Philips BLV97CE Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLV97CE
UHF power transistor
Product specification
March 1993
Philips Semiconductors Product specification

FEATURES

Internal input matching to achieve high power gain
Ballasting resistors for an optimum temperature profile
Gold metallization ensures excellent reliability

DESCRIPTION

NPN silicon planar epitaxial transistor in a SOT171 envelope, intended for common emitter, class-AB operation in radio transmitters for the 960 MHz communications band. The transistor has a 6-lead flange envelope, with a ceramic cap. All leads are isolated from the flange.

QUICK REFERENCE DATA

RF performance up to T
MODE OF OPERATION f (MHz) V
=25°C in a common emitter class-AB circuit.
h
(V) PL(W) GP(dB) ηc(%)
CE
c.w. class-AB 960 24 35 > 7 > 50

PINNING - SOT171A

PIN SYMBOL DESCRIPTION
handbook, halfpage
6
1 e emitter 2 e emitter
b
3 b base 4 c collector
Top view
12345
MAM141
5 e emitter 6 e emitter
Fig.1 Simplified outline and symbol.
c
e
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
March 1993 2
Philips Semiconductors Product specification

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
P
tot
T
stg
T
j

THERMAL RESISTANCE

collector base voltage open emitter 50 V collector emitter voltage open base 27 V emitter base voltage open collector 3.5 V collector current DC or average 3A collector current peak value
9A
f > 1 MHz
total power dissipation f > 1 MHz
70 W
Tmb=25°C storage temperature 65 150 °C operating junction temperature 200 °C
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
thj-mb
R
th mb-h
10
handbook, halfpage
I
C
(A)
1
1
10
from junction to mounting base (RF) 2.3 K/W from mounting base to heatsink 0.4 K/W
MDA441
Tmb = 25 °C
Th = 70 °C
110
V
(V)
CE
2
10
100
handbook, halfpage
P
tot
(W)
80
60
40
20
0
0
II
I
40 80
120
MDA442
Th (°C)
160
Fig.2 DC SOAR.
March 1993 3
Fig.3 Power/temperature derating;
I: DC or RF operation; II: short-term operation during mismatch.
Philips Semiconductors Product specification

CHARACTERISTICS

at T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CES
h
FE
C
c
C
re
C
cf
collector-base breakdown voltage open emitter
IC= 50 mA
collector-emitter breakdown voltage open base
IC= 100 mA
emitter-base breakdown voltage open collector
IE= 10 mA
collector leakage current VBE=0
VCE=27V
DC current gain IC=2 A
VCE= 20 V
collector capacitance at f = 1 MHz IE=Ie=0
VCB= 25 V
feedback capacitance at f = 1 MHz IC=0
VCE= 25 V
collector-flange capacitance 2 pF
50 −−V
27 −−V
3.5 −−V
−−10 mA
15 −−
44 pF
30 pF
100
handbook, halfpage
h
FE
V
CE
80
60
40
20
0
024
= 25 V
20 V
MDA443
6
IC (A)
Fig.4 DC current gain as a function of collector
current; typical values.
100
handbook, halfpage
C
c
(pF)
80
60
40
20
8
0
010
20 30
MDA444
V
(V)
CB
Fig.5 Output capacitance as a function of
collector-base voltage; typical values.
March 1993 4
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