Philips BSP121 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BSP121
N-channel enhancement mode vertical D-MOS transistor
Product specification Supersedes data of April 1995 File under Discrete Semiconductors, SC13b
1998 Apr 01
Philips Semiconductors Product specification
N-channel enhancement mode vertical D-MOS transistor

DESCRIPTION

N-channel enhancement mode vertical D-MOS transistor in a miniature SOT223 envelope and designed for use as a line current interrupter in telephone sets and for application in relay, high-speed and line-transformer drivers.

FEATURES

Direct interface to C-MOS, TTL, etc.
High-speed switching
No secondary breakdown

QUICK REFERENCE DATA

Drain source voltage V Gate-source voltage (open drain) ±V Drain current (DC) I Total power dissipation up to
T
=25°CP
amb
Drain-source on-resistance
= 400 mA; VGS= 10 V R
I
D
Transfer admittance
= 400 mA; VDS= 25 V Yfs
I
D

PINNING - SOT223

1 = gate 2 = drain 3 = source 4 = drain
DS
GSO
D
tot
DS(on)
BSP121
max. 200 V max. 20 V max. 350 mA
max. 1.5 W
typ. max.
min. typ.
4.5
6.0ΩΩ
200 350mSmS

PIN CONFIGURATION

Marking code

BSP121
handbook, halfpage
Top view
Fig.1 Simplified outline and symbol.
4
123
MAM054
d
g
s
1998 Apr 01 2
Philips Semiconductors Product specification
N-channel enhancement mode vertical
BSP121
D-MOS transistor

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Drain-source voltage V Gate-source voltage (open drain) ±V Drain current (DC) I Drain current (peak) I
DS
GSO D DM
Total power dissipation up to
T
=25°C (note 1) P
amb
Storage temperature range T Junction temperature T
tot stg j

THERMAL RESISTANCE

From junction to ambient (note 1) R
thj-a
Note
1. Device mounted on an epoxy printed-circuit board 40 mm × 40 mm × 1.5 mm; mounting pad for the drain lead
2
min. 6 cm
.
max. 200 V max. 20 V max. 350 mA max. 1.2 A
max. 1.5 W
65 to + 150 °C
max. 150 °C
= 83.3 K/W
1998 Apr 01 3
Philips Semiconductors Product specification
N-channel enhancement mode vertical D-MOS transistor

CHARACTERISTICS

=25°C unless otherwise specified
T
j
Drain-source breakdown voltage
ID=10µA; VGS=0 V
Drain-source leakage current
V
= 160 V; VGS=0 I
DS
= 60 V; VGS=0 I
V
DS
Gate-source leakage current
± V
= 20 V; VDS=0 ±I
GS
Gate threshold voltage
= 1 mA; VDS= V
I
D
Drain-source on-resistance
= 400 mA; VGS= 10 V R
I
D
Transfer admittance
= 400 mA; VDS= 25 V Yfs
I
D
GS
(BR)DSS
DSS DSS
GSS
V
GS(th)
DS(on)
BSP121
min. 200 V
max. 1.0 µA max. 200 nA
max. 100 nA
min. max.
typ. max.
min. typ.
0.8
2.8VV
4.5
6.0ΩΩ
200 350mSmS
Input capacitance at f = 1 MHz
= 25 V; VGS=0 C
V
DS
Output capacitance at f = 1 MHz
= 25 V; VGS=0 C
V
DS
Feedback capacitance at f = 1 MHz
= 25 V; VGS=0 C
V
DS
Switching times (see Figs 2 and 3)
= 250 mA; VDD= 50 V; VGS= 0 to 10 V t
I
D
iss
oss
rss
on
t
off
typ. max.
typ. max.
typ. max.
typ. max.
typ. max.
4560pF
pF
1525pF
pF
3.510pF pF
510pF
pF
1520ns
ns
1998 Apr 01 4
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