Philips BY614 Datasheet
DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D189
BY614
Miniature high-voltage
soft-recovery rectifier
Product specification
Supersedes data of May 1996
1996 Sep 26
Philips Semiconductors Product specification
Miniature high-voltage soft-recovery
BY614
rectifier
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
DESCRIPTION
Miniature glass package, using a high
temperature alloyed construction.
This package is hermetically sealed
and fatigue free as coefficients of
• Excellent stability
• Soft-recovery switching
characteristics
handbook, halfpage
k
• Very compact construction.
APPLICATIONS
• Miniature high-voltage assemblies
such as voltage multipliers.
The cathode lead is marked with a black band.
Fig.1 Simplified outline (SOD61H2) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RSM
V
RRM
V
RW
V
R
I
F(AV)
non-repetitive peak reverse voltage − 2200 V
repetitive peak reverse voltage − 2200 V
working reverse voltage − 2000 V
continuous reverse voltage − 2000 V
average forward current averaged over any 20 ms period;
PCB mounting (see Fig.5);
T
=65°C; see Fig.2;
amb
see also Fig.3
I
FRM
I
FSM
T
stg
T
j
repetitive peak forward current − 500 mA
non-repetitive peak forward current t ≤ 10 ms; half sinewave;
Tj=T
VR=V
prior to surge;
j max
RWmax
storage temperature −65 +150 °C
junction temperature −65 +150 °C
expansion of all used parts are
matched.
The package is designed to be used
in an insulating medium such as
resin, oil or SF6 gas.
a
MAM162
− 50 mA
− 1A
1996 Sep 26 2
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