Philips bt152b DATASHEETS
Philips Semiconductors Product specification
Thyristors BT152B series
GENERAL DESCRIPTION QUICK REFERENCE DATA
Glasspassivatedthyristorsinaplastic SYMBOL PARAMETER MAX. MAX. MAX. UNIT
envelope suitable for surface
mounting, intended for use in BT152B- 400R 600R 800R
applications requiring high V
bidirectional blocking voltage V
capability and high thermal cycling I
performance. Typical applications I
include motor control, industrial and I
domestic lighting, heating and static current
switching.
PINNING - SOT404 PIN CONFIGURATION SYMBOL
, Repetitive peak off-state 450 650 800 V
DRM
RRM
T(AV)
T(RMS)
TSM
voltages
Average on-state current 13 13 13 A
RMS on-state current 20 20 20 A
Non-repetitive peak on-state 200 200 200 A
PIN DESCRIPTION
mb
1 cathode
ak
2 anode
3 gate
mb anode
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DRM
I
T(AV)
I
T(RMS)
I
TSM
I2tI
dIT/dt Repetitive rate of rise of ITM = 50 A; IG = 0.2 A; - 200 A/µs
I
GM
V
GM
V
RGM
P
GM
P
G(AV)
T
stg
T
j
Repetitive peak off-state - 4501650
voltages
Average on-state current half sine wave; Tmb ≤ 103 ˚C - 13 A
RMS on-state current all conduction angles - 20 A
Non-repetitive peak half sine wave; Tj = 25 ˚C prior to
on-state current surge
t = 10 ms - 200 A
2
t for fusing t = 10 ms - 200 A2s
t = 8.3 ms - 220 A
on-state current after dIG/dt = 0.2 A/µs
triggering
Peak gate current - 5 A
Peak gate voltage - 5 V
Peak reverse gate voltage - 5 V
Peak gate power - 20 W
Average gate power over any 20 ms period - 0.5 W
Storage temperature -40 150 ˚C
Operating junction - 125 ˚C
temperature
2
13
g
-400R -600R -800R
1
800 V
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may
switch to the on-state. The rate of rise of current should not exceed 15 A/µs.
September 1997 1 Rev 1.100
Philips Semiconductors Product specification
Thyristors BT152B series
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
R
th j-a
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
GT
I
L
I
H
V
T
V
GT
ID, I
R
Thermal resistance - - 1.1 K/W
junction to mounting base
Thermal resistance minimum footprint, FR4 board - 55 - K/W
junction to ambient
Gate trigger current VD = 12 V; IT = 0.1 A - 3 32 mA
Latching current VD = 12 V; IGT = 0.1 A - 25 80 mA
Holding current VD = 12 V; IGT = 0.1 A - 15 60 mA
On-state voltage IT = 40 A - 1.4 1.75 V
Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.6 1.5 V
Off-state leakage current VD = V
VD = V
; IT = 0.1 A; Tj = 125 ˚C 0.25 0.4 - V
DRM(max)
DRM(max)
; VR = V
; Tj = 125 ˚C - 0.2 1.0 mA
RRM(max)
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
dVD/dt Critical rate of rise of VDM = 67% V
off-state voltage exponential waveform gate open circuit
t
gt
t
q
Gate controlled turn-on VD = V
time ITM = 40 A
DRM(max)
Circuit commutated VD = 67% V
turn-off time ITM = 50 A; VR = 25 V; dITM/dt = 30 A/µs;
dVD/dt = 50 V/µs; RGK = 100 Ω
DRM(max)
; Tj = 125 ˚C; 200 300 - V/µs
DRM(max)
; IG = 0.1 A; dIG/dt = 5 A/µs; - 2 - µs
; Tj = 125 ˚C; - 70 - µs
September 1997 2 Rev 1.100
Loading...