Philips byd71 DATASHEETS

DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
BYD71 series
Ultra fast low-loss controlled avalanche rectifiers
Product specification Supersedes data of 1996 May 24
1996 Sep 19
Philips Semiconductors Product specification
Ultra fast low-loss
BYD71 series
controlled avalanche rectifiers

FEATURES

Glass passivated
High maximum operating
temperature

DESCRIPTION

Cavity free cylindrical SOD91 glass package through Implotec
(1)
technology. This package is
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
k
Available in ammo-pack.
Fig.1 Simplified outline (SOD91) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RRM
repetitive peak reverse voltage
BYD71A 50 V BYD71B 100 V BYD71C 150 V BYD71D 200 V BYD71E 250 V BYD71F 300 V BYD71G 400 V
V
R
continuous reverse voltage
BYD71A 50 V BYD71B 100 V BYD71C 150 V BYD71D 200 V BYD71E 250 V BYD71F 300 V BYD71G 400 V
I
F(AV)
I
F(AV)
average forward current Ttp=55°C; lead length = 10 mm;
BYD71A to D 0.56 A BYD71E to G 0.54 A
average forward current T
BYD71A to D 0.43 A BYD71E to G 0.41 A
see Figs 2 and 3; averaged over any 20 ms period; see also Figs 10 and 11
=60°C; PCB mounting (see
amb
Fig.16); see Figs 4 and 5; averaged over any 20 ms period; see also Figs 10 and 11
hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
(1) Implotec is a trademark of Philips.
a
MAM196
1996 Sep 19 2 Not recommended for new designs
Philips Semiconductors Product specification
Ultra fast low-loss
BYD71 series
controlled avalanche rectifiers
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
FRM
I
FRM
I
FSM
P
RSM
T
stg
T
j
repetitive peak forward current Ttp=55°C; see Figs 6 and 7
BYD71A to D 4.7 A BYD71E to G 5.0 A
repetitive peak forward current T
=60°C; see Figs 8 and 9
amb
BYD71A to D 3.7 A BYD71E to G 3.9 A
non-repetitive peak forward current t = 10 ms half sine wave;
non-repetitive peak reverse power dissipation
Tj=T VR=V
t=20µs half sine wave; Tj=T prior to surge
prior to surge;
j max
RRMmax
j max
7A
BYD71A to D 250 W
BYD71E to G 150 W storage temperature 65 +175 °C junction temperature 65 +175 °C

ELECTRICAL CHARACTERISTICS

T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
forward voltage IF= 0.5 A; Tj=T
BYD71A to D −−0.84 V
see Figs 12 and 13
j max
;
BYD71E to G −−0.90 V
V
F
forward voltage IF= 0.5 A;
BYD71A to D −−1.05 V
see Figs 12 and 13
BYD71E to G −−1.11 V
V
(BR)R
reverse avalanche breakdown
IR= 0.1 mA
voltage
BYD71A 55 −−V
BYD71B 110 −−V
BYD71C 165 −−V
BYD71D 220 −−V
BYD71E 275 −−V
BYD71F 330 −−V
BYD71G 440 −−V
I
R
reverse current VR=V
RRMmax
;
−− 1µA
see Fig 14 V
R=VRRMmax
;
−−75 µA
Tj= 165 °C; see Fig 14
t
rr
reverse recovery time when switched from
BYD71A to D −−25 ns
BYD71E to G −−50 ns
IF= 0.5 A to IR=1A; measured at IR= 0.25 A see Fig 18
1996 Sep 19 3 Not recommended for new designs
Philips Semiconductors Product specification
Ultra fast low-loss
BYD71 series
controlled avalanche rectifiers
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
C
d
dI
R
-------­dt

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-tp
R
th j-a
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm, see Fig.16. For more information please refer to the
diode capacitance f = 1 MHz; VR=0V;
BYD71A to D 25 pF BYD71E to G 20 pF
maximum slope of reverse recovery current
BYD71A to D −− 4A/µs BYD71E to G −− 5A/µs
thermal resistance from junction to tie-point lead length = 10 mm 180 K/W thermal resistance from junction to ambient note 1 250 K/W
“General Part of associated Handbook”
see Fig.15
when switched from I
= 1 A to VR≥ 30 V
F
and dIF/dt = 1A/µs; see Fig.17
.
1996 Sep 19 4 Not recommended for new designs
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