Philips BYD43U, BYD43-18 Datasheet

DISCRETE SEMICONDUCTORS

DATA SH EET

, halfpage

M3D119

BYD43 series

Fast soft-recovery rectifiers

Product specification
Supersedes data of February 1995
File under Discrete Semiconductors, SC01

1996 Jun 05

Philips Semiconductors Product specification

Fast soft-recovery rectifiers BYD43 series

FEATURES

• Glass passivated

• High maximum operating

temperature

DESCRIPTION

Cavity free cylindrical glass package
through Implotec

(1)

technology.

This package is hermetically sealed

and fatigue free as coefficients of
expansion of all used parts are
matched.

(1) Implotec is a trademark of Philips.

• Low leakage current

• Excellent stability

• Available in ammo-pack.

handbook, 4 columns

ak

MAM123

Fig.1 Simplified outline (SOD81) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

RSM

non-repetitive peak reverse voltage

BYD43U − 1300 V
BYD43V − 1500 V
BYD43-16 − 1700 V
BYD43-18 − 1900 V
BYD43-20 − 2100 V

V

RRM

repetitive peak reverse voltage

BYD43U − 1200 V
BYD43V − 1400 V
BYD43-16 − 1600 V
BYD43-18 − 1800 V
BYD43-20 − 2000 V

I

F(AV)

I

F(AV)

I

FRM

average forward current Ttp=55°C; lead length = 10 mm;

BYD43U and V − 1.20 A
BYD43-16 to 20 − 0.68 A

average forward current T

BYD43U and V − 0.65 A
BYD43-16 to 20 − 0.30 A

see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11

=65°C; PCB mounting (see

amb

Fig.20); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11

repetitive peak forward current Ttp=55°C; see Figs 6 and 7

BYD43U and V − 11 A
BYD43-16 to 20 − 6A

I

FRM

repetitive peak forward current T

=65°C; see Figs 8 and 9

amb

BYD43U and V − 6.0 A
BYD43-16 to 20 − 3.2 A

1996 Jun 05 2

Philips Semiconductors Product specification

Fast soft-recovery rectifiers BYD43 series

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

I

FSM

T

stg

T

j

ELECTRICAL CHARACTERISTICS

T

=25°C unless otherwise specified.

j

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

F

V

F

I

R

I

R

t

rr

C

d

dI

R

-------­dt

non-repetitive peak forward current t = 10 ms half sinewave; Tj=T

BYD43U and V − 6A

prior to surge; VR=V

RRMmax

j max

BYD43-16 to 20 − 6A
storage temperature −65 +175 °C
junction temperature see Figs 12 and 13 −65 +175 °C

forward voltage IF= 1 A; Tj=T

BYD43U and V −−1.20 V

see Figs 14 and 15

j max

;

BYD43-16 to 20 −−2.05 V
forward voltage IF=1A;

BYD43U and V −−1.5 V

see Figs 14 and 15

BYD43-16 to 20 −−2.4 V
reverse current VR=V

BYD43U and V −− 1µA

see Figs 16 and 17

RRMmax

;

BYD43-16 to 20 −− 5µA
reverse current VR=V

RRMmax

BYD43U and V Tj= 165 °C; see Fig 16 −−100 µA

BYD43-16 to 20 T

= 125 °C; see Fig 17 −− 50 µA

j

reverse recovery time when switched from

BYD43U and V −−250 ns

BYD43-16 to 20 −−300 ns

IF= 0.5 A to IR=1A;
measured at IR= 0.25 A;
see Fig 22

diode capacitance f = 1 MHz; VR=0V;

BYD43U and V − 20 − pF

see Figs 18 and 19

BYD43-16 to 20 − 15 − pF
maximum slope of reverse recovery

current

BYD43U and V −− 5A/µs

BYD43-16 to 20 −− 5A/µs

when switched from

= 1 A to VR≥ 30 V

I

F

and dIF/dt = −1A/µs;
see Fig.21

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R
R

th j-tp
th j-a

thermal resistance from junction to tie-point lead length = 10 mm 60 K/W
thermal resistance from junction to ambient note 1 120 K/W

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.20.
For more information please refer to the

‘General Part of Handbook SC01’

.

1996 Jun 05 3

Philips Semiconductors Product specification

Fast soft-recovery rectifiers BYD43 series

GRAPHICAL DATA

1.6

handbook, halfpage

I

F(AV)

(A)

1.2

0.8

0.4

0

0 200

BYD43U andV

a =1.42; VR=V
Switched mode application.

RRMmax

lead length 10 mm

100

; δ= 0.5.

Ttp( C)

MLC311

o

Fig.2 Maximum permissible average forward

current as a function of tie-point temperature
(including losses due to reverse leakage).

0.8

handbook, halfpage

I

F(AV)

(A)

0.6

0.4

0.2

0

0 200

BYD43-16 to20

a =1.42; VR=V
Switched mode application.

RRMmax

lead length 10 mm

100

; δ= 0.5.

o

Ttp( C)

Fig.3 Maximum permissible average forward

current as a function of tie-point temperature
(including losses due to reverse leakage).

MLC315

amb

MLC312

o

1.0

handbook, halfpage

I

F(AV)

(A)

0.8

0.6

0.4

0.2

0

0 200

BYD43U andV

a =1.42; VR=V
Device mounted as shown in Fig.20.
Switched mode application.

RRMmax

; δ= 0.5.

100

T ( C)

Fig.4 Maximum permissible average forward

current as a function of ambient temperature
(including losses due to reverse leakage).

0.5

handbook, halfpage

I

F(AV)

(A)

0.4

0.3

0.2

0.1

0

0 200

BYD43-16 to20

a =1.42; VR=V
Device mounted as shown in Fig.20.
Switched mode application.

RRMmax

; δ= 0.5.

100

o

T ( C)

amb

Fig.5 Maximum permissible average forward

current as a function of ambient temperature
(including losses due to reverse leakage).

MLC316

1996 Jun 05 4