Philips CGY2032TS-C1 Datasheet

DATA SH EET
Product specification Supersedes data of 1998 Nov 23 File under Integrated Circuits, IC17
1999 Jul 21
INTEGRATED CIRCUITS
CGY2032TS
1999 Jul 21 2
Philips Semiconductors Product specification
DECT 500 mW power amplifier CGY2032TS
FEATURES
Power Amplifier (PA) overall efficiency 55%
27.5 dBm saturated output power at 3.2 V
0 dBm input power
40 dB linear gain
Operation without negative supply
Wide operating temperature range 30 to +85 °C
SSOP16 package.
APPLICATIONS
1.88 to 1.9 GHz transceivers for DECT applications
2 GHz transceivers [Personal Handy phone System
(PHS), Digital Cellular System (DCS) and Personal Communication Services (PCS)].
GENERAL DESCRIPTION
The CGY2032TS is a GaAs Monolithic Microwave Integrated Circuit (MMIC) power amplifier specifically designed to operate from 3.6 V battery supply. No negative supply voltage is required for operation.
QUICK REFERENCE DATA
Note
1. For conditions, see Chapters “AC characteristics” and “DC characteristics”.
ORDERING INFORMATION
BLOCK DIAGRAM
SYMBOL PARAMETER
(1)
MIN. TYP. MAX. UNIT
V
DD
positive supply voltage 3.2 V
I
DD
positive peak supply current 350 mA
P
o
output power 27.5 dBm
T
amb
ambient temperature 30 +85 °C
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
CGY2032TS SSOP16 plastic shrink small outline package; 16 leads; body width 4.4 mm SOT369-1
Fig.1 Block diagram.
handbook, halfpage
MGK735
10 6, 7
2, 3, 4 12, 13, 14
11
85
16 15
1
RFI
V
DD1
GND1 GND2 GND3
V
DD2VDD3
RFO OPM
CGY2032TS
1999 Jul 21 3
Philips Semiconductors Product specification
DECT 500 mW power amplifier CGY2032TS
PINNING
SYMBOL PIN DESCRIPTION
V
DD3
1 third stage supply voltage GND3 2 third stage ground supply GND3 3 third stage ground supply GND3 4 third stage ground supply V
DD2
5 second stage supply voltage GND2 6 second stage ground supply GND2 7 second stage ground supply V
DD1
8 first stage supply voltage n.c. 9 not connected GND1 10 first stage ground supply RFI 11 PA input GND3 12 third stage ground supply GND3 13 third stage ground supply GND3 14 third stage ground supply OPM 15 output pre-matching RFO 16 PA output
Fig.2 Pin configuration.
handbook, halfpage
CGY2032TS
MGK734
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10
9
V
DD3
GND3 GND3 GND3
V
DD2
GND2 GND2
V
DD1
n.c.
GND1
RFI
GND3
GND3
GND3
OPM
RFO
FUNCTIONAL DESCRIPTION Amplifier
The CGY2032TS is a 3-stage GaAs power amplifier capableofdelivering500 mW(typ.)at1.9 GHzintoa 50 load. Each amplifier stage has an open-drain configuration. The drains have to be loaded externally by adequate reactive circuits which must also provide a DC path to the supply.
The amplifier can be switched off by means of a single external PNP or PMOS series switch connected between the battery and the amplifier drains.
This switch can also be used to vary the actual supply voltage applied to the amplifier and hence, control the output power.
This device is specifically designed to work with a duty factor of 50% and can work up to 100% with good thermal performance printed-circuit boards.
Biasing
Internal biasing is provided inside the amplifier for class AB operation.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. On Philips evaluation board.
2. On Philips evaluation board, P
tot
maximum value is 800 mW.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DD
operating supply voltage note 1 5.2 V
T
j(max)
maximum operating junction temperature 150 °C
P
tot
total power dissipation note 2 450 mW
P
i
input power 15 dBm
T
stg
storage temperature 55 +125 °C
1999 Jul 21 4
Philips Semiconductors Product specification
DECT 500 mW power amplifier CGY2032TS
HANDLING
Do not operate or store near strong electrostatic fields. Meets class 1 ESD test requirements [Human Body Model (HBM)], in accordance with
“MIL STD 883C - method 3015”
.
THERMAL CHARACTERISTICS
Note
1. On Philips evaluation board, R
th(j-a)
value is typically 80 K/W.
DC CHARACTERISTICS
T
amb
=25°C; unless otherwise specified.
AC CHARACTERISTICS
V
DD
= 3.2 V; fRF= 1900 MHz; Pi= 0 dBm; T
amb
=25°C; duty factor δ = 50%; 50 impedance system; measured and
guaranteed on the CGY2032TS evaluation board; the circuit diagram is shown in Fig.5.
Note
1. The device is adjusted to provide nominal value of load power into a 50 load. The device is switched off and a 6 : 1 load replaces the 50 load. The device is switched on and the phase of the 6 : 1 load is varied 360 electrical degrees during a 60 seconds test period.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air; note 1 145 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Pins V
DD1,VDD2
and V
DD3
V
DD
positive supply voltage 1.8 3.2 4.2 V
I
DD
positive peak supply current VDD= 3.2 V −−800 mA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
P
i
input power 5 0 +5 dBm δ duty factor 50 100 % P
o
output power 26.5 27.5 29 dBm I
DD
total drain current −−500 mA η efficiency 55 % P
leak
RF leakage to output in power off state VDD=0V −−40 35 dBm H2 second harmonic level −−−30 dBc H3 third harmonic level −−−35 dBc Stab stability (spurious levels) note 1 −−60 dBc
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