N-channel enhancement mode field-effect transistor in a plastic package using
TrenchMOS™ technology.
Product availability:
BSH111 in SOT23.
■ TrenchMOS™ technology
■ Very fast switching
■ Low threshold voltage
■ Subminiature surface mount package.
3.Applications
■ Battery management
■ High speed switch
■ Logic level translator.
4.Pinning information
Table 1:Pinning - SOT23, simplified outline and symbol
PinDescriptionSimplified outlineSymbol
1gate (g)
2source (s)
3drain (d)
12
Top view
3
MSB003
SOT23
g
MBB076
d
s
Philips Semiconductors
BSH111
N-channel enhancement mode field-effect transistor
5.Quick reference data
Table 2:Quick reference data
Symbol ParameterConditionsTypMaxUnit
V
I
D
P
T
R
DS
tot
j
DSon
drain-source voltage (DC)25 °C ≤ Tj≤ 150 °C-55V
drain current (DC)Tsp=25°C; VGS= 4.5 V-335mA
total power dissipationTsp=25°C-0.83W
junction temperature-150°C
drain-source on-state resistanceVGS= 4.5 V; ID= 500 mA2.34.0Ω
= 2.5 V; ID= 75 mA2.45.0Ω
V
GS
= 1.8 V; ID= 75 mA3.18.0Ω
V
GS
6.Limiting values
Table 3:Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol ParameterConditionsMinMaxUnit
V
DS
V
DGR
V
GS
I
D
I
DM
P
tot
T
stg
T
j
Source-drain diode
I
S
I
SM
drain-source voltage (DC)25 °C ≤ Tj≤ 150 °C-55V
drain-gate voltage (DC)25 °C ≤ Tj≤ 150 °C; RGS=20kΩ-55V
gate-source voltage-±10V
drain current (DC)Tsp=25°C; VGS= 4.5 V;
-335mA
Figure 2 and 3
T
= 100 °C; VGS= 4.5 V; Figure 2-212mA
sp
peak drain currentTsp=25°C; pulsed; tp≤ 10 µs;
-1.3A
Figure 3
total power dissipationTsp=25°C; Figure 1-0.83W
storage temperature−65+150°C
junction temperature−65+150°C
Objective dataDevelopmentThis data sheetcontains datafrom the objective specification forproduct development. Philips Semiconductors
Preliminary dataQualificationThis data sheet contains data from the preliminary specification. Supplementary data will be published at a
Product dataProductionThis data sheet contains data from the product specification. Philips Semiconductors reserves the right to
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[1]
Product status
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
[2]
Definition
reserves the right to change the specification in any manner without notice.
later date. Philips Semiconductors reserves the right to change the specification without notice, in order to
improve the design and supply the best possible product.
make changes at any time in order to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change Notification (CPCN) procedure
SNW-SQ-650A.
13. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warrantiesthat these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Trademarks
TrenchMOS —is a trademark of Koninklijke Philips Electronics N.V.
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.Fax: +31 40 27 24825
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 26 April 2002Document order number: 9397 750 09629
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