Philips BUK555-200B, BUK555-200A Datasheet

Philips Semiconductors Product Specification

PowerMOS transistor BUK555-200A/B
Logic level FET

GENERAL DESCRIPTION QUICK REFERENCE DATA

N-channel enhancement mode SYMBOL PARAMETER MAX. MAX. UNIT
logic level field-effect power
transistor in a plastic envelope. BUK555 -200A -200B
The device is intended for use in V
Switched Mode Power Supplies I
(SMPS), motor control, welding, P
DC/DC and AC/DC converters, and T
in automotive and general purpose R
switching applications. resistance; V

DS

D

tot
j

DS(ON)

PINNING - TO220AB PIN CONFIGURATION SYMBOL

Drain-source voltage 200 200 V
Drain current (DC) 14 13 A
Total power dissipation 125 125 W
Junction temperature 175 175 ˚C
Drain-source on-state 0.23 0.28 Ω

5 V

GS =

PIN DESCRIPTION

tab

d

1 gate
2 drain
3 source

tab drain

123

g

s

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
V

±V
±V

I

D

I

D

I

DM

P
T
T

DS
DGR

GS
GSM

tot
stg
j

Drain-source voltage - - 200 V
Drain-gate voltage RGS = 20 kΩ - 200 V
Gate-source voltage - - 15 V
Non-repetitive gate-source voltage tp ≤ 50 µs - 20 V

-200A -200B

Drain current (DC) Tmb = 25 ˚C - 14 13 A
Drain current (DC) Tmb = 100 ˚C - 10 9.2 A
Drain current (pulse peak value) Tmb = 25 ˚C - 56 52 A

Total power dissipation Tmb = 25 ˚C - 125 W
Storage temperature - - 55 175 ˚C
Junction Temperature - - 175 ˚C

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

R

th j-mb

R

th j-a

April 1993 1 Rev 1.100

Thermal resistance junction to - - 1.2 K/W
mounting base
Thermal resistance junction to - 60 - K/W
ambient

Philips Semiconductors Product Specification

PowerMOS transistor BUK555-200A/B
Logic level FET

STATIC CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

(BR)DSS

V

GS(TO)

I

DSS

I

DSS

I

GSS

R

DS(ON)

DYNAMIC CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

g

fs

C

iss

C

oss

C

rss

t

d on

t

r

t

d off

t

f

L

d

L

d

L

s

Drain-source breakdown VGS = 0 V; ID = 0.25 mA 200 - - V
voltage
Gate threshold voltage VDS = VGS; ID = 1 mA 1.0 1.5 2.0 V
Zero gate voltage drain current VDS = 200 V; VGS = 0 V; Tj = 25 ˚C - 1 10 µA
Zero gate voltage drain current VDS = 200 V; VGS = 0 V; Tj =125 ˚C - 0.1 1.0 mA
Gate source leakage current VGS = ±10 V; VDS = 0 V - 10 100 nA
Drain-source on-state VGS = 5 V; BUK555-200A - 0.2 0.23 Ω
resistance ID = 7 A BUK555-200B - 0.24 0.28 Ω

Forward transconductance VDS = 25 V; ID = 7 A 8.0 15 - S
Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 1600 2000 pF

Output capacitance - 180 250 pF
Feedback capacitance - 55 80 pF

Turn-on delay time VDD = 30 V; ID = 3 A; - 25 40 ns
Turn-on rise time VGS = 5 V; RGS = 50 Ω; - 45 75 ns
Turn-off delay time R
Turn-off fall time - 40 55 ns

= 50 Ω - 140 180 ns

gen

Internal drain inductance Measured from contact screw on - 3.5 - nH

tab to centre of die

Internal drain inductance Measured from drain lead 6 mm - 4.5 - nH

from package to centre of die

Internal source inductance Measured from source lead 6 mm - 7.5 - nH

from package to source bond pad

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

DR

I

DRM

V
t

rr

Q

SD

rr

Continuous reverse drain - - - 14 A
current
Pulsed reverse drain current - - - 56 A
Diode forward voltage IF = 14 A ; VGS = 0 V - 1.0 1.5 V

Reverse recovery time IF = 14 A; -dIF/dt = 100 A/µs; - 200 - ns
Reverse recovery charge VGS = 0 V; VR = 30 V - 0.25 - µC

AVALANCHE LIMITING VALUE

Tmb = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

W

DSS

April 1993 2 Rev 1.100

Drain-source non-repetitive ID = 14 A ; VDD ≤ 100 V ; - - 100 mJ
unclamped inductive turn-off VGS = 5 V ; RGS = 50 Ω
energy

Philips Semiconductors Product Specification

PowerMOS transistor BUK555-200A/B
Logic level FET

PD%

120
110
100

90
80
70
60
50
40
30
20
10

0

0 20 40 60 80 100 120 140 160 180

Normalised Power Derating

Tmb / C

Fig.1. Normalised power dissipation.

PD% = 100⋅PD/P

ID%

120
110
100

90
80
70
60
50
40
30
20
10

0

0 20 40 60 80 100 120 140 160 180

Tmb / C

= f(Tmb)

D 25 ˚C

Normalised Current Derating

Fig.2. Normalised continuous drain current.

ID% = 100⋅ID/I

= f(Tmb); conditions: VGS ≥ 5 V

D 25 ˚C

Zth j-mb / (K/W)

10

D =

1

0.5

0.2

0.1

0.1

0.05

0.02

0.01

0.001

0

1E-07 1E-05 1E-03 1E-01 1E+01

t / s

P

D

BUKx55-lv

p

p

t

t

D =

T

t

T

Fig.4. Transient thermal impedance.

Z

= f(t); parameter D = tp/T

th j-mb

ID / A

30

5

20

10

0

0 2 4 6 8 10 12 14 16 18 20

10

VDS / V

BUK555-200A

VGS / V =

4

3

Fig.5. Typical output characteristics, Tj = 25 ˚C

ID = f(VDS); parameter V

GS

.

ID / A

100

10

1

0.1

RDS(ON) = VDS/ID

1 10 100 1000

A
B

DC

VDS / V

Fig.3. Safe operating area. Tmb = 25 ˚C

ID & IDM = f(VDS); IDM single pulse; parameter t

BUK555-200A,B

tp = 10 us

100 us

1 ms
10 ms

100 ms

RDS(ON) / Ohm

1.0

0.8

0.6

0.4

0.2

0

0 4 8 12 16 20 24 28

2.5 3

ID / A

Fig.6. Typical on-state resistance, Tj = 25 ˚C

R

p

= f(ID); parameter V

DS(ON)

BUK555-200A

3.5

VGS / V =

4

5

10

.

GS

April 1993 3 Rev 1.100