Philips Semiconductors Product specification
Silicon Diffused Power Transistor BUJ106AX
GENERAL DESCRIPTION
High-voltage, high-speed planar-passivated npn power switching transistor in a plastic full-pack envelope intended
for use in high frequency electronic lighting ballast applications, converters, inverters, switching regulators, motor
control systems, etc.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
V
CESM
V
CBO
V
CEO
I
C
I
CM
P
tot
V
CEsat
h
FEsat
t
f
PINNING - SOT186A PIN CONFIGURATION SYMBOL
Collector-emitter voltage peak value VBE = 0 V - 700 V
Collector-Base voltage (open emitter) - 700 V
Collector-emitter voltage (open base) - 400 V
Collector current (DC) - 10 A
Collector current peak value - 20 A
Total power dissipation Ths ≤ 25 ˚C - 26 W
Collector-emitter saturation voltage IC = 6.0 A;IB = 1.2 A 0.4 1.0 V
IC = 6.0 A; VCE = 5 V 10 15
Fall time IC = 5.0 A; IB1 = 1A 20 50 ns
PIN DESCRIPTION
case
c
1 base
2 collector
b
3 emitter
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
V
V
I
C
I
CM
I
B
I
BM
P
T
T
CESM
CEO
CBO
tot
stg
j
Collector to emitter voltage VBE = 0 V - 700 V
Collector to emitter voltage (open base) - 400 V
Collector to base voltage (open emitter) - 700 V
Collector current (DC) - 10 A
Collector current peak value - 20 A
Base current (DC) - 5 A
Base current peak value - 10 A
Total power dissipation Ths ≤ 25 ˚C - 26 W
Storage temperature -65 150 ˚C
Junction temperature - 150 ˚C
THERMAL RESISTANCES
123
e
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
thj-hs
R
th j-a
Junction to heatsink With heatsink compound - 4.8 K/W
Junction to ambient in free air 60 - K/W
March 1999 1 Rev 2.000
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BUJ106AX
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
isol
C
isol
STATIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CES,ICBO
I
CES
I
CEO
I
EBO
V
CEOsust
V
CEsat
V
BEsat
h
FE
h
FE
h
FEsat
R.M.S. isolation voltage from all f = 50-60 Hz; sinusoidal - 2500 V
three terminals to external waveform;
heatsink R.H. ≤ 65% ; clean and dustfree
Capacitance from T2 to external f = 1 MHz - 10 - pF
heatsink
Collector cut-off current
Collector cut-off current V
Emitter cut-off current VEB = 9 V; IC = 0 A - - 1 mA
1
VBE = 0 V; VCE = V
VBE = 0 V; VCE = V
Tj = 125 ˚C
CEO
= V
(400V) - - 0.1 mA
CEOMmax
CESMmax
; - - 0.5 mA
CESMmax
- - 0.2 mA
Collector-emitter sustaining voltage IB = 0 A; IC = 10 mA; 400 - - V
L = 25 mH
Collector-emitter saturation voltage IC = 6.0 A;IB = 1.2 A - 0.4 1.0 V
Base-emitter saturation voltage IC = 6.0 A;IB = 1.2 A - 1.0 1.5 V
DC current gain IC = 5 mA; VCE = 5 V 10 17 32
IC = 500 mA; VCE = 5 V 14 21 33
IC = 6.0 A; VCE = 5 V 8 11 15
DYNAMIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
Switching times (resistive load) I
t
on
t
s
t
f
Turn-on time 0.56 0.75 µs
Turn-off storage time 2.2 3.3 µs
Turn-off fall time 260 350 ns
Switching times (inductive load) I
t
s
t
f
Turn-off storage time 1.35 1.6 µs
Turn-off fall time 20 50 ns
Switching times (inductive load) I
t
s
t
f
Turn-off storage time - 3.2 µs
Turn-off fall time - 100 ns
= 5 A; I
Con
RL = 75 ohms; V
= 5 A; I
Con
-VBB = 5 V
= 5 A; I
Con
-VBB = 5 V; Tj = 100 ˚C
= -I
Bon
Bon
Bon
= 1 A;
Boff
= 4 V;
BB2
= 1 A; LB = 1 µH;
= 1 A; LB = 1 µH;
1 Measured with half sine-wave voltage (curve tracer).
March 1999 2 Rev 2.000
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BUJ106AX
ICon
90 %
10 %
tf
IBon
30-60 Hz
6V
300R
Fig.1. Test circuit for V
100-200R
Horizontal
Oscilloscope
Vertical
1R
.
CEOsust
+ 50v
Fig.
90 %
IC
ton
IB
10 %
tr 30ns
-IBoff
4.
Switching times waveforms with resistive load.
ts
toff
IC / mA
250
100
10
0
VCE / V
Fig.2. Oscilloscope display for V
VIM
0
tp
T
R
B
min
VCEOsust
VCC
R
L
T.U.T.
CEOsust
VCC
LC
IBon
-VBB
.
Fig.
5.
LB
T.U.T.
Test circuit inductive load.
VCC = 300 V; -VBE = 5 V; LC = 200 uH; LB = 1 uH
ICon
90 %
IC
10 %
ts
toff
IB
IBon
tf
t
t
-IBoff
Fig
.3.
Test circuit resistive load. VIM = -6 to +8 V
Fig.
6.
Switching times waveforms with inductive load.
VCC = 250 V; tp = 20 µs; δ = tp / T = 0.01.
RB and RL calculated from I
Con
and I
requirements.
Bon
March 1999 3 Rev 2.000