Philips Semiconductors Product specification
Insulated Gate Bipolar Transistor BUK856-400 IZ
Protected Logic-Level IGBT
GENERAL DESCRIPTION QUICK REFERENCE DATA
Protected N-channel logic-level SYMBOL PARAMETER MIN. TYP. MAX. UNIT
insulated gate bipolar power
transistor in a plastic envelope, V
intended for automotive ignition V
applications. The device has I
built-in zener diodes providing P
active collector voltage clamping E
(CL)CER
CEsat
C
tot
CERS
and ESD protection up to 2 kV.
PINNING - TO220AB PIN CONFIGURATION SYMBOL
Collector-emitter clamp voltage 350 400 500 V
Collector-emitter on-state voltage 2.2 V
Collector current (DC) 20 A
Total power dissipation 100 W
Clamped energy dissipation 300 mJ
PIN DESCRIPTION
tab
c
1 gate
2 collector
3 emitter
tab collector
123
g
e
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
V
±V
I
C
I
C
I
CM
I
CLM
E
E
E
P
T
T
CE
CE
GE
CERS
CERR
ECR
tot
stg
j
1
1
Collecter-emitter voltage tp ≤ 500 µs - 500 V
Collector-emitter voltage Continuous -20 50 V
Gate-emitter voltage - - 12 V
Collector current (DC) Tmb = 100 ˚C - 10 A
Collector current (DC) Tmb = 25 ˚C - 20 A
Collector current (pulsed peak value, Tmb = 25 ˚C; tp ≤ 10 ms; - 25 A
on-state) VCE ≤ 15 V
Collector current (clamped inductive 1 kΩ ≤ RG ≤ 10 kΩ -10A
load)
Clamped turn-off energy Tmb = 25 ˚C; IC = 10 A; RG = 1 kΩ; - 300 mJ
(non-repetitive) see Figs. 23,24
Clamped turn-off energy (repetitive) Tmb = 100 ˚C; IC = 8 A; RG = 1 kΩ; - 125 mJ
f = 50 Hz
Reverse avalanche energy IE = 1 A; f = 50 Hz - 5 mJ
(repetitive)
Total power dissipation Tmb = 25 ˚C - 125 W
Storage temperature - -55 150 ˚C
Operating Junction Temperature - -40 150 ˚C
ESD LIMITING VALUE
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
C
1 This applies to short-term operation in ignition circuits with open-secondary ignition coil.
December 1996 1 Rev. 1.200
Electrostatic discharge capacitor Human body model - 2 kV
voltage (100 pF, 1.5 kΩ)
Philips Semiconductors Product specification
Insulated Gate Bipolar Transistor BUK856-400 IZ
Protected Logic-Level IGBT
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
R
th j-mb
th j-a
Junction to mounting base - 1.0 K/W
Junction to ambient In free air 60 - K/W
STATIC CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CG
V
(BR)EC
±V
V
GE(TO)
V
GE(TO)
I
CES
I
CES
I
EC
I
EC
I
GES
V
CEsat
(BR)GES
Collector-gate zener 2 mA ≤ -IG ≤ 5 mA; -40 ≤ Tj ≤150˚C 350 400 500 V
breakdown voltage
Reverse collector-emitter IE = 10 mA 20 30 50 V
breakdown voltage
Gate-emitter breakdown IG = ± 1 mA 12 16 20 V
voltage
Gate threshold voltage VCE = VGE; IC = 1 mA 1 1.5 2 V
Gate threshold voltage VCE = VGE; IC = 1 mA; 0.6 - 2.4 V
-40 ≤ Tj ≤150˚C
Zero gate voltage collector VCE = 50 V; VGE = 0 V; Tj = 25 ˚C - 0.01 10 µA
current
Zero gate voltage collector Tj = 125 ˚C - 0.01 1 mA
current
Reverse collector current VCE = -20 V - 0.2 5 mA
Reverse collector current VCE = -20 V; Tj = 125˚C - 2 20 mA
Gate emitter leakage current VGE = ±6 V - 0.1 1 µA
Tj = 150˚C - 5 100 µA
Collector-emitter on-state VGE = 4.5 V; IC = 8 A - 1.2 2.2 V
voltage VGE = 3.5 V; IC = 6 A; - 1.2 2.2 V
-40 ≤ Tj ≤150˚C
DYNAMIC CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(CL)CER
g
fe
C
ies
C
oes
C
res
t
d off
t
f
t
c
E
off
December 1996 2 Rev. 1.200
Collector-emitter clamp voltage RG = 1 kΩ; IC = 10 A; 350 400 500 V
(peak value) -40 ≤ Tj ≤150˚C; Inductive load; see
Figs. 23,24
Forward transconductance VCE = 15 V; IC = 4 A 5.5 15 20 S
Input capacitance VGE = 0 V; VCE = 25 V; f = 1 MHz - 940 1200 pF
Output capacitance - 95 130 pF
Feedback capacitance - 30 50 pF
Turn-off delay time IC = 8 A; VCL = 300 V; RG = 1 kΩ; - 13 18 µs
Fall time VGE = 5 V; Tj = 125˚C; - 6 10 µs
Crossover Time Inductive load; see Figs. 20,21 - 12 - µs
Turn-off Energy loss - 13 - mJ
Philips Semiconductors Product specification
Insulated Gate Bipolar Transistor BUK856-400 IZ
Protected Logic-Level IGBT
Zth(j-mb) / (K/W)
1E+01
1E+00
1E-01
1E-02
1E-03
D=
0.5
0.2
0.1
0.05
0.02
t
P
D
0
1E-07 1E-05 1E-03 1E-01 1E+01
t / s
D =
p
T
Fig.1. Transient thermal impedance
Z
= f(t) ; parameter D = tp/T
th j-mb
IC / A
10
Self-clamped
1
I
CLM
BUK8Y6-400IZ
PD%
120
110
100
90
80
70
60
50
t
p
T
t
40
30
20
10
0
0 20 40 60 80 100 120 140
Normalised Power Derating
Tmb / C
Fig.4. Normalised power dissipation.
PD% = 100.PD/P
ICLM / A BUK8Y6-400IZ
15
10
5
D 25˚C
= f(Tmb)
0.1
0 200 400 600
VCE / V
Fig.2. Turn-off Safe Operating Area
conditions: Tj ≤ T
VCE / V
3
2
1
0
0 4 8 12 16 20 24
Tj / C =
150
-40
25
jmax.
IC / A
; RG ≥ 1
PMG35A
Fig.3. Typical On-state Voltage
V
= f(IC); parameter Tj; conditions: VGE = 3.5 V
CEsat
kΩ
0
0 50 100 150 200
Fig.5. Derating of I
conditions: VCE ≤ 500 V; Tj ≤ T
VCE / V
2
Tj / C =
1.5
1
0.5
0
0 4 8 12 16 20 24
150
-40
25
dVCE/dt (V/us)
with turn-off dVCE/dt
CLM
IC / A
Fig.6. Typical On-state Voltage
V
= f(IC); parameter Tj; conditions: VGE = 5 V
CEsat
jmax.
PMG35A
December 1996 3 Rev. 1.200