Philips blv91 sl DATASHEETS

DISCRETE SEMICONDUCTORS
DATA SH EET
BLV91/SL
UHF power transistor
Product specification
September 1988
Philips Semiconductors Product specification

DESCRIPTION

NPN silicon planar epitaxial transistor designed for use in mobile radio transmitters in the 900 MHz band.

QUICK REFERENCE DATA

RF performance in a common-emitter class-B circuit
MODE OF OPERATION
narrow band; CW T
T
°C
= 25 12.5 900 2 > 6.5 > 50
mb
(1)
=25
T
a a
=25
(1)
T
V
CE
V
12.5 900 1.5 > 6.5 > 50
9.6 900 1.5 typ. 6.6 typ. 60
Note
1. Device mounted on a printed-circuit board (see Fig.6).

FEATURES

diffused emitter-ballasting resistors for an optimum temperature profile.
gold metallization ensures excellent reliability.
the device can be applied at rated load power, without
an external heatsink, when it is mounted on a printed-circuit board (see Fig.6).
The transistor has a 4-lead envelope with a ceramic cap (SOT-172D). All leads are isolated from the mounting base.
f
MHz
P
W
L
G
p
dB
η
C
%

PIN CONFIGURATION

PINNING - SOT172D.

PIN DESCRIPTION
1 emitter
handbook, halfpage
1
2 base 3 collector 4 emitter
2
4
Top view
3
MSB007
Fig.1 Simplified outline. SOT172D.
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely safe provided that the BeO disc is not damaged.
September 1988 2
Philips Semiconductors Product specification

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-base voltage (open emitter) V Collector-emitter voltage (open base) V Emitter-base voltage (open collector) V
CBO CEO EBO
Collector current
DC or average I (peak value); f > 1 MHz I
C CM
; I
C(AV)
Total power dissipation
f > 1 MHz; Tmb≤ 90 °CP Storage temperature T Operating junction temperature T
tot(RF) stg j
max. 36 V max. 16 V max. 3 V
max. 0.4 A max. 1.2 A
max. 6 W
65 to + 150 °C
max. 200 °C
120
MDA398
Tmb (°C)
160
10
handbook, halfpage
P
tot(rf)
(W)
8
6
4
2
0
0
I Continuous RF operation (f > 1 MHz) II Short-time RF operation during mismatch (f > 1 MHz)
II
I
40 80
Fig.2 Power/temperature curve.

THERMAL RESISTANCE

Dissipation = 4.5 W
(1)
From junction to ambient
=25°CR
T
a
(f > 1 MHz)
th j-a (RF)
max. 55 K/W
From junction to mounting base
Tmb=25°C (f > 1 MHz) R
th j-mb (RF)
max. 15 K/W
Note
1. Device mounted on a printed-circuit board (see Fig.6).
September 1988 3
Philips Semiconductors Product specification

CHARACTERISTICS

T
=25°C unless otherwise specified
j
Collector-base breakdown voltage
open emitter; I Collector-emitter breakdown voltage
open base; IC= 10 mA V Emitter-base breakdown voltage
open collector; IE= 0.5 mA V Collector cut-off current
VBE= 0; VCE=16V I Second breakdown energy
L = 25 mH; f = 50 Hz; R D.C. current gain
I
= 0.3 A; VCE=10V h
C
Collector capacitance at f = 1 MHz
I
= ie=0;VCB= 12.5 V C
E
Feedback capacitance at f = 1 MHz
I
= 0; VCE= 12.5 V C
C
Collector-mounting base capacitance C
= 5 mA V
C
=10 E
BE
(BR)CBO
(BR)CEO
(BR)EBO
CES
SBR
FE
C
re c-mb
> 36 V
> 16 V
> 3V
< 2.5 mA
> 0.55 mJ
> 25
typ. 3.5 pF
typ. 2.0 pF typ. 0.5 pF
120
handbook, halfpage
h
FE
80
40
0
0
0.3
0.6 1.20.9
MDA399
V
CE
12.5 V
10 V
IC (A)
=
Fig.3 Tj=25°C; typical values.
September 1988 4
handbook, halfpage
8
C
c
(pF)
6
4
2
0
08
Fig.4 IE=ie= 0; f = 1 MHz; typical values.
MDA400
16 24
VCB (V)
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