Philips BUK9506-30 Datasheet

Philips Semiconductors Product specification
TrenchMOS transistor BUK9506-30 Logic level FET

GENERAL DESCRIPTION QUICK REFERENCE DATA

N-channel enhancement mode logic SYMBOL PARAMETER MAX. UNIT level field-effectpowertransistorina plastic envelope using trench’V technology.Thedevicefeatures very I low on-state resistance and has P integral zener diodes giving ESD T protectionupto 2kV. Itis intended for R
DS
D
tot j
DS(ON)
use in automotive and general resistance VGS = 5 V purpose switching applications.

PINNING - TO220AB PIN CONFIGURATION SYMBOL

PIN DESCRIPTION
tab
d
1 gate 2 drain 3 source
tab drain
123
g
s

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V V ±V I
D
I
D
I
DM
P T
DS DGR
tot
stg
GS
, T
j
Drain-source voltage - - 30 V Drain-gate voltage RGS = 20 k -30V Gate-source voltage - - 10 V Drain current (DC) Tmb = 25 ˚C - 75 A Drain current (DC) Tmb = 100 ˚C - 53 A Drain current (pulse peak value) Tmb = 25 ˚C - 240 A Total power dissipation Tmb = 25 ˚C - 187 W Storage & operating temperature - - 55 175 ˚C

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
th j-mb
Thermal resistance junction to - - 0.8 K/W mounting base
R
th j-a
Thermal resistance junction to in free air 60 - K/W ambient

ESD LIMITING VALUE

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
C
December 1997 1 Rev 1.100
Electrostatic discharge capacitor Human body model - 2 kV voltage, all pins (100 pF, 1.5 k)
Philips Semiconductors Product specification
TrenchMOS transistor BUK9506-30
Logic level FET

STATIC CHARACTERISTICS

Tj= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
V
GS(TO)
I
DSS
I
GSS
±V R
DS(ON)
(BR)GSS
Drain-source breakdown VGS = 0 V; ID = 0.25 mA; 30 - - V voltage Tj = -55˚C 27 - - V Gate threshold voltage VDS = VGS; ID = 1 mA 1.0 1.5 2.0 V
Tj = 175˚C 0.5 - - V
Tj = -55˚C - - 2.3 V
Zero gate voltage drain current VDS = 30 V; VGS = 0 V; - 0.05 10 µA
Tj = 175˚C - - 500 µA
Gate source leakage current VGS = ±5 V; VDS = 0 V - 0.02 1 µA
Tj = 175˚C - - 10 µA Gate-source breakdown IG = ±1 mA; 10 - - V voltage Drain-source on-state VGS = 5 V; ID = 25 A - 5 6 m resistance Tj = 175˚C - - 11 m

DYNAMIC CHARACTERISTICS

Tmb = 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
g Q
Q Q
C C C
t t t t
L L L
fs
g(tot) gs gd
iss oss rss
d on r d off f
d
d
s
Forward transconductance VDS = 25 V; ID = 25 A 20 40 - S Total gate charge ID = 75 A; V
= 24 V; VGS = 5 V - 92 - nC
DD
Gate-source charge - 10 - nC Gate-drain (Miller) charge - 36 - nC
Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 5000 - pF Output capacitance - 1150 - pF Feedback capacitance - 500 - pF
Turn-on delay time VDD = 15 V; ID = 25 A; - 45 60 ns Turn-on rise time VGS = 5 V; RG = 5 - 120 170 ns Turn-off delay time Resistive load - 225 300 ns Turn-off fall time - 100 135 ns
Internal drain inductance Measured from contact screw on - 3.5 - nH
tab to centre of die
Internal drain inductance Measured from drain lead 6 mm - 4.5 - nH
from package to centre of die
Internal source inductance Measured from source lead 6 mm - 7.5 - nH
from package to source bond pad
December 1997 2 Rev 1.100
Philips Semiconductors Product specification
TrenchMOS transistor BUK9506-30
Logic level FET

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS

Tj = 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
DR
I
DRM
V
SD
t
rr
Q
rr

AVALANCHE LIMITING VALUE

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
W
DSS
Continuous reverse drain - - 75 A current Pulsed reverse drain current - - 240 A Diode forward voltage IF = 25 A; VGS = 0 V - 0.85 1.2 V
IF = 75 A; VGS = 0 V - 1.0 - V
Reverse recovery time IF = 75 A; -dIF/dt = 100 A/µs; - 100 - ns Reverse recovery charge VGS = -10 V; VR = 25 V - 0.6 - µC
Drain-source non-repetitive ID = 75 A; VDD 15 V; - - 500 mJ unclamped inductive turn-off VGS = 5 V; RGS = 50 ; Tmb = 25 ˚C energy
December 1997 3 Rev 1.100
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