1999 Jul 21 4
Philips Semiconductors Product specification
DECT 500 mW power amplifier CGY2032TS
HANDLING
Do not operate or store near strong electrostatic fields. Meets class 1 ESD test requirements [Human Body Model
(HBM)], in accordance with
“MIL STD 883C - method 3015”
.
THERMAL CHARACTERISTICS
Note
1. On Philips evaluation board, R
th(j-a)
value is typically 80 K/W.
DC CHARACTERISTICS
T
amb
=25°C; unless otherwise specified.
AC CHARACTERISTICS
V
DD
= 3.2 V; fRF= 1900 MHz; Pi= 0 dBm; T
amb
=25°C; duty factor δ = 50%; 50 Ω impedance system; measured and
guaranteed on the CGY2032TS evaluation board; the circuit diagram is shown in Fig.5.
Note
1. The device is adjusted to provide nominal value of load power into a 50 Ω load. The device is switched off and a 6 : 1
load replaces the 50 Ω load. The device is switched on and the phase of the 6 : 1 load is varied
360 electrical degrees during a 60 seconds test period.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air; note 1 145 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Pins V
DD1,VDD2
and V
DD3
V
DD
positive supply voltage 1.8 3.2 4.2 V
I
DD
positive peak supply current VDD= 3.2 V −−800 mA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
P
i
input power −5 0 +5 dBm
δ duty factor − 50 100 %
P
o
output power 26.5 27.5 29 dBm
I
DD
total drain current −−500 mA
η efficiency − 55 − %
P
leak
RF leakage to output in power off state VDD=0V −−40 −35 dBm
H2 second harmonic level −−−30 dBc
H3 third harmonic level −−−35 dBc
Stab stability (spurious levels) note 1 −−60 − dBc