Philips Semiconductors Product specification
Three quadrant triacs BTA208S series D, E and F
guaranteed commutation
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
Thermal resistance full cycle - - 2.0 K/W
junction to mounting base half cycle - - 2.4 K/W
R
th j-a
Thermal resistance pcb (FR4) mounted; footprint as in Fig.14 - 75 - K/W
junction to ambient
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
BTA208S- ...D ...D ...E ...F
I
GT
Gate trigger current
2
VD = 12 V; IT = 0.1 A
T2+ G+ - 0.8 5 10 25 mA
T2+ G- - 2.0 5 10 25 mA
T2- G- - 3.2 5 10 25 mA
I
L
Latching current VD = 12 V; IGT = 0.1 A
T2+ G+ - 7.2 15 25 30 mA
T2+ G- - 8.2 25 30 40 mA
T2- G- - 11.0 25 30 40 mA
I
H
Holding current VD = 12 V; IGT = 0.1 A - 5.3 15 25 30 mA
...D, E, F
V
T
On-state voltage IT = 10 A - 1.3 1.65 V
V
GT
Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.7 1.5 V
VD = 400 V; IT = 0.1 A; 0.25 0.4 - V
Tj = 125 ˚C
I
D
Off-state leakage current VD = V
DRM(max)
; - 0.1 0.5 mA
Tj = 125 ˚C
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
BTA208S- ...D ...E ...F ...D
dVD/dt Critical rate of rise of VDM = 67% V
DRM(max)
; 20607060 -V/µs
off-state voltage Tj = 110 ˚C; exponential
waveform; gate open
circuit
dI
com
/dt Critical rate of change of VDM = 400 V; Tj = 110 ˚C; 1.8 3.5 5 8.5 - A/ms
commutating current I
T(RMS)
= 8 A;
dV
com
/dt = 20V/µs; gate
open circuit
dI
com
/dt Critical rate of change of VDM = 400 V; Tj = 110 ˚C; 5 16 19 100 - A/ms
commutating current I
T(RMS)
= 8 A;
dV
com
/dt = 0.1V/µs; gate
open circuit
...D, E, F
t
gt
Gate controlled turn-on ITM = 12 A; VD = V
DRM(max)
;- - - 2 - µs
time IG = 0.1 A; dIG/dt = 5 A/µs
2 Device does not trigger in the T2-, G+ quadrant.
February 2000 2 Rev 1.000