Philips Semiconductors Product specification
Rectifier diodes BY229 series
fast, soft-recovery
FEATURES SYMBOL QUICK REFERENCE DATA
• Low forward volt drop VR = 200 V/ 400 V/ 600 V/800 V
• Fast switching
• Soft recovery characteristic I
• High thermal cycling performance
• Low thermal resistance I
k a
12
GENERAL DESCRIPTION PINNING SOD59 (TO220AC)
= 8 A
F(AV)
≤ 60 A
FSM
trr ≤ 135 ns
Glass-passivated double diffused PIN DESCRIPTION
rectifier diodes featuring low
tab
forward voltage drop, fast reverse 1 cathode
recovery and soft recovery
characteristic. The devices are 2 anode
intended for use in TV receivers,
monitorsandswitchedmodepower tab cathode
supplies.
1
The BY229 series is supplied in the
2
conventional leaded SOD59
(TO220AC) package.
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
BY229 -200 -400 -600 -800
V
RSM
V
RRM
V
RWM
V
R
I
F(AV)
I
F(RMS)
I
FRM
I
FSM
I2tI
T
stg
T
j
Peak non-repetitive reverse - 200 400 600 800 V
voltage
Peak repetitive reverse voltage - 200 400 600 800 V
Crest working reverse voltage - 150 300 500 600 V
Continuous reverse voltage - 150 300 500 600 V
Average forward current
1
square wave; - 8 A
δ = 0.5;
Tmb ≤ 122 ˚C
sinusoidal; - 7 A
a = 1.57;
Tmb ≤ 125 ˚C
RMS forward current - 11 A
Repetitive peak forward current t = 25 µs; δ = 0.5; - 16 A
Tmb ≤ 122 ˚C
Non-repetitive peak forward t = 10 ms - 60 A
current. t = 8.3 ms - 66 A
sinusoidal;
Tj = 150 ˚C prior to
surge; with
2
t for fusing t = 10 ms - 18 A2s
reapplied V
RWM(max)
Storage temperature -40 150 ˚C
Operating junction temperature - 150 ˚C
1 Neglecting switching and reverse current losses.
September 1998 1 Rev 1.200
Philips Semiconductors Product specification
Rectifier diodes BY229 series
fast, soft-recovery
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
R
th j-a
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
I
R
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
t
rr
Q
s
dIR/dt Maximum slope of the reverse IF = 2 A; -dIF/dt = 20 A/µs - 50 60 A/µs
Thermal resistance junction to - - 2.0 K/W
mounting base
Thermal resistance junction to in free air. - 60 - K/W
ambient
Forward voltage IF = 20 A - 1.5 1.85 V
Reverse current VR = V
; Tj = 125 ˚C - 0.1 0.4 mA
RWM
Reverse recovery time IF = 1 A; VR > 30 V; -dIF/dt = 50 A/µs - 100 135 ns
Reverse recovery charge IF = 2 A; VR > 30 V; -dIF/dt = 20 A/µs - 0.5 0.7 µC
recovery current
September 1998 2 Rev 1.200
Philips Semiconductors Product specification
Rectifier diodes BY229 series
fast, soft-recovery
I
F
dI
F
dt
trr
time
Qs
I
R
I
rrm
Fig.1. Definition of trr, Qs and I
PF / W
20
Vo = 1.25 V
Rs = 0.03 Ohms
15
10
5
0
0 2 4 6 8 10 12
0.1
BY329
0.5
0.2
I
IF(AV) / A
25%
Tmb(max) / C
D = 1.0
t
p
D =
T
rrm
Fig.2. Maximum forward dissipation, PF = f(I
square wave current waveform; parameter D = duty
cycle = tp/T
.
100%
110
120
130
t
p
T
140
t
150
);
F(AV)
IFS(RMS) / A
80
70
60
50
40
30
20
10
0
1ms 10ms 0.1s 1s 10s
IFSM
tp / s
BY229
Fig.4. Maximum non-repetitive rms forward current.
IF = f(tp); sinusoidal current waveform; Tj = 150˚C prior
to surge with reapplied V
IF / A
30
Tj = 150 C
Tj = 25 C
20
10
typ
0
0 1
0.5
VF / V
1.5
RWM
max
.
BY229F
2
Fig.5. Typical and maximum forward characteristic;
IF = f(VF); parameter T
j
PF / W
15
Vo = 1.25 V
Rs = 0.03 Ohms
10
5
0
0 2 4 6 8
BY329
2.8
4
IF(AV) / A
Fig.3. Maximum forward dissipation, PF = f(I
sinusoidal current waveform; parameter a = form
factor = I
F(RMS)/IF(AV)
2.2
Tmb(max) / C
a = 1.57
1.9
.
120
130
140
150
F(AV)
Qs / uC
10
Tj = 150 C
Tj = 25 C
2 A
1
0.1
1 100
);
Fig.6. Maximum Qs at Tj = 25˚C and 150˚C
10
-dIF/dt (A/us)
BY329
IF = 10 A
10 A
1 A
2 A
1 A
September 1998 3 Rev 1.200
Philips Semiconductors Product specification
Rectifier diodes BY229 series
fast, soft-recovery
trr / ns
1000
IF = 10 A
100
Tj = 150 C
Tj = 25 C
10
1 10 100
-dIF/dt (A/us)
Fig.7. Maximum trr measured to 25% of I
and 150˚C
Cd / pF
100
10
BY329
10A
1 A
1A
; Tj = 25˚C
rrm
BY329
Transient thermal impedance, Zth j-mb (K/W)
10
1
0.1
p
D =
t
T
t
BY229
p
t
0.01
0.001
1us 10us 100us 1ms 10ms 100ms 1s 10s
P
D
pulse width, tp (s)
T
Fig.9. Transient thermal impedance Zth = f(tp)
1
1 100
Fig.8. Typical junction capacitance Cd at f = 1 MHz
10 1000
VR / V
Tj = 25˚C
;
September 1998 4 Rev 1.200
Philips Semiconductors Product specification
Rectifier diodes BY229 series
fast, soft-recovery
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
3,0 max
not tinned
1,3
max
(2x)
10,3
max
3,7
12
5,08
2,8
3,0
13,5
min
0,9 max (2x)
4,5
max
1,3
5,9
min
15,8
max
0,6
2,4
Fig.10. SOD59 (TO220AC). pin 1 connected to mounting base.
Notes
1. Refer to mounting instructions for TO220 envelopes.
2. Epoxy meets UL94 V0 at 1/8".
September 1998 5 Rev 1.200
Philips Semiconductors Product specification
Rectifier diodes BY229 series
fast, soft-recovery
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
September 1998 6 Rev 1.200
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