Philips BUK113-50DL Datasheet

Philips Semiconductors Objective specification
PowerMOS transistor BUK113-50DL Logic level TOPFET
DESCRIPTION QUICK REFERENCE DATA
Monolithic overload protected logic SYMBOL PARAMETER MIN. MAX. UNIT level power MOSFET in a surface mount plastic envelope, intended as V a general purpose switch for automotive systems and other I applications.
DS
D
P
D
APPLICATIONS
T
General controller for driving
lamps R
j
DS(ON)
small motors solenoids
FEATURES FUNCTIONAL BLOCK DIAGRAM
Vertical power DMOS output stage Overload protected up to 125˚C ambient Overload protection by current limiting and overtemperature sensing Latched overload protection reset by input 5 V logic compatible input level Control of power MOSFET and supply of overload protection circuits derived from input Low operating input current permits direct drive by micro-controller ESD protection on all pins Overvoltage clamping for turn off of inductive loads
INPUT
Continuous junction temperature - 150 ˚C Drain-source on-state resistance - 200 m
DRAIN
O/V
CLAMP
RIG
LOGIC AND
PROTECTION
POWER MOSFET
SOURCE
Fig.1. Elements of the TOPFET.
PINNING - SOT223 PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
1 input 2 drain 3 source 4 drain (tab)
1
January 1996 1 Rev 1.000
4
23
TOPFET
I
D
P
S
Philips Semiconductors Objective specification
PowerMOS transistor BUK113-50DL Logic level TOPFET
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V I I I P T T
DS D I IRM
D
stg
j
Continuous drain source voltage Continuous drain current
2
Continuous input current clamping - 3 mA Non-repetitive peak input current tp 1 ms - 10 mA Total power dissipation Tsp = 90 ˚C - 4 W Storage temperature - -55 150 ˚C Continuous junction temperature normal operation - 150 ˚C
ESD LIMITING VALUE
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
1
- - 50 V
- - self limiting A
V
C
Electrostatic discharge capacitor Human body model; - 2 kV voltage C = 250 pF; R = 1.5 k
OVERVOLTAGE CLAMPING LIMITING VALUES
At a drain source voltage above 50 V the power MOSFET is actively turned on to clamp overvoltage transients.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
E
DSM
Non-repetitive clamping energy Tb 25 ˚C; IDM < I
; - 100 mJ
D(lim)
inductive load
E
DRM
Repetitive clamping energy Tb 75 ˚C; IDM = 50 mA; - 4 mJ
f = 250 Hz
OVERLOAD PROTECTION LIMITING VALUES
With the protection supply provided via the input pin, TOPFET can protect itself from short circuit loads. Overload protection operates by means of drain current limiting and activating the overtemperature protection.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
ISP
V
DDP
Protection supply voltage Protected drain source supply voltage VIS = 5 V - 35 V
3
for valid protection 4 - V
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Thermal resistance
R
th j-sp
Junction to solder point measured to pin 4 solder point - 12 15 K/W
Application information
R
th j-a
Junction to ambient on PCB of fig. 3 - 70 - K/W
on minimum footprint PCB - 100 - K/W
1 Prior to the onset of overvoltage clamping. For voltages above this value, safe operation is limited by the overvoltage clamping energy. 2 Refer to OVERLOAD PROTECTION CHARACTERISTICS. 3 The input voltage for which the overload protection circuits are functional.
January 1996 2 Rev 1.000
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