DISCRETE SEMICONDUCTORS
DATA SH EET
BSP121
N-channel enhancement mode
vertical D-MOS transistor
Product specification
Supersedes data of April 1995
File under Discrete Semiconductors, SC13b
1998 Apr 01
Philips Semiconductors Product specification
N-channel enhancement mode vertical
D-MOS transistor
DESCRIPTION
N-channel enhancement mode
vertical D-MOS transistor in a
miniature SOT223 envelope and
designed for use as a line current
interrupter in telephone sets and for
application in relay, high-speed and
line-transformer drivers.
FEATURES
• Direct interface to C-MOS, TTL,
etc.
• High-speed switching
• No secondary breakdown
QUICK REFERENCE DATA
Drain source voltage V
Gate-source voltage (open drain) ±V
Drain current (DC) I
Total power dissipation up to
T
=25°CP
amb
Drain-source on-resistance
= 400 mA; VGS= 10 V R
I
D
Transfer admittance
= 400 mA; VDS= 25 V Yfs
I
D
PINNING - SOT223
1 = gate
2 = drain
3 = source
4 = drain
DS
GSO
D
tot
DS(on)
BSP121
max. 200 V
max. 20 V
max. 350 mA
max. 1.5 W
typ.
max.
min.
typ.
4.5
6.0ΩΩ
200
350mSmS
PIN CONFIGURATION
Marking code
BSP121
handbook, halfpage
Top view
Fig.1 Simplified outline and symbol.
4
123
MAM054
d
g
s
1998 Apr 01 2
Philips Semiconductors Product specification
N-channel enhancement mode vertical
BSP121
D-MOS transistor
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Drain-source voltage V
Gate-source voltage (open drain) ±V
Drain current (DC) I
Drain current (peak) I
DS
GSO
D
DM
Total power dissipation up to
T
=25°C (note 1) P
amb
Storage temperature range T
Junction temperature T
tot
stg
j
THERMAL RESISTANCE
From junction to ambient (note 1) R
thj-a
Note
1. Device mounted on an epoxy printed-circuit board 40 mm × 40 mm × 1.5 mm; mounting pad for the drain lead
2
min. 6 cm
.
max. 200 V
max. 20 V
max. 350 mA
max. 1.2 A
max. 1.5 W
−65 to + 150 °C
max. 150 °C
= 83.3 K/W
1998 Apr 01 3
Philips Semiconductors Product specification
N-channel enhancement mode vertical
D-MOS transistor
CHARACTERISTICS
=25°C unless otherwise specified
T
j
Drain-source breakdown voltage
ID=10µA; VGS=0 V
Drain-source leakage current
V
= 160 V; VGS=0 I
DS
= 60 V; VGS=0 I
V
DS
Gate-source leakage current
± V
= 20 V; VDS=0 ±I
GS
Gate threshold voltage
= 1 mA; VDS= V
I
D
Drain-source on-resistance
= 400 mA; VGS= 10 V R
I
D
Transfer admittance
= 400 mA; VDS= 25 V Yfs
I
D
GS
(BR)DSS
DSS
DSS
GSS
V
GS(th)
DS(on)
BSP121
min. 200 V
max. 1.0 µA
max. 200 nA
max. 100 nA
min.
max.
typ.
max.
min.
typ.
0.8
2.8VV
4.5
6.0ΩΩ
200
350mSmS
Input capacitance at f = 1 MHz
= 25 V; VGS=0 C
V
DS
Output capacitance at f = 1 MHz
= 25 V; VGS=0 C
V
DS
Feedback capacitance at f = 1 MHz
= 25 V; VGS=0 C
V
DS
Switching times (see Figs 2 and 3)
= 250 mA; VDD= 50 V; VGS= 0 to 10 V t
I
D
iss
oss
rss
on
t
off
typ.
max.
typ.
max.
typ.
max.
typ.
max.
typ.
max.
4560pF
pF
1525pF
pF
3.510pF
pF
510pF
pF
1520ns
ns
1998 Apr 01 4