DISCRETE SEMICONDUCTORS
DATA SH EET
BSP120
N-channel enhancement mode
vertical D-MOS transistor
Product specification
File under Discrete Semiconductors, SC13b
April 1995
Philips Semiconductors Product specification
N-channel enhancement mode vertical
D-MOS transistor
DESCRIPTION
N-channel enhancement mode
vertical D-MOS transistor in a
miniature SOT223 envelope and
designed for use as a line current
interrupter in telephone sets and for
application in relay, high-speed and
line-transformer drivers.
FEATURES
• Direct interface to C-MOS, TTL,
etc.
• High-speed switching
• No secondary breakdown
QUICK REFERENCE DATA
Drain-source voltage V
Drain-current (DC) I
Drain-source ON-resistance
ID= 250 mA; VGS= 10 V R
Gate threshold voltage V
PINNING - SOT223
1 = gate
2 = drain
3 = source
4 = drain
Marking code
BSP120
DS
D
DS(on)
GS(th)
BSP120
max. 200 V
max. 250 mA
typ.
max.
max. 2.8 V
712Ω
Ω
PIN CONFIGURATION
handbook, halfpage
Top view
Fig.1 Simplified outline and symbol.
4
123
MAM054
d
g
s
April 1995 2
Philips Semiconductors Product specification
N-channel enhancement mode vertical
BSP120
D-MOS transistor
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Drain-source voltage V
Gate-source voltage (open drain) ±V
Drain current (DC) I
Drain current (peak) I
Total power dissipation up to T
=25°C (note 1) P
amb
Storage temperature range T
Junction temperature T
DS
GSO
D
DM
tot
stg
j
THERMAL RESISTANCE
From junction to ambient (note 1) R
th j-a
Note
1. Device mounted on an epoxy printed-circuit board 40 mm × 40 mm × 1.5 mm; mounting pad for the drain lead
min. 6 cm
2
.
max. 200 V
max. 20 V
max. 250 mA
max. 800 mA
max. 1.5 W
−65 to + 150 °C
max. 150 °C
= 83.3 K/W
CHARACTERISTICS
=25°C unless otherwise specified
T
j
Drain-source breakdown voltage
I
=10µA; VGS=0 V
D
Drain-source leakage current
VDS=160 V; VGS=0 I
Gate-source leakage current
V
= 20 V; VDS=0 I
GS
Drain-source ON-resistance (see Fig.4)
ID= 250 mA; VGS= 10 V R
Gate threshold voltage
= 1 mA; VGS=V
I
D
DS
Transfer admittance
= 250 mA; VDS= 15 V Yfs
I
D
Input capacitance at f = 1 MHz;
= 10 V; VGS=0 C
V
DS
(BR)DSS
DSS
GSS
DS(on)
V
GS(th)
iss
min. 200 V
max. 1.0 µA
max. 100 nA
typ.
max.
min.
max.
min.
typ.
typ.
max.
712Ω
Ω
0.8
2.8VV
125
250mSmS
4565pF
pF
Output capacitance at f = 1 MHz;
= 10 V; VGS=0 C
V
DS
April 1995 3
oss
typ.
max.
2030pF
pF
Philips Semiconductors Product specification
N-channel enhancement mode vertical
D-MOS transistor
Feedback capacitance at f = 1 MHz;
= 10 V; VGS= 0 C
V
DS
Switching times (see Figs 2 and 3)
I
= 250 mA; VDD= 50 V;
D
VGS= 0 to 10 V t
handbook, halfpage
10 V
0 V
50 Ω
VDD = 50 V
I
D
MBB691
rss
on
t
off
handbook, halfpage
INPUT
OUTPUT
typ.
max.
typ.
max.
typ.
max.
10 %
t
on
90 %
510pF
36ns
1520ns
90 %
BSP120
pF
ns
ns
t
off
10 %
MBB692
3
10
handbook, halfpage
I
D
(mA)
2
10
10
Fig.2 Switching time test circuit.
VGS = 10 V
5 V
4 V
81012
R
DSon
Fig.4 Tj=25°C; typical values.
MDA738
(Ω)
Fig.3 Input and output waveforms.
8
VGS (V)
MDA739
handbook, halfpage
144 6
1
I
D
(A)
0.8
0.6
0.4
0.2
0
010
246
Fig.5 Tj=25°C; VDS= 10 V; typical values.
April 1995 4