Philips buk465 60a DATASHEETS

Philips Semiconductors Product specification
PowerMOS transistor BUK465-60A

GENERAL DESCRIPTION QUICK REFERENCE DATA

N-channel enhancement mode SYMBOL PARAMETER MAX. UNIT field-effect power transistor in a plastic envelope suitable for surface mount V applications. I The device is intended for use in P Switched Mode Power Supplies T (SMPS), motor control, welding, R
DS
D
tot j
DS(ON)
DC/DC and AC/DC converters, and in resistance 0.038 automotive and general purpose switching applications.

PINNING - SOT404 PIN CONFIGURATION SYMBOL

Drain-source voltage -60A Drain current (DC) 60 V Total power dissipation 41 A Junction temperature 125 W Drain-source on-state 175 ˚C
PIN DESCRIPTION
mb
d
1 gate 2 drain 3 source
mb drain
2
13
g
s

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
DS
V
DGR
Drain-source voltage - - 60 V
Drain-gate voltage RGS = 20 kΩ -60V ±VGSGate-source voltage - - 30 V I
D
I
D
I
DM
P
tot
T
stg
T
j
Drain current (DC) Tmb = 25 ˚C - 41 A
Drain current (DC) Tmb = 100 ˚C - 29 A
Drain current (pulse peak value) Tmb = 25 ˚C - 164 A
Total power dissipation Tmb = 25 ˚C - 125 W
Storage temperature - - 55 175 ˚C
Junction temperature - - 175 ˚C

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R R
th j-mb
th j-a
Thermal resistance junction to - - 1.2 K/W mounting base Thermal resistance junction to minimum footprint, - 50 - K/W ambient FR4 boards (see Fig 18).
February 1996 1 Rev 1.000
Philips Semiconductors Product specification
PowerMOS transistor BUK465-60A

STATIC CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
V
GS(TO)
I
DSS
I
DSS
I
GSS
R
DS(ON)

DYNAMIC CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
g
fs
C
iss
C
oss
C
rss
t
d on
t
r
t
d off
t
f
L
d
L
s
Drain-source breakdown VGS = 0 V; ID = 0.25 mA 60 - - V voltage Gate threshold voltage VDS = VGS; ID = 1 mA 2.1 3.0 4.0 V Zero gate voltage drain current VDS = 60 V; VGS = 0 V; Tj = 25 ˚C - 1 10 µA Zero gate voltage drain current VDS = 60 V; VGS = 0 V; Tj =125 ˚C - 0.1 1.0 mA Gate source leakage current VGS = ±30 V; VDS = 0 V - 10 100 nA Drain-source on-state VGS = 10 V; ID = 20 A - 0.03 0.038 resistance
Forward transconductance VDS = 25 V; ID = 20 A 8 13.5 - S Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 1650 2000 pF
Output capacitance - 560 750 pF Feedback capacitance - 300 400 pF
Turn-on delay time VDD = 30 V; ID = 3 A; - 25 40 ns Turn-on rise time VGS = 10 V; RGS = 50 ; - 60 90 ns Turn-off delay time R Turn-off fall time - 100 130 ns
= 50 - 125 160 ns
gen
Internal drain inductance Measured from upper edge of drain - 2.5 - nH
tab to centre of die
Internal source inductance Measured from source lead - 7.5 - nH
soldering point to source bond pad

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
DR
I
DRM
V t
rr
Q
SD
rr
Continuous reverse drain - - - 41 A current Pulsed reverse drain current - - - 164 A Diode forward voltage IF = 41 A ; VGS = 0 V - 1.4 2.0 V
Reverse recovery time IF = 41 A; -dIF/dt = 100 A/µs; - 60 - ns Reverse recovery charge VGS = 0 V; VR = 30 V - 0.30 - µC

AVALANCHE LIMITING VALUE

Tmb = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
W
DSS
Drain-source non-repetitive ID = 41 A ; VDD 25 V ; - - 100 mJ unclamped inductive turn-off VGS = 10 V ; RGS = 50 energy
February 1996 2 Rev 1.000
Philips Semiconductors Product specification
PowerMOS transistor BUK465-60A
PD%
120 110 100
90 80 70 60 50 40 30 20 10
0
0 20 40 60 80 100 120 140 160 180
Normalised Power Derating
Tmb / C
Fig.1. Normalised power dissipation.
PD% = 100⋅PD/P
ID%
120 110 100
90 80 70 60 50 40 30 20 10
0
0 20 40 60 80 100 120 140 160 180
Tmb / C
= f(Tmb)
D 25 ˚C
Normalised Current Derating
Fig.2. Normalised continuous drain current.
ID% = 100⋅ID/I
= f(Tmb); conditions: VGS ≥ 10 V
D 25 ˚C
Zth j-mb / (K/W)
10
D =
1
0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.001
0
1E-07 1E-05 1E-03 1E-01 1E+01
t / s
P
D
BUKx55-lv
p
p
t
t
D =
T
t
T
Fig.4. Transient thermal impedance.
Z
= f(t); parameter D = tp/T
th j-mb
ID / A
80 70 60 50 40 30 20 10
20
15
0
0 2 4 6 8 10
10
VDS / V
BUK455-50A
VGS / V =
8
7
6
5 4
Fig.5. Typical output characteristics, Tj = 25 ˚C
ID = f(VDS); parameter V
GS
.
ID / A
1000
A
100
RDS(ON) = VDS/ID
10
1
1 100
DC
10
VDS / V
Fig.3. Safe operating area. Tmb = 25 ˚C
ID & IDM = f(VDS); IDM single pulse; parameter t
BUK455-60
tp = 10 us
100 us
1 ms
10 ms 100 ms
RDS(ON) / Ohm
0.20
0.15
0.10
0.05
0
5 5.5 6 6.5
4.5
0 20 40 60 80
ID / A
Fig.6. Typical on-state resistance, Tj = 25 ˚C
R
p
= f(ID); parameter V
DS(ON)
7
7.5
VGS / V =
BUK455-50A
8
10
20
.
GS
February 1996 3 Rev 1.000
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