Philips CBT3384 User Manual

CBT3384

10-bit bus switch with 5-bit output enables

Rev. 06 — 2 November 2009 Product data sheet

1. General description

The CBT3384 provides ten bits of high-speed TTL-compatible bus switching. The low
ON resistance of the switch allows connections to be made with minimal propagation
delay.

The CBT3384 device is organized as two 5-bit bus switches with two separate output
enable (1OE, 2OE)inputs. When nOE is LOW, the switch is on and port A is connected to
the B port. When nOE is HIGH, each switch is disabled.

The CBT3384 is characterized for operation from −40 °C to +85 °C.

2. Features

n 5 Ω switch connection between two ports
n TTL-compatible control input levels
n Multiple package options
n See CBTD3384 for CBT3384 with level shifting diodes
n Latch-up protection exceeds 100 mA per JESD78
n ESD protection:

u HBM JESD22-A114E exceeds 2000 V
u CDM JESD22-C101C exceeds 1000 V

3. Ordering information

Table 1. Ordering information

Type
number

CBT3384D −40 °C to +85 °C SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
CBT3384DB −40 °C to +85 °C SSOP24 plastic shrink small outline package; 24 leads;

CBT3384DK −40 °C to +85 °C SSOP24

CBT3384PW −40 °C to +85 °C TSSOP24 plastic thin shrink small outline package; 24 leads;

[1] Also known as QSOP24 package

Package
Temperature range Name Description Version

SOT340-1

body width 5.3 mm

[1]

plastic shrink small outline package; 24 leads; body
width 3.9 mm; lead pitch 0.635 mm

body width 4.4 mm

SOT556-1

SOT355-1

NXP Semiconductors

4. Functional diagram

CBT3384

10-bit bus switch with 5-bit output enables

Fig 1. Logic diagram

5. Pinning information

5.1 Pinning

CBT3384

1

1OE V

2

1B1 2B5

3

1A1 2A5

4

1A2 2A4

5

1B2 2B4

6

1B3 2B3

7

1A3 2A3

8

1A4 2A2

9

1B4 2B2

10

1B5 2B1

11

1A5 2A1

12

GND 2OE

001aak878

1A1

1A5

1OE

2A1

2A5

2OE

3

11

1

14

22

13

2

1B1

10

1B5

15

2B1

23

2B5

001aak877

CBT3384

24

CC

23
22
21
20
19
18
17
16
15
14
13

1

1OE V

2

1B1 2B5

3

1A1 2A5

4

1A2 2A4

5

1B2 2B4

6

1B3 2B3

7

1A3 2A3

8

1A4 2A2

9

1B4 2B2

10

1B5 2B1

11

1A5 2A1

12

GND 2OE

001aak879

24

CC

23
22
21
20
19
18
17
16
15
14
13

Fig 2. Pin configuration for SO24 (SOT137-1) Fig 3. Pin configuration for SSOP24 (SOT340-1) and

TSSOP24 (SOT355-1)

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 2 of 14

NXP Semiconductors

CBT3384

10-bit bus switch with 5-bit output enables

CBT3384

1OE V

1

1B1 2B5

2

1A1 2A5

3

1A2 2A4

4

1B2 2B4

5

1B3 2B3

6

1A3 2A3

7

1A4 2A2

8

1B4 2B2

9

10

1B5 2B1

11

1A5 2A1

12

GND 2OE

001aak880

24
23
22
21
20
19
18
17
16
15
14
13

Fig 4. Pin configuration for SSOP24 (SOT556-1)

5.2 Pin description

Table 2. Pin description

Symbol Pin Description

OE, 2OE 1, 13 output enable input (active LOW)

1
1A1 to 1A5 3, 4, 7, 8, 11 data input/output (A port)
2A1 to 2A5 14, 17, 18, 21, 22 data input/output (A port)
1B1 to 1B5 2, 5, 6, 9, 10 data input/output (B port)
2B1 to 2B5 15, 16, 19, 20, 23 data input/output (B port)
GND 12 ground (0 V)
V

CC

24 positive supply voltage

CC

6. Functional description

Table 3. Function selection

Input Input/output
1OE 2OE 1An, 1Bn 2An, 2Bn

L L 1An = 1Bn 2An = 2Bn
L H 1An = 1Bn Z
H L Z 2An = 2Bn
HHZZ

[1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state.

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 3 of 14

[1]

NXP Semiconductors

7. Limiting values

CBT3384

10-bit bus switch with 5-bit output enables

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).
T

=−40°C to +85°C, unless otherwise specified.

amb

[1]

Symbol Parameter Conditions Min Max Unit

V

CC

V

I

I

O

I

IK

T

stg

[1] Stresses beyond those listed may cause permanent damage to the device.These are stress ratings only and functional operation of the

device at these or any other conditions beyond those indicated under Section 8. is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.

[2] The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

supply voltage −0.5 +7.0 V
input voltage

[2]

−0.5 +7.0 V
output current VO<0V - ±128 mA
input clamping current V

=0V −50 - mA

I/O

storage temperature −65 +150 °C

8. Recommended operating conditions

Table 5. Operating conditions

All unused control inputs of the device must be held at VCC or GND to ensure proper device operation.

Symbol Parameter Conditions Min Typ Max Unit

V
V
V
T

CC
IH
IL

amb

supply voltage 4.5 - 5.5 V
HIGH-state input voltage 2.0 - - V
LOW-state input voltage - - 0.8 V
ambient temperature operating in free air −40 - +85 °C

9. Static characteristics

Table 6. Static characteristics

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions T

V
I
I

∆I

V

C
C

I
CC

IK

CC

pass

I
io(off)

input clamping voltage VCC= 4.5 V; II= −18 mA - - −1.2 V
input leakage current VCC= 5.5 V; VI= GND or 5.5 V - - ±1 µA
supply current VCC= 5.5 V; IO= 0 mA;

V

I=VCC

additional supply current per input pin; VCC= 5.5 V; one input at

3.4 V, other inputs at V

or GND

or GND

CC

[2]

pass voltage output HIGH; VI=VCC= 5.0 V;

I

= −100 µA

O

input capacitance control pins; VI= 3 V or 0 V - 4.0 - pF
off-state input/output

port off; VI= 3 V or 0 V; nOE = V

CC

capacitance

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 4 of 14

= −40 °C to +85 °C Unit

amb

Min Typ

[1]

Max

--3µA

- - 2.5 mA

3.6 3.9 4.2 V

- 10.0 - pF

NXP Semiconductors

CBT3384

10-bit bus switch with 5-bit output enables

Table 6. Static characteristics

…continued

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions T

R

ON

[1] All typical values are at VCC=5V, T
[2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[3] Measured by the voltage drop between the nAn and the nBn terminals at the indicated current through the switch. ON resistance is

ON resistance VCC= 4.5 V; VI=0V; II=64mA

= 4.5 V; VI=0V; II=30mA

V

CC

= 4.5 V; VI= 2.4 V; II= −15 mA

V

CC

=25°C.

amb

determined by the lowest voltage of the two (nAn or nBn) terminals.

[3]
[3]
[3]

= −40 °C to +85 °C Unit

amb

Min Typ

[1]

Max

-57Ω

-57Ω

-1015Ω

10. Dynamic characteristics

Table 7. Dynamic characteristics

Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 7.

Symbol Parameter Conditions T

Min Typ Max Min Max

t

pd

propagation delay nAn, nBn to nBn, nAn;

see

Figure 5

[1][2]

VCC = 5.0 V ± 0.5 V - - 0.25 - 0.25 ns

t

PZH

t

PZL

t

PHZ

t

PLZ

OFF-state to HIGH
propagation delay

OFF-state to LOW
propagation delay

HIGH to OFF-state
propagation delay

LOW to OFF-state
propagation delay

nOE to nAn or nBn;
see

Figure 6

= 5.0 V ± 0.5 V 1.2 2.3 5.7 1.2 5.6 ns

V

CC

nOE to nAn or nBn;
see

Figure 6

= 5.0 V ± 0.5 V 1.2 2.3 5.7 1.2 6.0 ns

V

CC

nOE to nAn or nBn;
see

Figure 6

= 5.0 V ± 0.5 V 1.7 3.6 5.2 1.7 5.5 ns

V

CC

nOE to nAn or nBn;
see

Figure 6

= 5.0 V ± 0.5 V 1.7 2.7 5.2 1.7 6.6 ns

V

CC

= 25 °C T

amb

= −40 °C to +85 °C Unit

amb

[1] The propagation delay is the calculated RC time constant of the typical ON resistance of the switch and the specified load capacitance,

when driven by an ideal voltage source (zero output impedance).

[2] tpd is the same as t

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 5 of 14

PLH

and t

PHL

.

NXP Semiconductors

10-bit bus switch with 5-bit output enables

11. Waveforms

V

I

nAn, nBn input

GND

V

OH

nBn, nAn output

V

OL

V

M

t

PHL

V

M

Measurement points are given in Table 8.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.

Fig 5. The data input (nAn, nBn) to output (nBn, nAn) propagation delay times

V

I

nOE input

output
LOW to OFF
OFF to LOW

output
HIGH to OFF
OFF to HIGH

GND

3.5 V

V

V

OH

GND

OL

V

M

t

outputs

enabled

PLZ

t

PHZ

V

X

V

Y

outputs

disabled

V

M

V

M

t

t

V

M

001aak881

PZL

t

PZH

PLH

V

M

V

001aak298

M

outputs
enabled

CBT3384

Measurement points are given in Table 8.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.

Fig 6. Enable and disable times

Table 8. Measurement points

Supply voltage Input Output
V

CC

V

I

V

M

V

M

V

X

V

Y

VCC = 5.0 V ± 0.5 V GND to 3.0 V 1.5 V 1.5 V VOL + 0.3 V VOH− 0.3 V

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 6 of 14

NXP Semiconductors

12. Test information

negative

pulse

0 V

positive

pulse

0 V

CBT3384

10-bit bus switch with 5-bit output enables

t

V

CC

DUT

W

V

M

t

r

t

f

V

M

t

W

V

EXT

R

V

O

C

L

R

L

L

V

I

90 %

V

M

10 %

t

f

t

10 %

r

90 %

V

M

V

I

R

T

V

I

G

001aae331

Test data is given in Table 9.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; Zo=50Ω.
The outputs are measured one at a time with one transition per measurement.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
V

= External voltage for measuring switching times.

EXT

Fig 7. Test circuit for measuring switching times

Table 9. Test data

Supply voltage Input Load V

V

I

tr, t

f

C

L

R

L

t

EXT

PLH

, t

PHL

t

PLZ

, t

PZL

t

PHZ

VCC = 5.0 V ± 0.5 V GND to 3.0 V ≤ 2.5 ns 50 pF 500 Ω open 7.0 V open

, t

PZH

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 7 of 14

NXP Semiconductors

13. Package outline

CBT3384

10-bit bus switch with 5-bit output enables

SO24: plastic small outline package; 24 leads; body width 7.5 mm

D

c

y

Z

24

pin 1 index

1

e

13

12

w M

b

p

SOT137-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT137-1

A

max.

2.65

0.1

A1A2A

0.3

2.45

0.1

2.25

0.012

0.096

0.004

0.089

IEC JEDEC JEITA

075E05 MS-013

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

(1)E(1) (1)

cD

15.6

15.2

0.61

0.60

REFERENCES

eHELLpQ

7.6

7.4

0.30

0.29

1.27

0.05

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

0.25

0.25 0.1

0.01

0.01

EUROPEAN

PROJECTION

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

99-12-27
03-02-19

o

8

o

0

Fig 8. Package outline SOT137-1 (SO24)

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 8 of 14

NXP Semiconductors

CBT3384

10-bit bus switch with 5-bit output enables

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

D

c

y

Z

24 13

A

2

A

pin 1 index

1

SOT340-1

E

H

E

Q

L

p

L

(A )

A

X

v M

A

A

3

θ

112

w M

b

e

DIMENSIONS (mm are the original dimensions)

UNIT A1A2A

Note

1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.

A

max.

0.21

mm

2

OUTLINE
VERSION

SOT340-1 MO-150

0.05

1.80

1.65

IEC JEDEC JEITA

0.25

b

3

p

0.38

0.25

p

0 2.5 5 mm

(1)E(1) (1)

cD

0.20

8.4

0.09

5.4

8.0

5.2

REFERENCES

scale

0.65 1.25

eHELLpQZywv θ

7.9

7.6

1.03

0.63

detail X

0.9

0.7

EUROPEAN

PROJECTION

0.13 0.10.2

0.8

0.4

ISSUE DATE

99-12-27
03-02-19

o

8

o

0

Fig 9. Package outline SOT340-1 (SSOP24)

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 9 of 14

NXP Semiconductors

CBT3384

10-bit bus switch with 5-bit output enables

SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm

D

c

y

Z

24

1

e

13

A

2

A

1

12

w M

b

p

E

H

E

detail X

A

(A )

3

L

p

L

X

A

θ

SOT556-1

v M

A

0 2.5 5 mm

scale

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

mm

OUTLINE
VERSION

SOT556-1

A

max.

1.73

0.068

1

0.25

0.10

0.0098

0.0040

A2A

1.55

1.40

0.061

0.055

IEC JEDEC JEITA

0.25

0.01

b

3

p

0.31

0.25

0.20

0.18

0.012

0.0098

0.008

0.0075

MO-137

UNIT A

inches

Note

1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included.

(1)E(1)

cD

8.8

8.6

0.344

0.337

REFERENCES

H

eL ywv θ

E

4.0

3.8

0.157

0.150

6.2

0.635 1

5.8

0.244

0.025 0.041

0.228

L

p

0.89

0.41

0.035

0.016

0.180.25 0.1

0.0070.01 0.004

EUROPEAN

PROJECTION

(1)

Z

1.05

0.66

0.040

0.026

ISSUE DATE

o

8

o

0

o

8

o

0

99-12-27
03-02-18

Fig 10. Package outline SOT556-1 (SSOP24)

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 10 of 14

NXP Semiconductors

CBT3384

10-bit bus switch with 5-bit output enables

TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm

D

c

y

Z

24

pin 1 index

13

A

2

A

1

112

w M

b

e

p

E

H

E

detail X

SOT355-1

A

X

v M

A

Q

(A )

3

A

θ

L

p

L

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT A1A2A

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

A

max.

0.15

mm

1.1

OUTLINE
VERSION

SOT355-1 MO-153

0.05

0.95

0.80

IEC JEDEC JEITA

0.25

b

3

p

0.30

0.19

(1)E(2) (1)

cD

0.2

7.9

0.1

7.7

REFERENCES

eHELLpQZywv θ

4.5

4.3

0.65

6.6

6.2

0.75

0.50

0.4

0.3

EUROPEAN

PROJECTION

o

0.5

0.13 0.10.21

ISSUE DATE

99-12-27
03-02-19

0.2

8

o

0

Fig 11. Package outline SOT355-1 (TSSOP24)

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 11 of 14

NXP Semiconductors

10-bit bus switch with 5-bit output enables

CBT3384

14. Abbreviations

Table 10. Abbreviations

Acronym Description

CDM Charged Device Model
DUT Device Under Test
ESD ElectroStatic Discharge
FET Field Effect Transistor
HBM Human Body Model
PRR Pulse Rate Repetition
TTL Transistor-Transistor Logic

15. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

CBT3384_6 20091102 Product data sheet - CBT3384_5
Modifications:

CBT3384_5 20011220 Product specification - CBT3384_4
CBT3384_4 20010319 Product specification - CBT3384_3
CBT3384_3 20001113 Product specification - CBT3384_2
CBT3384_2 20000128 Product specification - -

• The format of this data sheet has been redesigned to comply with the new identity guidelines of

NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Changed: Table 6 “Static characteristics”

a. Pass voltage values have changed.
b. Undershoot static current protection removed.

• Changed: Table 7 “Dynamic characteristics”

a. Enable and disable times values have changed.

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 12 of 14

NXP Semiconductors

16. Legal information

16.1 Data sheet status

CBT3384

10-bit bus switch with 5-bit output enables

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s)described in this document may have changed since this document waspublished and may differin case of multiple devices.The latestproduct status

information is available on the Internet at URL

[1][2]

Product status

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information includedherein and shall have no liabilityfor the consequencesof
use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet
with thesame product type number(s) and title. Ashort data sheet is intended
for quickreference only and should not be relied upon to contain detailedand
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.

16.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as tothe accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.

Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental

[3]

http://www.nxp.com.

Definition

damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in
the Absolute MaximumRatings System of IEC 60134) maycause permanent
damage to the device. Limiting valuesare stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at

http://www.nxp.com/profile/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.

16.4 Trademarks

Notice: Allreferenced brands,product names, service names and trademarks
are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]

CBT3384_6 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 06 — 2 November 2009 13 of 14

NXP Semiconductors

18. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Functional description . . . . . . . . . . . . . . . . . . . 3

7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Recommended operating conditions. . . . . . . . 4

9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5

11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

12 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

17 Contact information. . . . . . . . . . . . . . . . . . . . . 13

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

CBT3384

10-bit bus switch with 5-bit output enables

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2009. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]

Date of release: 2 November 2009

Document identifier: CBT3384_6