Glasspassivated,sensitivegatetriacsSYMBOLPARAMETERMAX. MAX. UNIT
in a plastic envelope suitable for
surface mounting, intended for use inBT134W-500D600D
generalpurposebidirectionalV
switchingandphasecontrolI
applications.Thesedevices areI
intended to be interfaced directly to
DRM
T(RMS)
TSM
microcontrollers,logicintegrated
circuits and other low power gate
trigger circuits.
on-state current afterdIG/dt = 0.2 A/µs
triggeringT2+ G+-50A/µs
I
V
P
P
T
T
GM
GM
GM
G(AV)
stg
j
Peak gate current-2A
Peak gate voltage-5V
Peak gate power-5W
Average gate powerover any 20 ms period-0.5W
Storage temperature-40150˚C
Operating junction-125˚C
temperature
1
T2+ G--50A/µs
T2- G--50A/µs
T2- G+-10A/µs
600
1
T1T2
V
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 3 A/µs.
August 19971Rev 1.200
Philips SemiconductorsProduct specification
TriacsBT134W series D
logic level
THERMAL RESISTANCES
SYMBOL PARAMETERCONDITIONSMIN.TYP.MAX.UNIT
R
th j-sp
R
th j-a
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETERCONDITIONSMIN.TYP.MAX.UNIT
I
GT
I
L
I
H
V
T
V
GT
I
D
Thermal resistancefull or half cycle--15K/W
junction to solder point
Thermal resistancepcb mounted; minimum footprint-156-K/W
junction to ambientpcb mounted; pad area as in fig:14-70-K/W