Philips BTA208BseriesD,EandF Datasheet
Philips Semiconductors Objective specification
Three quadrant triacs BTA208B series D, E and F
guaranteed commutation
GENERAL DESCRIPTION QUICK REFERENCE DATA
Glass passivated high commutation SYMBOL PARAMETER MAX. MAX. MAX. UNIT
triacsin a plastic envelope suitable for
surface mounting, intended for use in BTA208B- 500D 600D -
motor control circuits or with other BTA208B- 500E 600E 800E
highly inductive loads. These devices BTA208B- 500F 600F 800F
balance the requirements of V
DRM
Repetitive peak off-state 500 600 800 V
commutation performance and gate voltages
sensitivity. The "sensitive gate" E I
T(RMS)
RMS on-state current 8 8 8 A
series and "logic level" D series are I
TSM
Non-repetitive peak on-state 65 65 65 A
intendedforinterfacingwithlowpower current
drivers, including micro controllers.
PINNING - SOT404 PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
1 main terminal 1
2 main terminal 2
3 gate
mb main terminal 2
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
-500 -600 -800
V
DRM
Repetitive peak off-state - 500
1
600
1
800 V
voltages
I
T(RMS)
RMS on-state current full sine wave; - 8 A
Tmb ≤ 102 ˚C
I
TSM
Non-repetitive peak full sine wave;
on-state current Tj = 25 ˚C prior to
surge
t = 20 ms - 65 A
t = 16.7 ms - 71 A
I2tI
2
t for fusing t = 10 ms - 21 A2s
dIT/dt Repetitive rate of rise of ITM = 12 A; IG = 0.2 A; 100 A/µs
on-state current after dIG/dt = 0.2 A/µs
triggering
I
GM
Peak gate current - 2 A
V
GM
Peak gate voltage - 5 V
P
GM
Peak gate power - 5 W
P
G(AV)
Average gate power over any 20 ms - 0.5 W
period
T
stg
Storage temperature -40 150 ˚C
T
j
Operating junction - 125 ˚C
temperature
13
mb
2
T1T2
G
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 6 A/µs.
September 1997 1 Rev 1.000
Philips Semiconductors Objective specification
Three quadrant triacs BTA208B series D, E and F
guaranteed commutation
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
Thermal resistance full cycle - - 2.0 K/W
junction to mounting base half cycle - - 2.4 K/W
R
th j-a
Thermal resistance minimum footprint, FR4 board - 55 - K/W
junction to ambient
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
BTA208B- ...D ...E ...F
I
GT
Gate trigger current
2
VD = 12 V; IT = 0.1 A
T2+ G+ 2 - 5 10 25 mA
T2+ G- 2 - 5 10 25 mA
T2- G- 2 - 5 10 25 mA
I
L
Latching current VD = 12 V;
IGT = 0.1 A
T2+ G+ - - 6 12 30 mA
T2+ G- - - 9 18 45 mA
T2- G- - - 6 12 30 mA
I
H
Holding current VD = 12 V; IGT = 0.1 A - - 6 12 30 mA
V
T
On-state voltage IT = 10 A - 1.3 1.65 1.65 1.65 V
V
GT
Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.7 1.5 V
VD = 400 V; IT = 0.1 A; 0.25 0.4 - V
Tj = 125 ˚C
I
D
Off-state leakage current VD = V
DRM(max)
; - 0.1 0.5 mA
Tj = 125 ˚C
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
BTA208B- ...D ...E ...F
dVD/dt Critical rate of rise of VDM = 67% V
DRM(max)
;102050--V/µs
off-state voltage Tj = 125 ˚C; exponential
waveform; gate open
circuit
dI
com
/dt Critical rate of change of VDM = 400 V; Tj = 125 ˚C; 1.8 2.5 3.5 - - A/ms
commutating current I
T(RMS)
= 8 A;
dV
com
/dt = 20v/µs; gate
open circuit
t
gt
Gate controlled turn-on ITM = 12 A; VD = V
DRM(max)
;---2-µs
time IG = 0.1 A; dIG/dt = 5 A/µs
2 Device does not trigger in the T2-, G+ quadrant.
September 1997 2 Rev 1.000
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