Philips BU505F, BU505DF Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BU505F; BU505DF
Silicon diffused power transistors
Product specification Supersedes data of December 1991 File under Discrete Semiconductors, SC06
1997 Aug 13
Philips Semiconductors Product specification
Silicon diffused power transistors BU505F; BU505DF

DESCRIPTION

High-voltage, high-speed, glass-passivated NPN power transistor in a SOT186 package with electrically isolated mounting base. The BU505DF has an integrated efficiency diode.
2
2

APPLICATIONS

Horizontal deflection circuits of colour television receivers.

PINNING

123
1
MBB008
3
a. BU505F. b. BU505DF.
1
MBB077
3
PIN DESCRIPTION
1 base
Front view
MBC668
2 collector 3 emitter
mb mounting base; electrically
Fig.1 Simplified outline (SOT186) and symbols.
isolated from all pins

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
V
CESM
V
CEO
V
CEsat
collector-emitter peak voltage VBE=0 1500 V collector-emitter voltage open base 700 V collector-emitter saturation
IC= 2 A; IB= 900 mA; see Fig.8 1V
voltage
V
F
diode forward voltage
IF=2A 1.8 V
(BU505DF)
I
Csat
I
C
I
CM
P
tot
t
f
collector saturation current 2A collector current (DC) see Figs 4 and 5 2.5 A collector current (peak value) see Figs 4 and 5 4A total power dissipation Th≤ 25 °C; see Fig.2 20 W fall time inductive load; see Fig.10 0.7 −µs

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-h
thermal resistance from junction to external heatsink note 1 6.35 K/W
note 2 3.85 K/W
R
th j-a
thermal resistance from junction to ambient 55 K/W
Notes
1. Mounted without heatsink compound and 30 ±5 N force on centre of package.
2. Mounted with heatsink compound and 30 ±5 N force on centre of package.
Philips Semiconductors Product specification
Silicon diffused power transistors BU505F; BU505DF

ISOLATION CHARACTERISTICS

SYMBOL PARAMETER TYP. MAX. UNIT
V
isolM
C
isol

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CESM
V
CEO
I
Csat
I
C
I
CM
I
B
I
BM
P
tot
T
stg
T
j
isolation voltage from all terminals to external heatsink (peak value) 1500 V isolation capacitance from collector to external heatsink 12 pF
collector-emitter peak voltage VBE=0 1500 V collector-emitter voltage open base 700 V collector saturation current 2A collector current (DC) see Figs 4 and 5 2.5 A collector current (peak value) see Figs 4 and 5 4A base current (DC) 2A base current (peak value) 4A total power dissipation Th≤ 25 °C; see Fig.2 20 W storage temperature 65 +150 °C junction temperature 150 °C
120
handbook, halfpage
P
tot max
(%)
80
40
0
050
100 150
Fig.2 Power derating curve.
MGK674
o
T
(
C)
h
2
10
handbook, halfpage
h
FE
10
1
2
10
Tj=25°C. (1) VCE=5V. (2) VCE=1V.
Fig.3 DC current gain; typical values.
MGB875
(1)
(2)
1
10
1
IC (A)
10
Philips Semiconductors Product specification
Silicon diffused power transistors BU505F; BU505DF

CHARACTERISTICS

T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CEOsust
V
CEsat
V
BEsat
V
F
I
CES
I
EBO
h
FE
f
T
C
c
collector-emitter sustaining voltage IC= 0.1 A; IB= 0; L = 25 mH;
see Figs 6 and 7
collector-emitter saturation voltage IC= 2 A; IB= 900 mA;
see Fig.8
base-emitter saturation voltage IC= 2 A; IB= 900 mA;
see Fig.9 diode forward voltage (BU505DF) IF=2A −−1.8 V collector-emitter cut-off current VCE=V
CESmax
; VBE=0;
note 1
V
CE=VCESmax
; VBE=0;
Tj= 125 °C; note 1 emitter-base cut-off current VEB=5V; IC=0 −−1mA DC current gain see Fig.3
V
= 5 V; IC= 2 A 2.22 −−
CE
= 5 V; IC= 100 mA 6 13 30
V
CE
transition frequency VCE=5V; IC= 100 mA;
f = 1 MHz collector capacitance VCB=10V; IE=ie=0;
f = 1 MHz
700 −−V
−−1V
−−1.3 V
−−0.15 mA
−−1mA
7 MHz
65 pF
Switching times in horizontal deflection circuit (see Fig.4) t
s
storage time ICM= 2 A; I
Vdr= 4V
L
=10µH 6.5 −µs
B
=15µH 7.5 −µs
L
B
L
=25µH 9.5 −µs
B
t
f
fall time ICM= 2 A; I
Vdr= 4V
L
=10µH 0.9 −µs
B
=15µH 0.9 −µs
L
B
L
=25µH 0.85 −µs
B
Note
1. Measured with a half-sinewave voltage (curve tracer).
B(end)
B(end)
= 900 mA;
= 900 mA;
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