
62
TRICK-H
SECAM-H
ACE HEAD ASSEMBLY
(DECK ASSEMBLY)
CONTROL
HEAD
Q504
ST-S
SENSOR CBA
1-4-1
Q503
END-S
SENSOR CBA
M
PG
SENSOR
DRUM
CYLINDER ASSEMBLY
MOTOR
LOADING
MOTOR
HK100BLS
Video Block Diagram
MODE: SP/RECPB-VIDEO SIGNAL DVD VIDEO SIGNAL
VIDEO (L)-1
HEAD
VIDEO (R)-1
HEAD
VIDEO (L)-2
HEAD
CYLINDER ASSEMBLY
VIDEO (R)-2
HEAD
MAIN CBA
REC-VIDEO SIGNAL
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
:INDICATES A TEST POINT WITH A JUMPER WIRE ACROSS A HOLE IN THE PCB.
:USED TO INDICATE A TEST POINT WITH A COMPONENT LEAD ON FOIL SIDE.
:USED TO INDICATE A TEST POINT WITH NO TEST PIN.
:USED TO INDICATE A TEST POINT WITH A TEST PIN.
TEST POINT INFORMATION
(DECK ASSEMBLY)
TO SERVO/SYSTEM
CONTROL BLOCK
456
123
CN251
VIDEO(L)-1
VIDEO(L)-2
VIDEO(R)-1
VIDEO-COM
969594
7978
4643
6968
SERIAL
DECORDER
65
50
55
P
R
Y. DELAY
LUMINANCE
AGC
BYPASS
SP
HEAD
SP
SIGNAL
PROCESS
VIDEO-COM
93
AMP
EP
VIDEO(R)-2
WF1
908988
EP
CHARA.
RF-SW
D-REC-H
RF-SW
TP504
87
80
HEAD
AMP
D-REC-H
REC FMAGC
+
Y
C
CCD 1H DELAY
1/2
FBC
INS.
DIAGRAM
H-A-SW
C-ROTA
D-V-SYNC
H-A-COMP
83
71
62
70
H-A-SW
D-V-SYNC
H-A-COMP
RF-SW/C-ROTA
RPRP
CHROMINANCE
SIGNAL
PROCESS
V-ENV
C-SYNC
84
V-ENV
Y/C
PR
TRICK-H
SECAM-H
67
C-SYNC
VXO
MIX
AGC
PAL/SECAM
DETECTOR
IC370 (PAL/SECAM DECTECTOR)
1
171418216
29
28
44
PB-H OUT
21
WF2
C-PB
TP301
25
2928
X301
4.43MHz
5859
“ “ = SMD
NOTE FOR WIRE CONNECTORS:
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
(WIRE IS SOLDERED DIRECTLY.)
WF3
IC501 (OSD)
OSD-V-OUT
J909
COLOR
-IN
OSD
CHARACTER
MIX
52
BUFFER
Q301
VIDEO SIGNAL PROCESS
/HEAD AMP
IC301
WF7
CN253
VIDEO-OUT 9
50
VIDEO-IN7
WF6
1-4-2
HK100BLV
Audio Block Diagram
Mode : SP/REC
ALC
12
DET
11
MUTE
LINE
ALC
AMP
REC-ON
SERIAL
DECODER
71
68 69
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-H
PB-AUDIO SIGNALREC-AUDIO SIGNAL
MAIN CBA
15
IC301
(AUDIO SIGNAL PROCESS)
INV
PB-ON
P
R
ATT
98
7
EQ
AMP
SP/LP-ON
5
6
P-ON+5V
Q404
Q403
BIAS
OSC
REC
AUTO
1
AMP
100
3
BIAS
2
Q406
16
AUDIO HD-SW
CONTROL
P-ON+5V
SWITCHING
D-REC-OFF
Q405
Q401
(PB=ON)
NOTE FOR WIRE CONNECTORS:
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
(WIRE IS SOLDERED DIRECTLY.)
“ “ = SMD
N-A-PB
N-A-REC
TO Hi-Fi AUDIO
BLOCK DIGRAM
1-4-3
CN504
ACE HEAD ASSEMBLY
(DECK ASSEMBLY)
AUDIO-PB/REC
4
3 A-COM
1 AE-H
2 AE-H/FE-H
AUDIO
HEAD
AUDIO
ERASE
HEAD
CN501
2 FE-H
FE HEAD
FULL
ERASE
HK100BLA
1 FE-H-GND
HEAD
Hi-Fi Audio Block Diagram
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
CN253
73
MUTE-ON
AUDIO(R)-OUT
AUDIO(L)-OUT
5
4
74
767775
WF5
MUTE-ON
A-MODE
IIC-BUS SCL
IIC-BUS SDA
Q451
37
38
LOGIC
FROM/TO
SERVO/SYSTEM
CONTROL BLOCK
AUDIO-MUTE-H
21
53
MUTE
Hi-Fi-H-SW
39
Hi-Fi
AUDIO
(R) HEAD
CYLINDER
ASSEMBLY
(DECK ASSEMBLY)
-COM 8
CN251
Hi-Fi-AUDIO(R)7Hi-Fi
242627
R
Hi-Fi
9
Hi-Fi-AUDIO(L)
L
AUDIO
(L) HEAD
MAIN CBA
R-CH
SW
OUTPUT
SELECT
ALC
(Hi-Fi AUDIO SIGNAL PROCESS)
BPF
COMP
NOISE
R-CH
ENV
NOISE
PPR
PNR
DET
DET
34 33
LIM
L-CH
DO
DET
PNR
ALC
BPF
COMP
SW
NOISE
+
HOLD
PULSE
LPF
MIXV/I
VCO
LIMDEV
47
48
LPF
14
VCO
LIMDEV
R
L-CH
15
NOTE FOR WIRE CONNECTORS:
“ “ = SMD
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
(WIRE IS SOLDERED DIRECTLY.)
IC451
1-4-4
52
2AUDIO(R)-IN
CN253
WF4
1AUDIO(L)-IN
6
78
80
N-A-REC
N-A-PB
TO AUDIO BLOCK
HK100BLH
SCHEMATIC DIAGRAMS / CBA'S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using
replacement components rated for higher voltage,
wattage, etc. Replacement parts that have these special safety character istics are id entified in th is manual
and its supplements; electrical components having
such features are identified by the mark " ! " in the
schematic diagram and the par ts list. Before replacing
any of these components, read the parts list in this
manual carefully. The use of substitute replacement
parts that do not have the same safety characterist ics
as specified in the pa r ts list may create sh ock, fire, or
other hazards.
Capacitor Temperature Markings
Mark
(B)
(F)
(SR)
(Y)
Capacity
change rate
±10%
±30 - 80%
±15%
±22.5%
Capacitors and transistor s are represente d by the following symbols.
1. Do not use the par t number s hown on these drawings for ordering. The correct part number is
shown in the parts list, and may be slightly different
or amended since these drawings were prepared.
2. To maintain original function and reliability of
repaired units, use only orig inal replacement par ts
which are listed with their part numbers in the parts
list section of the service manual.
3. How to read converged lines.
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to the line number
"1" of the area "D3".
2. "1-B1" means that line number "1" goes to the line number
"1" of the area "B1".
4. All resistance values are indicated in ohms
3
(K=10
, M=106).
5. Resistor wattage s are 1/4 W or 1/6W unl ess other wise specified.
6. All capacitance values are indicated in µF
-6
(P=10
µF).
7. All voltages are DC voltages unless otherwise
specified.
8. Voltage indications for PLAY and REC modes on
the schematics are as shown below.
3
AREA D3
2
1
AREA B1
1-D3
ABCD
1-B1
< PCB Symbols >
(Top View) (Bottom View)
+
(Bottom View)
Transistor or Digital Transistor
E C B
(Top View)
NPN Transistor
E C B
(Top View)
NPN Digital Transistor
E C B
Electrolytic Capacitor
(Top View)
E C B
(Top View)
E C B
Unit: Volts
The same voltage for
both PLAY & REC modes
PNP Transistor
PNP Digital
Transistor
PLAY mode
REC mode
5.0
231
5.0
(2.5)
Indicates that the voltage
is not consistent here.
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product through
improper servicing.
NOTES:
Parts that are not assigned par t numbers (---------) ar e
not available.
Tolerance of Capacitors and Resistors are noted with
the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
ELECTRICAL PARTS LIST
Pos.No. !12 NCDescription
MCV CBA1
Consists of the following:
MAIN CBA1
SENSOR CBA1
MAIN CBA