Philips DVDR3430V-05, DVDR3430V-31, DVDR3430V-51, DVDR3430V-58, DVDR3432V-05 Service Package

...

DVDR3430V/05/31/51/58 & DVDR3432V/05/12

Service Package

The table below gives the summary of all the files in the service package. Please refer to this document for the various information required.

Chapter No. Reference Document & Instructions

Chapter 1 Technical Specifications and Connection Facilities

"DVDR3430V_3432V

Technical Specification_ver2.1_1SEP06.pdf"

Chapter 2 Safety Information, General notes & Lead-free Requirements

Safety_requirements

.pdf

Chapter 3 Directions for Use / QUG Direction for use is available at website:

HTUwww.p4c.philips.comUTH

DVDR3430V_3432V_

euqsg_eng_22171_wk635.pdf

Chapter 4 Mechanical Instructions

DVDR3430V_Euro_Di

smantling_Inst_wk628_ver2.0.pdf

to remove the tape from loader_wk635_ver1.0.pdf"

Chapter 5 Firmware Upgrading

Euro Firmware Upgrade VER2.0_1SEP06.pdf"

Chapter 6 Block Diagram & Wiring Diagram

Chapter 7 Electrical Circuits & Layout drawings

Refer to “2_Drawings.zip for the various pc board’s circuit & layouts.

Chapter 8 Circuit Descriptions

Cctdescription_wk628.pdf

"Manual Procedure

"DVDR3430V_3432V

DVDR3430V_Eu_Bloc

k_diagram.pdf

DVDR3430V_3432V_

DVDR3430V_Wirin 3139-249-35241.pdf

Chapter 9 Exploded view & Service parts list

Funai VCR Module (2422 549 01124) (For Information only)

DVDR3430V_Explode

dview_wk628.pdf

DVDR3432V_3430V_

ServicePartlistwk635.pdf

VCR_Module_HK100

ED_DVDR3430V_Eur_2006-6-14.pdf

CLASS 1

LASER PRODUCT

2. Safety Information, General Notes & Lead Free Requirements

2.1 Safety Instructions

2.1.1 General Safety

Safety regulations require that during a repair:

• Connect the unit to the mains via an isolation transformer.

• Replace safety components, indicated by the symbol only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of ﬁre or electrical shock hazard.

Safety regulations require that after a repair, you must return the unit in its original condition. Pay, in particular, attention to the following points:

• Route the wires/cables correctly, and ﬁx them with the mounted cable clamps.

• Check the insulation of the mains lead for external damage.

• Check the electrical DC resistance between the mains plug and the secondary side:

1. Unplug the mains cord, and connect a wire between the two pins of the mains plug.

2. Set the mains switch to the ‘on’ position (keep the mains cord unplugged!).

3. Measure the resistance value between the mains plug and the front panel, controls, and chassis bottom.

4. Repair or correct unit when the resistance measurement is less than 1 MΩ.

5. Verify this, before you return the unit to the customer/ user (ref. UL-standard no. 1492).

6. Switch the unit ‘off’, and remove the wire between the two pins of the mains plug.

2.1.2 Laser Safety

This unit employs a laser. Only qualiﬁed service personnel may remove the cover, or attempt to service this device (due to possible eye injury).

2.2 Warnings

2.2.1 General

• All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD, during repair can reduce life drastically. Make sure that,

during repair, you are at the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential. Available ESD protection equipment: – Complete kit ESD3 (small tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671. – Wristband tester 4822 344 13999.

• Be careful during measurements in the live voltage section. The primary side of the power supply, including the heatsink, carries live mains voltage when you connect the player to the mains (even when the player is ‘off’!). It is possible to touch copper tracks and/ or components in this unshielded primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A ‘lightning stroke’ and a stripe-marked printing on the printed wiring board, indicate the primary side of the power supply.

• Never replace modules, or components, while the unit is ‘on’.

2.2.2 Laser

• The use of optical instruments with this product, will increase eye hazard.

• Only qualiﬁed service personnel may remove the cover or attempt to service this device, due to possible eye injury.

• Repair handling should take place as much as possible with a disc loaded inside the player.

• Text below is placed inside the unit, on the laser cover shield:

). Careless handling

Laser Device Unit

Type : Semiconductor laser GaAlAs Wavelength : 650 nm (DVD) : 780 nm (VCD/CD) Output Power : 20 mW (DVD+RW writing) : 0.8 mW (DVD reading) : 0.3 mW (VCD/CD reading) Beam divergence : 60 degree

Figure 2-1

Note: Use of controls or adjustments or performance of procedure other than those speciﬁed herein, may result in hazardous radiation exposure. Avoid direct exposure to beam.

CAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM ADVARSEL

SYNLIG OG USYNLIG LASERSTRÅLING VED ÅBNING UNDGÅ UDSÆTTELSE FOR STRÅLING ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES UNNGÅ EKSPONERING FOR STRÅLEN VARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA EJ STRÅLEN VARO! AVATTAESSA OLET ALTTIINA NÄKYVÄLLE JA NÄKYMÄTTÖMÄLLE LASER SÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN VORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEÖFFNET NICHT DEM STRAHL AUSSETSEN DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAM ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU

Figure 2-2

2.3 Lead Free Requirement

Information about Lead-free produced sets

Philips CE is starting production of lead-free sets from

1.1.2005 onwards.

INDENTIFICATION:

Regardless of special logo (not always indicated)

One must treat all sets from next rules.

Example S/N:

1 Jan 2005 onwards, according

• Special information for BGA-ICs:

- always use the 12nc-recognizable soldering temperature proﬁle of the speciﬁc BGA (for de-soldering always use the lead-free temperature proﬁle, in case of doubt)

- lead free BGA-ICs will be delivered in so-called ‘drypackaging’ (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYSwebsite.

Do not re-use BGAs at all.

•

For sets produced before 1.1.2005 (except products of

2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes.

Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 1991 wk 18

So from 0501 onwards = from 1 Jan 2005 onwards

Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.

Due to lead-free technology some rules have to be respected by the workshop during a repair:

• Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-pate is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle.

•

Use only adequate solder tools applicable for lead-free

solder alloy. The solder tool must be able

o To reach at least a solder-temperature of 400°C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications.

• Adjust your solder tool so that a temperature around 360°C – 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and ﬂux-ﬂuid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat.

• Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305).

• Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies.

•

On our website www.atyourservice.ce.Philips.com you ﬁnd more information to:



BGA-de-/soldering (+ baking instructions)

 Heating-proﬁles of BGAs and other ICs used in Philips-sets

You will ﬁnd this and more technical information within the

“magazine”, chapter “workshop news”.

For additional questions please contact your local repair-helpdesk.

1.Technical Specifications and Connection Facilities

1.1 PCB Locations

Fronts Boards

HS Drive

Module

Analogue

Board

Digital Board

(below Basic Engine)

PSU Board

1.2 Read / Write Speed

Type of Disc(Function) Disc Rotation Speed

Read Speed CD 7X CAV Read Speed DVD 4X CAV Write Speed DVD+R/RW 2.4X ZCAV Write Speed DVD-R/RW 2X

1.3 General: Mains voltage : 220V-240V

Mains frequency : 50Hz Standby Power consumption : <3W

1.4 RF Tuner

Test Equipment :Fluke 54200 TV Signal generator Test Stream:PAL BG Philips Standard test pattern

1.4.1.1 System:

PAL B/G, PAL D/K, SECAM L/L’, PAL I

1.4.1.2 RF – Loop Through

Frequency range : 43MHz-860MHz Gain: (ANT IN-ANT OUT) : -4dB ± 2dB

1.4.1.3 Receiver: PLL tuning with AFC for optimum reception

Frequency range : 45.25MHz - 857MHz Sensitivity at 40dB S/N (video unweighted) : ≤ 40dBµV at 75Ω (high end)

≤ 60dBµV at 75Ω (low end)

1.4.1.5 Video Performance:

Channel 25 / 503,25MHz, Test pattern: PAL BG PHILIPS standard test pattern, RF Level 74dBV Measured on SCART 1 Frequency response : 0.1MHz - 4.00MHz ± 3dB Group delay (0.1MHz-4.4MHz) : 0 nsec ± 150 nsec

1.4.1.6 Audio Performance:

Audio Performance Analogue – HiFi:

Frequency response at SCART 1 (L + R) output : 100Hz -12kHz / 0 ± 3dB

S/N Ratio (20Hz- 20KHz) unweighted Harmonic distortion (1kHz, ± 25kHz deviation) :≤ 1.5%

Audio Performance NICAM: Frequency response at SCART 1

(L + R) output : 40 Hz – 15 kHz / 0 ± 3dB S/N according to DIN 45405,7,1967 and PHILIPS standard test pattern

video signal : ≥ 40dB Harmonic distortion (1kHz) : ≤ 1.5%

1.4.1.7 Tuning

Automatic Search Tuning

scanning time without antenna : 3min. typical stop level (vision carrier) : ≥ 37dBµV

Maximum tuning error(drift) during operation : ± 100kHz

Tuning Principle

Automatic B, G, I, DK and L/L’ detection .Manual selection in “STORE” mode

1.5 Analogue Inputs / Outputs

1.5.1 SCART 1(Connected to TV)

Pin Signals:

1 - Audio-out R 1.8V RMS

2 - Audio-out R 3 - Audio-out L 1.8V RMS

4 - Audio GND 5 - Blue / Chroma GND 6 - Audio- in L 7 - Blue-out 0.7Vpp ± 0.1V into 75 W 8 - Function switch < 2V = TV

> 4.5V / < 7V = asp. Ratio 16:9 DVD > 9.5V / < 12V = asp. Ratio 4:3 DVD

9 - Green GND 10 – P50 control not use 11 – Green out 0.7Vpp ± 0.1V into 75W (*) 12 - NC 13 - Red / Chroma GND 14 - Fast switch GND 15 - Red-out / Chroma-out 0.7Vpp ± 0.1V into 75W (*) 16 - Fast switch

RGB / CVBS or Y out < 0.4V into 75W = CVBS >1V / < 3V into 75W = RGB

17 - Y/CVBS GND OUT 18 - CVBS GND IN 19 - CVBS-out 1Vpp ± 0.1V into 75W(*) 20 - CVBS-in 21 - Shield

1.5.2 SCART 2 (Connected to AUX)

Pin Signals: 1 - Audio-out R 1.8V RMS 2 - Audio-in R 3 - Audio-out L 1.8V RMS 4 - Audio GND 5 - Blue / Chroma GND 6 - Audio-in L

7 - Blue-in 8 - Function switch 9 - Green GND 10 - NC 11 - Green-in 12 - NC 13 - Red / Chroma GND 14 - Fast switch GND 15 - Red-in/Chroma-in 16 - Fast switch

RGB / CVBS or Y in

17 - CVBS-OUT GND 18 – Y/CVBS in GND 19 - CVBS out sync 1Vpp ± 0.1V into 75Ω 20 – CVBS in / Y-in 21 – Shield

1.5.3 Audio/Video Front Input Connectors

Audio – Cinch

Input voltage : 2.2Vrms Input impedance : > 10kΩ

Video – Cinch

Input voltage : 1Vpp ± 3dB Input impedance : 75Ω

Video – YC (Hosiden)

According to IEC 933-5

Superimposed DC-level on pin 4(load >100kΩ)

<2.4V is detected as 4:3 aspect ratio >3.5V is detected as 16:9 aspect ratio

Input voltage Y : 1Vpp ± 3dB Input impedance Y : 75Ω Input voltage C : 300 mVpp ± 3dB Input impedance C : 75Ω

1.6 Digital Inputs / Outputs

1.6.1 Digital Output

Digital Audio – Coaxial LCM : according IEC 60958 MPEG 1,MPEG2,AC3 : according IEC 61937 DTS : according IEC 61937+addendum

1.7.3 Digital Video Input(IEEE 1394)

Implementation Standard according: IEEE Std 1394-1995 IEC61883 - Part1 IEC61883 - Part2 SD-DVCR (02-01-1997)

Specification of consumer use digital VCR’s using 6.3mm magnetic tape – dec. 1994 Mechanical connection according to Annex of IEC 61883-1

1.8 Video Performance

All outputs loaded with 75 Ω SNR measurements over full bandwidth without weighting.

1.8.1 SCART (RGB)

SNR : > -65dB on all output Bandwidth : 4.8MHz ± 2dB

1.9 Audio Performance CD

1.9.1 Cinch Output Rear

Output voltage 2 channel mode : 2Vrms ± 2dB Channel unbalance (1kHz) : < 0.22dB

Crosstalk 1kHz : > 100dB Crosstalk 16Hz-20kHz : > 87dB Frequency response 20Hz-20kHz : ± 0.5dB max Signal to noise ratio : < 85dB Dynamic range 1kHz : <83dB Distortion and noise 1kHz : < 83dB Distortion and noise 16Hz-20kHz : < 75dB Intermodulation distortion : < 70dB Mute : < 95dB

1.9.2 Scart Audio

Output voltage 2 channel mode : 1.6Vrms ± 2dB Channel unbalance (1kHz) : < 1dB Crosstalk 1kHz : > 85dB Crosstalk 16Hz-20kHz : > 70dB Frequency response 20Hz-20kHz : ± 0.5dB max Signal to noise ratio : > 80dB Dynamic range 1kHz : > 75dB Distortion and noise 1kHz : > 75dB Distortion and noise 16Hz-20kHz : > 50dB Intermodulation distortion : > 70dB Mute : > 80dB

1.10 Dimensions and Weight

Height of feet : 5.5mm Apparatus(WxDxH) : 435 x 100 x 344mm Weight without packaging : 5.2kg Weight with packaging : 7.0kg

1.11 Laser Output Power & Wavelength

1.11.1 DVD

Output power during reading : 0.8mW Output power during writing : 20mW Wavelength 650nm

1.11.2 CD

Output power :0.3mW Wavelength :780nm

1.2 VHS Drive Technical Specifications

1.2.1 Servo

1.2.1.1 Drum lock Phase Changing Time :6.5H

1.2.1.2 WOW Flutter R/P(CCIR WTD) :0.3%

1.2.1.3 Jitter :0.07µs

1.2.2 Video

1.2.2.1 Output Level(R/P EBU Full Color Bar) at 75Ω :1.0Vpp

1.2.2.2 Resolution (R/P monochronous scope W/O burst:230 line

1.2.2.3 Signal to Noise Ratio(Y-Band) :43dB

1.2.2.4 (C AM) :41dB

1.2.2.5 (C PM) :38dB

1.2.3 Normal Audio

1.2.3.1 Output Level(R/P Input 1KHz – 10dBv) :-5dBµv

1.2.3.2 S/N :40dB

1.2.3.4 Distortion ratio :1.5%

1.2.3.5 Frequency Response( at reference 1KHz,-20dBv) At 200Hz :-3dB

At 6KHz :-3dB

1.2.4 HiFi AUDIO

1.2.4.1 Output Level :-9dBv

1.2.4.2 Dynamic range(R/P JIS A) :80dB

1.2.4.3 Frequency Response(at reference R/P Input 1KHz –20dBv)

1.2.4.4 At 20Hz :0dB

Frequency Response(at reference R/P Input 1KHz –20dBv)

At 20KHz :0dB

1.2.4.5 Distortion (at reference R/P Input 1KHz –10dBv) :0.5%

Manual Procedure to remove the tape from the loader

Immediate action must be done to remove the Video Cassette on the set manually as described belo w : Note : Item number refers to the Deck Parts List in VCR Module

(12NC:2422 549 01124) unless otherwise stated

1. Turn the B525 (LDG Belt MK11 ) in the direction indicated by the arrow below in figure 1:

B525

Figure 1:Turning B525 by hand

2. Upon hearing the click sound , the Clip[B587] holding the VCR will be released as shown in figure 2.

Figure 2:Clip 587 released

3.The tape will be slackened as shown in figure 3.

Figure 3:Tape slackened

4.The video casette slowly reversed and raised to loading position in figure 4 .

Figure 4 :Video Casette Slowly reversed

5. Fold the slack of the video by hand to minimize damage by the front dust cover

cover upon approaching the B354 & B355 position will be closed and comes out of the Door Flap(112 of exploded view of DVDR3430V)

of Videocasette.The front

Figure 5:The dust cover slowy cover the tape due to spring action

of the dust cover

6.Remove the cassette as you normally does from the front loading position

Mechanical Instructions

Note : The position numbers given here refers to the Exploded view

1.1 Dismantling of the DVD Tray Cover manually

1) Insert a screw-driver into the slot provided at the bottom of the set and push in the direction as shown in figure 1 to unlock before sliding the Tray Cover 110 out.

Figure 1:Unlock DVD tray

1.2 Dismantling of the Basic Engine (Drive D4.5)

1) Remove 8 screws to loosen Top cover 240 .

2) Remove 4 screws to loosen the Basic Engine Holder D4.5 As shown in Figure 2.

Figure 2- Remove Basic Engine mounting

3) Remove 4 screw to detach the Holder from the Basic Engine and unscrew the Heatsin k plate . Basic Engine Service position as show once heatsink plate removed in Figure 4-4.

Remove the Heatsink plate

Figure 3 – Basic Engine Service Position

1.3 Dismantling of the PSU Board

4) Remove 4 screws to loosen the PSU Board 1007 as shown in Figure …

5) Service position for PSU Board is given in Figure 8.

Figure 4 – Remove PSU mounting

1.5 Dismantling of the Digital Board

Remove 4 screws to loosen the Digital Board 1004 as shown in Figure 4-5.

Figure 5 :Remove Digital Board Mounting

1) Service Position for Digital Board is given in Figure 6.

Figure 6: Digital Board Service Position

1.5 Dismantling of the Analogue Board

1) Remove screws from the rear panel 230 to detach Analogue Board shown in Figure 7.

2) Service Position of Analogue Board is given in Figure 8.

Figure 7:Detach Analogue Board

Figure 8 :Analogue Board Service Position

Insulation sheet

1.6 Dismantling of the VHS Drive Module

Note:For items name& number mentioned below , please refer to VCR Module HK100ED (12NC:2422 549 01124)

1) Detach VHS Drive Module by unscrewing 5 screw shown on Figure 9

Figure 9:Remove VHS Module

2) While unscrewing the cross screws , great care must be taken with the screw located near the helical drum at the VHS module to prevent accidental scratches to the drum shown in figure 10.

Figure 10:Caution area

3) Make the VCR module upright and Insulation sheet must be inserted onto the drum to prevent damage by contact to the Recorder frame shown in Figure 11.

Insulation Sheet

Figure 11:Insulation sheet for precaution

Service Position of the VCR module is given in Figure 12.

Insulation Sheet

Figure 12:Service Position of the VHS Drive Module

Firmware Upgrading

A. Preparation to upgrade firmware:

1. Unzip the zip-archive file

2. Copy the files into different folder for burning into separate CD-R/CDRW.

3. Start the CD Burning software and create a new CD project (data disc) with the following settings:

File system: Joliet Format: MODE 2: CDROM XA Recording mode: SINGLE SESSION (TRACK-AT-ONCE), FINALIZED CD

Note: Long file name is necessary for the preparation of the upgrade disc

4. Place the file into the root directory of the new CD project.

5. Burn the data onto blank CDR or CD-RW.

B. Procedure to apply the Drive upgrade:

1. Open the tray and load the Upgrade CDROM .

2. The tray closes and set will display:

“DRV UPG”

3. The OSD will display

“Loader Software Upgrade Software Upgrade Disc detected . Select OK to start upgrading or CANCEL to exit.”

4. Click on the OK button .

5. The set will display:

“DRIVE UPGRADING”

With the OSD display

“Upgrading Software .Please Wait.Do not switch off the power.”

The whole process takes less than 5 minutes

6. When the upgrade is completed the tray will open automatically and the set will display:

“Loader Upgrade process has completed successfully .Press <OK> to reboot system.”

7. The tray open and the set will display:

8. The tray will display:

9. The OSD will display

10. Click on the OK button .

11. The set will display :

“DRV OK”

“SW UPGD”

“Software Upgrade Disc detected.Select OK to start upgrading or CANCEL to exit .”

“Upgrading SW”

12. And the OSD will display

“Upgrading Software .Please Wait.Do not switch off the power.”

The whole process takes less than 5 minutes

13. When the upgrade is completed the tray will open automatically and the set will display:

“System is successfully upgraded.Remove disc from tray and reset system.”

14. The tray open and the set will display:

“SW DONE”

15. Press <OK> and the set goes to standby .

B. How to read out the firmware version to confirm set has been upgraded:

1. Power up the set

2. Ensure no disc inside the loader,if no ,open the tray to remove the disc and close the tray.

3. Press <0> <0> <0><9> in succession

4. Press <OK> button

5. The TV connected to the set will display:

“DVDR3430V_EU_V04_02 , Region :2 , Drive 45.04.05 Build: 0097_PHILIPS_V03 JAN 11 2006 , 09:28:29 Stroke:31 ”

and the tray will open automatically for user to remove CD-ROM.

Note: Do not press any buttons or interrupt the mains supply during the upgrading

process, otherwise the set may becomes defective.

1.1 PSU Board

1.1.1General

Mains Connection

The PSU board provides the following connection to the rest of the set:

• Connector A(Connector J1 on Analogue Board): Supply/Signal to Analog Board Conn. 1101

• Serve as supply to Digital Board

1 2 3 4 5

• Connector B(Connector J2 on Analogue Board): Supply/Signal to Analogue Board Conn. 1102

Pin Supply/

1 VGN 2 5N 3 GND 4 IPFAIL

5 GND 6 12V

Supply/

Signal

12V

GND

3.3V GND

Signal

Remarks

HIGH>4.0v =

power good

LOW<0.5v =power

fail

The Mains must be disconnected from the Set before attempting the procedure mentioned

below: The PSU is designed with short-circuit protection that will shutdown the power supply. When this

happen, the voltage stored in capacitor C1 and C40 will prevent the Pow er Su pply to turn-on, therefore they must be discharged with a screwdriver with high electrical isol ation handle before the PSU can function normally again.

Note :During the process of discharging the capacito rs ,spark can be observed which is typical of the high voltage stored in Capacitor C1 and C40.

1.2 Front Board (Panel – Display + Key)

1.2.1 General

This board consists of the following parts:

• Slave µP

• Frontend (Audio & Video)

• VFD Heater voltage Generator

1.2.2 FIP Control Driver (IC 7105 : UPD16316GB)

The core element of the Front Display + Key board is the slave µP. It runs on a 5V supply and is responsible for the following functions:

• Interface with the Domino chip on the Digital Board

• Evaluation of the keyboard matrix within Front board

• Decoding the remote control commands from the infra-red receiver

• Activation and control of the display

• Timer Wake-up activation

It runs on two clock frequencies namely:

• 5MHz for normal operation

• 32.768KHz for the real time clock

1.2.3 Interface to the Domino chip

It communicates with the Domino Host on the Digital board via a 6-wire synchonous serial interface. The Host is always the master to generate the communication clock to the slave µP irrespective of the direction of data transfer.

1.2.4 Evaluation of the keyboard matrix

A key matrix is used on the Front board. The FIP control driver does the key-scanning with FIP9 - FIP24 (pin 23-26 and 29-40) as output and KEY_A - KEY_C (pin 41-43) as input. Each key is assigned a key code based on the output and input ports, and the slave µP will do the evaluation by getting the key codes.

1.2.5 IR receiver and signal evaluation

The IR receiver on the Front Board contains a selectively controlled amplifier as well as a photodiode. The photo-diode changes the received infrared transmission to electrical pulses, which are then amplified and demodulated. On the output of the IR receiver, a pulse sequence with TTL-level, which corresponds to the envelope curve of the received IR remote control command, can be measured. This pulse sequence is fed into the slave µP for further processing via pin 13.

1.2.6 Vacuum Fluorescent Display [1002 : HUV-08SS65T]

The VFD is fully controlled and driven by the FIP control driver.

1.2.7 VFD Heater Voltage Generator

The oscillator circuit provided by [5100, 2101, 2102 & 7100] provides the necessary sine wave signal for transistors [7101, 7102 & 7103] to generate the 50% duty-cycle 48KHz AC square-wave signal for the filament of the VFD.

1.2.8 Timer Wake-up activation

During the Standby mode, the FIP ctrl driver provides a wakeup call (POWER_CTL-line switches to high) to the Domino Host on the Digital Board. It will then starts up and asks for the wake-up reason.

1.3 Analog Board

1.3.1 General

The pc board consists of the following parts:

• Fan Control (optional)

• Power Supply Unit

• Tuner Frontend

• Audio ADC/DAC

1.3.2 Power Supply Unit Interface

This power supply unit Interfacing interfaces with a external power supply board ,draws the required voltage level to the various supply lines to the requirement mentioned below:

The following are the various supply lines provided:

• 3V3SW to CU, DAC_ADC, Digital Board

• 5V to IOA, IOV, CU, CINCH, MSP, DIGIO and FV

• 5N to MSP (provision only) and Digital Board (provision only)

• 5VE to Basic Engine

• 5V_BE to Digital Board

• 5NSTBY to IOA, CINCH and DAC_ADC

• 5VSTBY to IOA, IOV, FV, MSP, DAC_ADC, Front Board

• 8VSTBY to MSP

• 12V to Digital Board,VCR module

• 12VSTBY to CU, IOV, DAC_ADC, Front Board

• 12VE to Basic Engine and Digital Board (provision only)

• 33VSTBY to FV

• VGNSTBY to Front Board

• 21V to VCR module loader motor

Standby modes:

In Standby mode the STBY control line is low, switching off the 3V3SW, 5V, 5N (provision), 5VE, 12V and 12VE supply and thus reducing the power consumption.

1.3.3 Tuner Frontend [1151 : TMQZ2]

It has a RF IN for antenna connection and RF OUT which provides a RF loop through for connection to the TV. The Frontend ( Tuner & IF-demodulator ) is controlled by I Domino Host on the Digital board. Complete video processing is done in this unit and the video output (CVBS) is taken out from the [VIDEO_OUT] pin 13 via a transistor as CVBS_TV-line to the Video I/O circuitry. The audio-IF component SIF1 is taken out from the [SIFOUT] pin 10 for the demodulation by the Multi-sound processor (MSP).

1.3.4 Audio demodulator

The sound demodulation is done by the MSP3415 [7315], which is also fully controlled via I Domino Host. The audio signals are available at pin 26 and pin 27 and fed as AFER- & AFEL- line to the audio I/O for further processing.

Audio Routing

C (SCL_5V- and SDA_5V-) lines coming from the

C bus by the

1.3.5 Audio routing

The sound processing is always done in stereo (that means separate left- and right- channel) and the complete switching is realized by using HEF4052 which is a dual four-to-one multiplexer and MSP3415G which is a multisound processor.

a) Scart 1 – Output path

The multiplexer [7311] selects either signals from the Scart 2 Input (AIN2L/AIN2R) or the Audio DAC (ALDAC/ARDAC) as the output source for Scart 1 (AOUT1L/AOUT1R).

b) Scart 2 – Output path

The MSP [7315] selects either signals from the Scart 1 Input (AIN1L/AIN1R), the Audio DAC (ALDAC/ARDAC) or the Tuner Frontend as the output source for Scart 2 (AOUT2L/AOUT2R).

c) Record path (DVDR Recording )

The record-selector [7311] selects either signals from the Scart 1 Input (AIN1L/AIN1R), Scart 2 Input (AIN2L/AIN2R), Front Cinch (AINFL/AINFR) or the MSP (AFEL/AFER) and routes to the audio ADC (ALADC/ARADC) for record purposes. The switch is controlled via RSA1 and RSA2 signals coming from the MSP.

d) Record path (VCR Recording )

Another record-selector Multiplexer HEF4052B [7319] , selects either audio signal from left (ALDAC) and right (ARDAC) (from DVDRW), with PRE_R and PRE_L audio signal (from all external source other than DVDRW)

and routes to VCR for record purposes . The switch is controlled via V_AUD_SEL and V_AUD_MUTE signals

coming from the STV6618 matrix.

1.3.6 Audio ADC/DAC

The conversion of analog audio signals from the record-selector [7311] outputs (ALADC/ARADC) is done via UDA1361TS [7704]. This IC can process input signals up to 2V input pins. All required clock signals are generated on the digital board and only the audio data (A_DAT-line) are routed to Digital board for further processing.

The transformation of digital audio back into analog domain is done by CS4351 [7411]. All necessary clock signals are coming from the digital board and digital audio data (D_DATA0-line) are converted into analog signals (pin 15 and 18). The output signals from the audio DAC part (ALDAC/ARDAC) are directly routed to the rear cinch sockets. To avoid plops and any other audible noise on the output muting circuits are implemented for each channel.Muting for the various other output lines are done via AKILL & BKILL-lines which is a combination of the D_KILL from the Digital board and POWER_FAIL from power supply and AMUTE & BMUTE (digital silence mute) from DAC-part.

VIDEO ROUTING OF DVDR3430V

by using external resistors in series to the

rms

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